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    • 1. 发明公开
    • LIGHT-EMITTING DIODE
    • 发光二极管
    • EP1119058A1
    • 2001-07-25
    • EP00948262.1
    • 2000-07-27
    • Citizen Electronics Co., Ltd.
    • FUKASAWA, KoichiMIYASHITA, JunjiTSUCHIYA, Kousuke
    • H01L33/00
    • H01L33/486H01L33/507H01L33/508H01L33/54H01L33/58H01L2224/48091H01L2224/48227H01L2224/49107H01L2224/73265H05K1/182H01L2924/00014
    • A light emitting diode 21 in which a through hole 25 is provided in a glass epoxy substrate 22 which extends from the upper surface 26a to the lower surface 26b thereof, a transparent resin section 27 is used to fill the through hole 25, a light emitting diode element 29 made of a gallium nitride based compound semiconductor with a transparent element substrate of sapphire glass 30 is fixed on top of the transparent resin section 27 using a transparent adhesive 37, and light blocking electrodes 33, 34 are provided on the upper surface of the light emitting diode element 29, and light emitted from the light emitting diode element 29 passes through the transparent resin section 27 and is guided out through a bottom surface 26b of the glass epoxy substrate 22. When the light emitting diode 21 is mounted onto a motherboard 41, by dropping the resin sealing body 38 of the light emitting diode 21 down into an insertion hole 42 formed in the motherboard 41, the height dimension of the mounted light emitting diode 21 mounted can be reduced.
    • 在从上表面26a延伸到下表面26b的玻璃环氧树脂基板22中设置有通孔25的发光二极管21,透明树脂部27用于填充通孔25,发光二极管 使用透明粘合剂37将由具有蓝宝石玻璃30的透明元件衬底30的氮化镓基化合物半导体制成的二极管元件29固定在透明树脂部分27的顶部上,并且将遮光电极33,34设置在透明树脂部分27的上表面 发光二极管元件29和从发光二极管元件29发射的光穿过透明树脂部分27并且通过玻璃环氧基板22的底表面26b被引出。当发光二极管21被安装到 通过使发光二极管21的树脂密封体38下降到形成在主板41中的插入孔42中,安装的高度尺寸 可以减少安装的发光二极管21。