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    • 1. 发明授权
    • PIXELATED IMAGER WITH MOTFT AND PROCESS
    • 具有MOTFT和PROCESS的像素化成像器
    • EP2932534B1
    • 2017-08-30
    • EP13863613.9
    • 2013-12-09
    • CBrite Inc.
    • SHIEH, Chan-longYU, Gang
    • H01L31/036H01L27/146H01L27/12H01L31/0368H01L31/0376H01L31/20
    • H01L31/20H01L27/1225H01L27/1463H01L27/14632H01L27/14663H01L27/14687H01L27/14692H01L31/0368H01L31/0376Y02E10/50
    • A method of fabricating a pixelated imager includes providing a substrate with bottom contact layer and sensing element blanket layers on the contact layer. The blanket layers are separated into an array of sensing elements by trenches isolating adjacent sensing elements. A sensing element electrode is formed adjacent each sensing element overlying a trench and defining a TFT. A layer of metal oxide semiconductor (MOS) material is formed on a dielectric layer overlying the electrodes and on an exposed upper surface of the blanket layers defining the sensing element adjacent each TFT. A layer of metal is deposited on each TFT and separated into source/drain electrodes on opposite sides of the sensing element electrode. The metal forming one of the S/D electrodes contacts the MOS material overlying the exposed surface of the semiconductor layer, whereby each sensing element in the array is electrically connected to the adjacent TFT by the MOS material.
    • 一种制造像素化成像器的方法包括在接触层上提供具有底部接触层和感测元件覆盖层的衬底。 通过隔离相邻感测元件的沟槽将覆盖层分成感测元件阵列。 感测元件电极形成在覆盖沟槽并限定TFT的每个感测元件附近。 一层金属氧化物半导体(MOS)材料形成在覆盖电极的介电层上以及在限定与每个TFT相邻的感测元件的覆盖层的暴露的上表面上。 在每个TFT上沉积金属层,并在感测元件电极的相对侧分成源极/漏极电极。 形成S / D电极中的一个的金属接触覆盖半导体层的暴露表面的MOS材料,由此阵列中的每个感测元件通过MOS材料电连接到相邻的TFT。
    • 4. 发明公开
    • METAL OXIDE TFT WITH IMPROVED SOURCE/DRAIN CONTACTS
    • 金属氧化物薄膜晶体管,改善源/漏极接触
    • EP2715786A1
    • 2014-04-09
    • EP12796733.9
    • 2012-05-16
    • CBrite Inc.
    • SHIEH, Chan-longYU, GangFOONG, Fatt
    • H01L21/36H01L21/44H01L21/465
    • H01L29/7869H01L21/428H01L29/45H01L29/66969H01L29/78606
    • A method of forming ohmic source/drain contacts in a metal oxide semiconductor thin film transistor includes providing a gate, a gate dielectric, a high carrier concentration metal oxide semiconductor active layer with a band gap and spaced apart source/drain metal contacts in a thin film transistor configuration. The spaced apart source/drain metal contacts define a channel region in the active layer. An oxidizing ambient is provided adjacent the channel region and the gate and the channel region are heated in the oxidizing ambient to reduce the carrier concentration in the channel area. Alternatively or in addition each of the source/drain contacts includes a very thin layer of low work function metal positioned on the metal oxide semiconductor active layer and a barrier layer of high work function metal is positioned on the low work function metal.
    • 一种在金属氧化物半导体薄膜晶体管中形成欧姆源极/漏极接触的方法包括提供具有带隙的栅极,栅极电介质,高载流子浓度金属氧化物半导体有源层以及间隔开的薄膜晶体管 薄膜晶体管配置。 间隔开的源极/漏极金属触点在有源层中限定沟道区域。 在沟道区域附近提供氧化环境,并且在氧化环境中加热栅极和沟道区域以降低沟道区域中的载流子浓度。 可选地或附加地,每个源极/漏极接触件包括位于金属氧化物半导体活性层上的非常薄的低功函数金属层,并且具有高功函数金属的阻挡层位于低功函数金属上。
    • 6. 发明公开
    • PIXELATED IMAGER WITH MOTFET AND PROCESS
    • PIXELBILDGEBER MIT MOTFT UND VERFAHREN
    • EP2932534A1
    • 2015-10-21
    • EP13863613.9
    • 2013-12-09
    • CBrite Inc.
