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1. 发明公开

EP3112086A2 METHOD OF POLISHING BACK SURFACE OF SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：抛光基板背面的方法和基板处理装置
公开(公告)号：EP3112086A2
公开(公告)日：2017-01-04
申请号：EP16181386.0
申请日：2014-01-29
申请人： EBARA CORPORATION
发明人： ISHII, Yu , ITO, Kenya , NAKANISHI, Masayuki , TOGAWA, Tetsuji
IPC分类号： B24B37/04 , B24B37/30 , B24B7/22 , B24B21/00
CPC分类号： B24B7/228 , B24B21/004 , B24B21/06 , B24B37/04 , B24B37/042 , B24B37/30
摘要： A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.
摘要翻译：提供一种能够以高去除率从基板的整个背面去除异物的研磨方法。抛光方法包括：在保持基板的背面的中心侧区域的同时，将抛光工具与基板的背面的外周区域滑动接触，并且将抛光工具放置成与中心区域滑动接触; 同时保持基板的斜面部分以整体抛光背面。

2. 发明公开

EP2199018A1 POLISHING DEVICE 审中-公开
标题翻译：抛光装置
公开(公告)号：EP2199018A1
公开(公告)日：2010-06-23
申请号：EP08791844.7
申请日：2008-07-23
申请人： Ebara Corporation
发明人： KIMURA, Norio , ITO, Kenya , TAKAHASHI, Tamami , SEKI, Masaya
IPC分类号： B24B21/18 , B24B9/00 , B24B21/00
CPC分类号： B24B9/065
摘要： A polishing apparatus according to the present invention is a polishing apparatus for polishing a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate (W) by bringing a polishing tool (41) into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder (20) configured to hold the substrate (W); and a polishing head (42) configured to polish the periphery of the substrate (W) held by the substrate holder (20) using the polishing tool (41). The polishing head (42) includes a press pad (50) for pressing the polishing tool (41) against the periphery of the substrate (W), and a linear motor (90) configured to reciprocate the press pad (50).
摘要翻译：本发明的研磨装置是一种研磨装置，其通过使研磨用具（41）与研磨用具（41）滑动接触来研磨基板（W）的周边部（斜面部，切口部，切边部）衬底的外围。该研磨装置具有：保持基板（W）的基板支架（20）; 以及研磨头（42），其使用研磨用具（41）研磨由基板保持件（20）保持的基板（W）的周边。研磨头42具有将研磨用具41按压在基板W的周围的加压垫50和使加压垫50往复移动的线性电动机90。

3. 发明公开

EP2172304A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光设备
公开(公告)号：EP2172304A1
公开(公告)日：2010-04-07
申请号：EP08778124.1
申请日：2008-07-08
申请人： EBARA CORPORATION
发明人： TAKAHASHI, Tamami , ITO, Kenya , KUSA, Hiroaki , SEKI, Masaya
IPC分类号： B24B21/08 , B24B9/00 , B24B21/16 , H01L21/304
CPC分类号： B24B21/002 , B24B9/065 , H01L21/02021
摘要： A polishing apparatus according to the present invention includes a polishing tape (41) having a polishing surface, a substrate holder configured to hold and rotate a substrate (W), a press pad (50) configured to press the polishing tape against a bevel portion of the substrate held by the substrate holder, and a polishing-tape feeding mechanism (45) configured to cause the polishing tape to travel in its longitudinal direction. The press pad (50) includes a pad body (53), a plate-shaped pressing section having a pressing surface (51a) for pressing the bevel portion of the substrate through the polishing tape and having a rear surface (51b) opposite to the pressing surface, and a plurality of coupling sections (52) coupling the pressing section to the pad body. A space (S) is formed between the rear surface of the pressing section and the pad body.
摘要翻译：本发明的研磨装置具备：具有研磨面的研磨带（41）;保持基板（W）并使其旋转的基板保持具;按压垫（50），将该研磨带按压于倾斜部由所述基板保持件保持的所述基板的保持部，以及使所述研磨带沿所述长度方向行进的研磨带进给机构（45）。压垫（50）包括：垫主体（53）;板状的按压部分，具有用于通过研磨带按压基板的斜面部分的按压表面（51a），并且具有与该基板的背面（51b）相对的背面压紧表面，以及将压紧部分连接到垫体的多个连接部分（52）。在按压部分的后表面和垫体之间形成空间（S）。

4. 发明公开

EP4195243A1 TAPE AFFIXING SYSTEM, TAPE AFFIXING METHOD, TAPE REMOVING SYSTEM, AND TAPE REMOVING METHOD 审中-实审转让
公开(公告)号：EP4195243A1
公开(公告)日：2023-06-14
申请号：EP21853980.7
申请日：2021-08-04
申请人： Ebara Corporation , IS Engineering Co., Ltd.
发明人： ITO, Kenya , YAMADA, Takumi , SHIBUYA, Mahito , NAGUMO, Daisuke
IPC分类号： H01L21/677 , H01L21/683
摘要： The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.

