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1. 发明公开

EP3168002A1 POLISHING FILM 有权
标题翻译：抛光电影
公开(公告)号：EP3168002A1
公开(公告)日：2017-05-17
申请号：EP15819449.8
申请日：2015-06-26
申请人： Bando Chemical Industries, Ltd.
发明人： TAURA Toshikazu , SAITO Kazuo
IPC分类号： B24D11/00 , B24B19/00 , B24D3/28 , G02B6/25
CPC分类号： B24D3/28 , B24B19/00 , B24D11/00 , G02B6/25
摘要： An abrasive film capable of preventing an undercut of an optical fiber after polishing, while providing a great grinding force is provided. An abrasive film includes a substrate and an abrasive layer overlaid on a top face side thereof, the abrasive layer including a resin binder and abrasive particles dispersed in the resin binder; the content of abrasive particles having a primary particle size of no less than 70 nm being no less than 10% by mass and no greater than 50% by mass with respect to the total abrasive particles; the content of the abrasive particles in the abrasive layer being no less than 84% by mass; and the indentation hardness of the abrasive layer being no greater than 370 N/mm 2 . The abrasive particles are preferably silica particles. An average thickness of the abrasive layer is preferably no less than 4 µm and no greater than 15 µm.
摘要翻译：本发明提供一种磨削膜，其能够在研磨后防止光纤的咬边，同时提供很大的磨削力。一种研磨膜，包括基材和覆盖在其顶面侧上的研磨层，所述研磨层包括树脂粘合剂和分散在所述树脂粘合剂中的磨粒; 一次粒径为70nm以上的磨粒的含量相对于总磨粒为10质量％以上且50质量％以下，磨料层中磨料颗粒的含量不小于84质量％; 磨料层的压痕硬度不大于370N / mm2。磨粒优选是二氧化硅颗粒。磨料层的平均厚度优选不小于4μm且不大于15μm。

2. 发明公开

EP3184244A1 POLISHING FILM 有权
标题翻译：抛光电影
公开(公告)号：EP3184244A1
公开(公告)日：2017-06-28
申请号：EP15834367.3
申请日：2015-08-05
申请人： Bando Chemical Industries, Ltd.
发明人： TAURA Toshikazu , SAITO Kazuo
IPC分类号： B24D11/00 , B24D3/00
CPC分类号： B24D3/00 , B24D11/001 , G02B6/3847 , G02B6/3863
摘要： Provided is an abrasive film not likely to cause an end face defect of an optical fiber connector due to variation in load conditions during polishing, while providing a great grinding force. The abrasive film comprises a substrate film and an abrasive layer overlaid thereon, the abrasive layer comprising abrasive particles and a binder therefor and a wear quantity of the abrasive layer being from 10 mg to 25 mg. A content of the abrasive particles in the abrasive layer is preferably no less than 85% by mass. The abrasive particles preferably comprise first abrasive particles (primary particle diameter: of no less than 10 nm and less than 50 nm), and second abrasive particles (primary particle diameter: no less than 50 nm and less than 250 nm). An average thickness of the abrasive layer is preferably from 4 µm to 15 µm. The abrasive particles are preferably silica particles.
摘要翻译：本发明提供一种磨削膜，该磨削膜不易引起光纤连接器的端面缺陷，这是因为在抛光期间负载条件的变化，同时提供了很大的磨削力。该磨料膜包括基材膜和覆盖在其上的磨料层，该磨料层包含磨料颗粒和用于其的粘合剂，磨料层的磨损量为10mg至25mg。磨料层中磨粒的含量优选不小于85质量％。磨粒优选包含第一磨粒（初级粒径：不小于10nm且小于50nm）和第二磨粒（初级粒径：不小于50nm且小于250nm）。磨料层的平均厚度优选为4μm至15μm。磨粒优选是二氧化硅颗粒。

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