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    • 2. 发明公开
    • Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
    • 装置与几个独立的操纵器和生产和传输设备为半导电性的硅酮光盘
    • EP0793262A3
    • 2001-08-16
    • EP97301360.0
    • 1997-02-28
    • APPLIED MATERIALS, INC.
    • McClintock, WilliamLowrance, Robert B.Grunes, Howard
    • H01L21/00
    • H01L21/67742H01L21/68707H01L21/68742Y10S414/135
    • The disclosure relates to a robot assembly (10) including multiple independently operable robot assemblies provided for use in semiconductor wafer processing. The robot assembly includes independent co-axial upper and lower robot assemblies (14,16) adapted to handle multiple objects. The upper robot is stacked above the lower robot and the two robots are mounted concentrically to allow fast wafer transfer. Concentric drive mechanisms (1004, 1006, 1000, 1002) may also be provided for imparting rotary motion to either rotate the robot assembly or extend an extendable arm assembly (21,22) into an adjacent chamber (18a, 18b). Each robot can be either a single blade robot or a dual blade (33,34) robot. Also provided is an apparatus for processing semiconductor wafers (W) comprising a pre/post process transfer chamber (12) housing multiple independent robot assemblies and surrounded by a plurality of pre-process chambers and post process chambers (18a, 18b). A process transfer chamber (12) is connected to the pre/post process transfer chamber by cooling chambers, and is otherwise surrounded by a plurality of process chambers. Multiple independent robot assemblies are also provided within the process transfer chamber. Within each process, pre-process and post-process chamber is an apparatus for holding a plurality of stacked wafers. The apparatus includes a wafer lifting and storing apparatus exhibiting a plurality of vertically movable lift pins (270) surrounding the chamber pedestal (262). The lift pins are configures to receive and hold a plurality of stacked wafers, preferably two therein. Each one of the plurality of lift pins preferably comprises a lower lift pin (270a) segment exhibiting a lower wafer support surface proximal to the upper end thereof, and an upper lift pin segment (270b) hingedly connected to the lower lift pin segment and exhibiting an upper wafer support surface proximal to an upper end thereof.
    • 5. 发明公开
    • Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
    • 装置与几个独立的操纵器和生产和传输设备为半导电性的硅酮光盘
    • EP0793262A2
    • 1997-09-03
    • EP97301360.0
    • 1997-02-28
    • APPLIED MATERIALS, INC.
    • McClintock, WilliamLowrance, Robert B.Grunes, Howard
    • H01L21/00
    • H01L21/67742H01L21/68707H01L21/68742Y10S414/135
    • The disclosure relates to a robot assembly (10) including multiple independently operable robot assemblies provided for use in semiconductor wafer processing. The robot assembly includes independent co-axial upper and lower robot assemblies (14,16) adapted to handle multiple objects. The upper robot is stacked above the lower robot and the two robots are mounted concentrically to allow fast wafer transfer. Concentric drive mechanisms (1004, 1006, 1000, 1002) may also be provided for imparting rotary motion to either rotate the robot assembly or extend an extendable arm assembly (21,22) into an adjacent chamber (18a, 18b). Each robot can be either a single blade robot or a dual blade (33,34) robot. Also provided is an apparatus for processing semiconductor wafers (W) comprising a pre/post process transfer chamber (12) housing multiple independent robot assemblies and surrounded by a plurality of pre-process chambers and post process chambers (18a, 18b). A process transfer chamber (12) is connected to the pre/post process transfer chamber by cooling chambers, and is otherwise surrounded by a plurality of process chambers. Multiple independent robot assemblies are also provided within the process transfer chamber. Within each process, pre-process and post-process chamber is an apparatus for holding a plurality of stacked wafers. The apparatus includes a wafer lifting and storing apparatus exhibiting a plurality of vertically movable lift pins (270) surrounding the chamber pedestal (262). The lift pins are configures to receive and hold a plurality of stacked wafers, preferably two therein. Each one of the plurality of lift pins preferably comprises a lower lift pin (270a) segment exhibiting a lower wafer support surface proximal to the upper end thereof, and an upper lift pin segment (270b) hingedly connected to the lower lift pin segment and exhibiting an upper wafer support surface proximal to an upper end thereof.
    • 本发明涉及一种机器人组件(10)包括设置用于在半导体晶片加工使用多个unabhängig可操作机器人组件。 机器人组件包括独立同轴上部和下部机械手组件(14,16)angepasst来处理多个对象。 上部机械层叠于下机器人的上方和两个机器人同心安装,以允许几乎晶片传送。 同心的驱动机构(1004,1006,1000,1002)因此可以提供一种用于赋予旋转运动来旋转无论是机械手组件或延伸到伸展臂总成(21,22)插入在相邻的腔室(18A,18B)。 每个机器人可以是单个刀片机器人或双叶片(33,34)的机器人。 这样提供了一种用于处理半导体晶片(W),其包括前/后处理传送室(12)容纳多个独立机器人组件和由前处理及后处理室腔室的多个被围绕的装置(18A,18B)。 的方法,传送室(12)由冷却室连接到预/后处理传送腔室,并通过处理室的数目为否则包围。 因此多个独立的机器人组件在处理腔室传送内。 在每个过程中,前处理和后处理室是用于保持堆叠的晶片的一个多元化的装置。 该装置包括:晶片升降和存储装置参展的包围室基座(262)可垂直移动的提升销(270)多个。 升降销是提供配置为接收和保持堆叠的晶片的复数,优选两个在其中。 的升降销,所述多个每一个优选地包括下部升降销(270A)链段表现出较低的晶片支撑表面接近其上端,并且在上部提升销区段(270B)以铰接方式连接到下部升降销段和参展 在上晶片支撑表面邻近于上端。