5. 发明公开

EP3112086A3 METHOD OF POLISHING BACK SURFACE OF SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译： VERFAHREN ZUM POLIEREN DERRÜCKSEITEEINES SUBSTRAT UND SUBSTRATVERARBEITUNGSVORRICHTUNG
公开(公告)号：EP3112086A3
公开(公告)日：2017-01-18
申请号：EP16181386.0
申请日：2014-01-29
申请人： EBARA CORPORATION
发明人： ISHII, Yu , ITO, Kenya , NAKANISHI, Masayuki , TOGAWA, Tetsuji
IPC分类号： B24B37/04 , B24B37/30 , B24B7/22 , B24B21/00
CPC分类号： B24B7/228 , B24B21/004 , B24B21/06 , B24B37/04 , B24B37/042 , B24B37/30
摘要： A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.
摘要翻译：提供了能够以高去除速度从基板的整个背面除去异物的研磨方法。抛光方法包括：在保持基板的背面的中心侧区域的同时，将抛光工具与基板的背面的外周区域滑动接触，并且将抛光工具与中心部分滑动接触，同时保持基板的斜面部分以整体地抛光背面。

6. 发明授权

EP1872392B1 SUBSTRATE PROCESSING APPARATUS 有权
标题翻译：基板处理装置
公开(公告)号：EP1872392B1
公开(公告)日：2012-02-22
申请号：EP06732248.7
申请日：2006-04-18
申请人： EBARA CORPORATION
发明人： TAKAHASHI, Tamami , SHIRAKASHI, Mitsuhiko , ITO, Kenya , INOUE, Kazuyuki , YAMAGUCHI, Kenji , SEKI, Masaya
IPC分类号： H01L21/00 , H01L21/687 , B24B49/00 , B24B9/00
CPC分类号： H01L21/67219 , B24B9/065 , B24B49/04 , H01L21/302 , H01L21/461 , H01L21/67253 , H01L21/68707 , H01L21/68728
摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
摘要翻译：基板处理装置（1）包括用于研磨基板（W）的周边部分的第一和第二研磨单元（70A，70B），用于清洁基板（W）的第一清洁单元（100），第二清洁和干燥用于干燥在第一清洁单元（100）中清洁过的基板（W）的单元（110）以及用于测量基板（W）的周边部分的测量单元（30）。测量单元（30）包括用于在第一和第二抛光单元（70A和70B）中进行抛光所需的测量机构，例如直径测量机构，截面形状测量机构或表面状态测量机构。

7. 发明授权

EP2075088B1 POLISHING APPARATUS, POLISHING METHOD, AND TREATING APPARATUS 有权
标题翻译：清洁设备和清洁方法和处置器械
公开(公告)号：EP2075088B1
公开(公告)日：2014-05-07
申请号：EP07829379.2
申请日：2007-10-02
申请人： EBARA CORPORATION
发明人： TAKAHASHI, Tamami , ITO, Kenya , SEKI, Masaya , KUSA, Hiroaki
IPC分类号： B24B21/20 , B24B21/18 , H01L21/304
CPC分类号： B24B21/20 , B24B21/004 , B24B21/04

8. 发明授权

EP1719161B1 POLISHING APPARATUS 有权
标题翻译：磨光装置
公开(公告)号：EP1719161B1
公开(公告)日：2014-05-07
申请号：EP05719731.1
申请日：2005-02-23
申请人： EBARA CORPORATION
发明人： HONGO, Akihisa , ITO, Kenya , YAMAGUCHI, Kenji , NAKANISHI, Masayuki
IPC分类号： H01L21/304 , B24B37/02 , B24B9/06 , B24B21/00
CPC分类号： B24B37/02 , B24B9/065 , B24B21/002

9. 发明公开

EP2075088A1 POLISHING APPARATUS, POLISHING METHOD, AND TREATING APPARATUS 有权
标题翻译： REINIGUNGSVORRICHTUNG，REINIGUNGSVERFAHREN UND BEHANDLUNGSVORRICHTUNG
公开(公告)号：EP2075088A1
公开(公告)日：2009-07-01
申请号：EP07829379.2
申请日：2007-10-02
申请人： EBARA CORPORATION
发明人： TAKAHASHI, Tamami , ITO, Kenya , SEKI, Masaya , KUSA, Hiroaki
IPC分类号： B24B21/20 , B24B21/18 , H01L21/304
CPC分类号： B24B21/20 , B24B21/004 , B24B21/04
摘要： The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).
摘要翻译：本发明提供一种抛光装置和抛光方法，其能够计算研磨带供给卷轴和抛光带回收卷轴上的研磨带的辊的外径，并且能够计算研磨带的剩余量和消耗的研磨带的外径。该抛光装置包括研磨带供给卷轴（46），研磨头（44），研磨带引出机构G1和被配置为回收研磨带的研磨带供给和恢复机构（45）（43）从研磨带供给卷轴（46）经由研磨头（44）。抛光带供给和恢复机构（45）包括电动机Mb，该电动机Mb适于向抛光带供给卷轴（46）施加转矩，以便在穿过抛光头（3）的抛光带（43）上施加预定的张力 44）和适于检测研磨带供带盘（46）的旋转角度的旋转角度检测器REa。

10. 发明公开

EP1436832A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基片处理设备
公开(公告)号：EP1436832A1
公开(公告)日：2004-07-14
申请号：EP02801560.0
申请日：2002-10-15
申请人： EBARA CORPORATION
发明人： ITO, Kenya , KAMEZAWA, Masayuki , INOUE, Yuki , KIHARA, Sachiko
IPC分类号： H01L21/306 , H01L21/304
CPC分类号： H01L21/32133 , H01L21/6708
摘要： A substrate processing apparatus processes a substrate such as a semiconductor wafer by supplying a processing liquid. The substrate processing apparatus includes a substrate holder (1) for holding and rotating a substrate (W), a lower surface processing unit (2) for processing a lower surface of the substrate (W) by supplying a processing liquid to the lower surface of the substrate (W), and an outer circumferential edge processing unit (3) for processing an outer circumferential edge of the substrate (W) by supplying the processing liquid to the outer circumferential edge of the substrate (W). The substrate processing apparatus further includes a gas supply unit (5) for supplying a gas to an upper surface of the substrate (W).

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