    • SHIEH, Chan-longYU, Gang
    • H01L31/036
    • H01L31/20H01L27/1225H01L27/1463H01L27/14632H01L27/14663H01L27/14687H01L27/14692H01L31/0368H01L31/0376Y02E10/50
    • A method of fabricating a pixelated imager includes providing a substrate with bottom contact layer and sensing element blanket layers on the contact layer. The blanket layers are separated into an array of sensing elements by trenches isolating adjacent sensing elements. A sensing element electrode is formed adjacent each sensing element overlying a trench and defining a TFT. A layer of metal oxide semiconductor material is formed on a dielectric layer overlying the electrodes and on an exposed upper surface of the blanket layers defining the sensing element adjacent each TFT. A layer of metal is deposited on each TFT and separated into source/drain electrodes on opposite sides of the electrode.The metal forming one of the electrodes contacts the MOS material overlying the exposed surf ace of the semiconductor layer, whereby each sensing element in the array is electrically connected to the adjacent TFT by the MOS material.
    • 制造像素化成像器的方法包括在接触层上提供底层接触层和感测元件覆盖层。 橡皮布层通过隔离相邻感测元件的沟槽分离成感测元件的阵列。 感测元件电极邻近覆盖沟槽的每个感测元件形成并且限定TFT。 一层金属氧化物半导体(MOS)材料形成在覆盖电极的电介质层上,并且在覆盖层的暴露的上表面上形成与每个TFT相邻的感测元件。 在每个TFT上沉积一层金属,并在传感元件电极的相对侧分离成源极/漏极。 形成S / D电极之一的金属接触覆盖半导体层的暴露表面的MOS材料,由此阵列中的每个感测元件通过MOS材料电连接到相邻的TFT。
    • 7. 发明公开
    • MASK LEVEL REDUCTION FOR MOFET
    • MASOF LEVEL REDUCTION FOR MOFET
    • EP2856251A1
    • 2015-04-08
    • EP13797618.9
    • 2013-05-28
    • CBrite Inc.
    • SHIEH, Chan-longYU, GangFOONG, FattLEE, Liu-chung
    • G02F1/1343
    • G02F1/134363G02F1/13439G02F1/1368G02F2001/134372G02F2001/136231G02F2001/136236H01L27/1225H01L27/1288
    • A method of fabricating a TFT and IPS with reduced masking operations includes a substrate, a gate, a layer of gate dielectric on the gate and surrounding substrate surface and a semiconducting metal oxide on the gate dielectric. A channel protection layer overlies the gate to define a channel area in the semiconducting metal oxide. A S/D metal layer is patterned on the channel protection layer and a portion of the exposed semiconducting metal oxide to define an IPS area. An organic dielectric material is patterned on the S/D terminals and at an opposed side of the IPS area. The S/D metal is etched to expose the semiconducting metal oxide defining a first IPS electrode. A passivation layer covers the first electrode and a layer of transparent conductive material is patterned on the passivation layer to define a second IPS electrode overlying the first electrode.
    • 制造具有减少的掩模操作的TFT和IPS的方法包括衬底,栅极,栅极和周围衬底表面上的栅极电介质层以及栅极电介质上的半导体金属氧化物。 沟道保护层覆盖栅极以在半导体金属氧化物中限定沟道区域。 在沟道保护层和暴露的半导体金属氧化物的一部分上图案化S / D金属层以限定IPS区域。 有机介电材料在S / D端子上和IPS区域的相对侧上被图案化。 对S / D金属进行蚀刻以暴露限定第一IPS电极的半导体金属氧化物。 钝化层覆盖第一电极并且在钝化层上图案化透明导电材料层以限定覆盖第一电极的第二IPS电极。