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1. 发明公开

EP1788446A2 Exposure apparatus and device manufacturing method 审中-公开
标题翻译： Belichtungsgerätund Verfahren zur Herstellung einer Vorrichtung
公开(公告)号：EP1788446A2
公开(公告)日：2007-05-23
申请号：EP06023383.0
申请日：2006-11-09
申请人： CANON KABUSHIKI KAISHA
发明人： Nyui, Masaru , Chiba, Keiko , Yamashita, Keiji
IPC分类号： G03F7/20
CPC分类号： G03F7/70916 , G03F7/70341
摘要： An exposure apparatus (1) includes an illumination optical system (10) for illuminating a reticle (20) using a light from a light source (12), and a projection optical system (30) for projecting a pattern of the reticle (20) onto a substrate (40), the exposure apparatus (1) exposing the substrate (40) through a liquid (LQ) that is supplied to a space (SP1) between the substrate (40) and a lens (300) of the projection optical system (30) closest to the substrate (40), a surface (330) of the lens (300) on which the light does not pass having a polished surface
摘要翻译：曝光装置（1）包括：使用来自光源（12）的光照射标线（20）的照明光学系统（10），以及用于投射所述标线（20）的图案的投影光学系统（30）在基板（40）上，曝光装置（1）通过液体（LQ）将基板（40）暴露在基板（40）和投影光学透镜（300）之间的空间（SP1）上最靠近基板（40）的系统（30），透光体（300）的未通过光的表面（330）具有抛光表面

2. 发明授权

EP0884136B1 Measuring method and apparatus for using the same 失效
标题翻译：测量的方法和装置用于执行该方法
公开(公告)号：EP0884136B1
公开(公告)日：2003-11-05
申请号：EP98304444.7
申请日：1998-06-04
申请人： CANON KABUSHIKI KAISHA
发明人： Nyui, Masaru , Ban, Mikichi
IPC分类号： B24B37/04 , B24B49/04 , B24B49/12
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12

3. 发明公开

EP0827193A2 Polishing endpoint determination method and apparatus 失效
标题翻译：抛光终点确定方法和装置
公开(公告)号：EP0827193A2
公开(公告)日：1998-03-04
申请号：EP97306557.6
申请日：1997-08-27
申请人： CANON KABUSHIKI KAISHA
发明人： Nyui, Masaru , Ban, Mikichi
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/26
摘要： Disclosed is a method of polishing the surface of a film provided on a substrate, by use of a polishing device, while relatively moving the film surface and the polishing device. The method includes a position detecting step for detecting a predetermined position on the surface of the film, a first measurement step for measuring an absolute value of the film thickness at the predetermined position, a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through the first measurement step, a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of a data obtained through the first and second measurement steps, and a control step for controlling continuation/discontinuation of polishing, on the basis of a data obtained through the film thickness distribution measurement step.
摘要翻译：公开了一种在使膜表面和抛光装置相对移动的同时，通过使用抛光装置抛光设置在基板上的膜的表面的方法。该方法包括：位置检测步骤，用于检测薄膜表面上的预定位置;第一测量步骤，用于测量预定位置处的薄膜厚度的绝对值;第二测量步骤，用于测量薄膜的膜厚度信息所述预定位置基于通过所述第一测量步骤获得的测量值获得膜厚度分布测量步骤，所述膜厚度分布测量步骤用于基于通过所述第一和第二测量步骤获得的数据来检测所述膜的膜厚度分布，以及控制步骤，用于基于通过膜厚度分布测量步骤获得的数据来控制抛光的继续/停止。

4. 发明公开

EP1788446A3 Exposure apparatus and device manufacturing method 审中-公开
标题翻译：曝光装置和装置制造方法
公开(公告)号：EP1788446A3
公开(公告)日：2007-11-28
申请号：EP06023383.0
申请日：2006-11-09
申请人： CANON KABUSHIKI KAISHA
发明人： Nyui, Masaru , Chiba, Keiko , Yamashita, Keiji
IPC分类号： G03F7/20
CPC分类号： G03F7/70916 , G03F7/70341
摘要： An exposure apparatus (1) includes an illumination optical system (10) for illuminating a reticle (20) using a light from a light source (12), and a projection optical system (30) for projecting a pattern of the reticle (20) onto a substrate (40), the exposure apparatus (1) exposing the substrate (40) through a liquid (LQ) that is supplied to a space (SP1) between the substrate (40) and a lens (300) of the projection optical system (30) closest to the substrate (40), a surface (330) of the lens (300) on which the light does not pass having a polished surface
摘要翻译：曝光装置（1）包括用于使用来自光源（12）的光照射标线片（20）的照明光学系统（10）和用于投射标线片（20）的图案的投影光学系统（30）（40）和透镜（300）之间的空间（SP1）中的液体（LQ）曝光衬底（40）的曝光设备（1）系统（30）最靠近基板（40），透镜（300）的光不通过的表面（330）具有抛光表面

