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1. 发明公开

EP1220390A1 Low cost optical bench having high thermal conductivity 审中-公开
标题翻译： Preiswerte optische Bank mit hoher thermischerKonduktivität
公开(公告)号：EP1220390A1
公开(公告)日：2002-07-03
申请号：EP00128596.4
申请日：2000-12-28
申请人： Corning O.T.I. S.p.A.
发明人： Shaw, Mark Andrew
IPC分类号： H01S5/022 , H01S5/024 , G02B6/42
CPC分类号： H01S5/02216 , G02B6/4201 , G02B6/4202 , G02B6/4237 , H01S5/02248 , H01S5/02415 , H01S5/02476
摘要： The invention relates with an optical bench for optoelectronic packages comprising a rigid insulating substrate, the substrate having a top surface along which it is defined an optical axis, the substrate comprising: a device region for mounting at least an optoelectronic device in alignment with the optical axis, and a fixing region adjacent to the device region for affixing at least an optical component in alignment with the optical axis. The substrate further comprises a third region provided with metallised tracks, the third region extending over the substrate top surface along at least part of one side of the fixing region in a direction substantially parallel to the optical axis.
The invention also relates with an optical bench comprising: a single baseplate having a device region and a fixing region; a welding platform mounted directly on said fixing region; a heat sink mounted directly on said device region; and an optoelectronic device directly mounted on said heat sink.
摘要翻译：本发明涉及一种用于光电子封装的光学台，其包括刚性绝缘基板，该基板具有沿其定义的光轴的顶表面，该基板包括：用于安装至少一个与该光学元件对准的光电子器件的器件区域以及与装置区域相邻的固定区域，用于至少固定与光轴对准的光学部件。衬底还包括设置有金属化轨道的第三区域，第三区域沿着基本上平行于光轴的方向沿固定区域的一侧的至少一部分在衬底顶表面上延伸。本发明还涉及一种光学工作台，包括：具有装置区域和固定区域的单个基板; 直接安装在所述固定区上的焊接平台; 直接安装在所述装置区域上的散热片; 以及直接安装在所述散热器上的光电器件。

2. 发明公开

EP1271209A1 Optical bench for an opto-electronic device 审中-公开
标题翻译： Optische Bankfüropto-elektronische Vorrichtung
公开(公告)号：EP1271209A1
公开(公告)日：2003-01-02
申请号：EP01114842.6
申请日：2001-06-28
申请人： Corning O.T.I. S.p.A.
发明人： Galeotti, Roberto , Shaw, Mark Andrew , Coppo, Giacomo
IPC分类号： G02B6/42
CPC分类号： G02B6/4237 , G02B6/4225 , G02B6/4238 , G02B6/424 , G02B6/4248 , G02B6/4257 , G02B6/4265 , G02B6/4267 , G02B6/4271
摘要： The invention relates to an optical assembly for opto-electronic packages comprising an optical fibre secured on the underside of an elongated support member in optical alignment with an opto-electronic device, wherein said support member is affixed to an aligning member, which in turn is affixed, e.g., by laser welding, to a welding platform. In a preferred embodiment, the elongated support member is a planar parallelepiped. In a further preferred embodiment, the elongated support member is a parallelepiped with an axially extended slot, in which the optical fibre is secured with its longitudinal axis substantially parallel to the axially extended slot.
摘要翻译：本发明涉及一种用于光电子封装的光学组件，其包括固定在细长支撑构件的下侧上的光学纤维，其与光电装置光学对准，其中所述支撑构件固定在对准构件上，例如通过激光焊接固定在焊接平台上。在优选实施例中，细长的支撑构件是平行六面体平面的。在另一优选实施例中，细长支撑构件是平行六面体具有轴向延伸的槽，其中光纤被固定，其纵向轴线基本上平行于轴向延伸的槽。

3. 发明公开

EP1220391A1 Package with thermoelectric cooler 审中-公开
标题翻译：包装热电
公开(公告)号：EP1220391A1
公开(公告)日：2002-07-03
申请号：EP00128600.4
申请日：2000-12-28
申请人： Corning O.T.I. S.p.A.
发明人： Shaw, Mark Andrew
IPC分类号： H01S5/022 , H01L23/02
CPC分类号： H01S5/02216 , H01L23/38 , H01L2924/0002 , H01L2924/09701 , H01L2924/19107 , H01S5/02272 , H01S5/02415 , H01L2924/00
摘要： The invention relates to a method for electrically connecting a thermoelectric cooler within a package to external terminal pins through at least a connecting lead, said method comprising the steps of:

(a) providing at least a metallised pad at a surface of the thermoelectric cooler;
(b) bonding one end of said connecting lead to the said metallised pad of the thermoelectric cooler;
(c) bonding the other end of said connecting lead to the external terminal pins,
wherein bonding of step (c) uses the parallel gap welding technique. Connecting leads can be either ribbons or wires.
摘要翻译：本发明涉及一种用于通过至少一个连接引线将封装内的热电冷却器电连接到外部端子引脚的方法，所述方法包括以下步骤：（a）在热电冷却器的表面处提供至少一个金属化焊盘; （b）将所述连接引线的一端接合到所述热电冷却器的所述金属化焊盘; （c）将所述连接引线的另一端接合到外部端子引脚，其中步骤（c）的结合使用平行间隙焊接技术。连接导线可以是丝带或导线。

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