5. 发明公开

EP0827193A3 Polishing endpoint determination method and apparatus 失效
标题翻译： Polierendpunktbestimmungsmethode und Apparat
公开(公告)号：EP0827193A3
公开(公告)日：1998-12-30
申请号：EP97306557.6
申请日：1997-08-27
申请人： CANON KABUSHIKI KAISHA
发明人： Nyui, Masaru , Ban, Mikichi
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , H01L22/26
摘要： Disclosed is a method of polishing the surface of a film provided on a substrate, by use of a polishing device, while relatively moving the film surface and the polishing device. The method includes a position detecting step for detecting a predetermined position on the surface of the film, a first measurement step for measuring an absolute value of the film thickness at the predetermined position, a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through the first measurement step, a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of a data obtained through the first and second measurement steps, and a control step for controlling continuation/discontinuation of polishing, on the basis of a data obtained through the film thickness distribution measurement step.
摘要翻译：公开了一种在使膜表面和抛光装置相对移动的同时通过使用研磨装置来研磨设置在基板上的膜的表面的方法。该方法包括用于检测胶片表面上的预定位置的位置检测步骤，用于测量在预定位置处的膜厚度的绝对值的第一测量步骤，用于测量胶片厚度信息的第二测量步骤基于通过第一测量步骤获得的测量值，基于通过第一和第二测量步骤获得的数据，检测膜的膜厚分布的膜厚度分布测量步骤，以及根据通过薄膜厚度分布测量步骤获得的数据，控制用于控制抛光的继续/停止的控制步骤。

6. 发明公开

EP0884136A1 Polishing method and polishing apparatus using the same 失效
标题翻译： Polierverfahren und Poliervorrichtung zurDurchführungdes Polierverfahrens
公开(公告)号：EP0884136A1
公开(公告)日：1998-12-16
申请号：EP98304444.7
申请日：1998-06-04
申请人： CANON KABUSHIKI KAISHA
发明人： Nyui, Masaru , Ban, Mikichi
IPC分类号： B24B37/04 , B24B49/04 , B24B49/12
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12
摘要： This specification discloses a polishing method of polishing the surface of a film layer (5a) provided on the surface of a substrate (5b) by polishing means (4) with both of them driven relative to each other, having the position detecting step of detecting a predetermined position on the surface of the film layer (5a), the first measuring step of applying momentary light from a light source to the predetermined position, and detecting the light beam from the predetermined position by a light receiving element to thereby measure the film thickness at the predetermined position, and the controlling step of controlling the polishing state by using data obtained at the first measuring step. The specification also discloses a polishing apparatus (1) using such polishing method.
摘要翻译：该说明书公开了一种抛光方法，其通过抛光装置（4）对设置在基板（5b）的表面上的膜层（5a）的表面进行抛光，两者都被相对于彼此驱动，具有位置检测步骤在膜层（5a）的表面上的预定位置，第一测量步骤，将来自光源的瞬时光施加到预定位置，并且通过光接收元件检测来自预定位置的光束，从而测量膜以及通过使用在第一测量步骤获得的数据来控制抛光状态的控制步骤。本说明书还公开了使用这种抛光方法的抛光装置（1）。

7. 发明公开

EP0806266A2 Polishing method and polishing apparatus using the same 失效
标题翻译：使用的相同的抛光方法和装置
公开(公告)号：EP0806266A2
公开(公告)日：1997-11-12
申请号：EP97302916.8
申请日：1997-04-29
申请人： CANON KABUSHIKI KAISHA
发明人： Nyui, Masaru , Ban, Mikichi , Takahashi, Kazuo
IPC分类号： B24B37/04
CPC分类号： B24B37/013 , B24B49/04 , B24B49/12 , G01B11/0683 , G05B19/401 , G05B2219/37398 , G05B2219/37576 , G05B2219/45026 , G05B2219/45199 , G05B2219/50067 , H01L22/26
摘要： A polishing method is disclosed of polishing the surface of a layer provided on the surface of a substrate having the surface configuration measuring step of detecting the surface information of the layer at a plurality of locations and obtaining the surface configuration of the layer, the film thickness distribution measuring step of detecting the film thicknesses of the layer at a plurality of locations and obtaining the film thickness distribution of the layer, the determining step of determining whether the surface configuration and film thickness distribution of the layer are within a preset allowable range, and the polishing controlling step of continuing or stopping the polishing on the basis of the result of the determination at the determining step.

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