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    • 8. 发明公开
    • Lithographic projection apparatus and device manufacturing method
    • LithografischesProjektionsgerätund Verfahren zur Herstellung einer Vorrichtung
    • EP1693708A2
    • 2006-08-23
    • EP06250757.9
    • 2006-02-13
    • ASML Netherlands B.V.
    • Stavenga, Marco KoertJacobs, Johannes Henricus WilhelmusJansen, HansVerhagen, Martinus Cornelis Maria
    • G03F7/20
    • G03F7/70341G03F7/709
    • Various types of pressure regulating devices are disclosed to reduce a pressure gradient in a liquid supply system of a lithographic apparatus, the liquid supply system having a liquid confinement structure configured to at least partially confine a liquid between a projection system and a substrate table of the lithographic apparatus. A high pressure gradient may cause particulate contamination in the liquid supply system and/or liquid confinement structure. A pressure gradient can be reduced by, for example, the use of slow switching in one or more valves (20), a bleed flow (22) around or through one or more valves, diversion of liquid to a drain (24) rather than or in addition to switching a valve off, a pressure regulator or flow restrictor to prevent shock waves, and a buffer volume / damper to compensate for pressure fluctuation.
    • 公开了各种类型的压力调节装置,以减小光刻设备的液体供应系统中的压力梯度,液体供应系统具有液体限制结构,其被配置为至少部分地将液体限制在投影系统和基板台之间的液体 光刻设备 高压梯度可能导致液体供应系统和/或液体限制结构中的颗粒污染。 压力梯度可以通过例如在一个或多个阀门(20)中使用缓慢的切换来减少,在一个或多个阀门周围或通过一个或多个阀门的排出流(22),将液体转移到排水管(24)而不是 或者除了关闭阀门之外,也可以使用压力调节器或限流器来防止冲击波,以及缓冲容积/阻尼器来补偿压力波动。
    • 10. 发明公开
    • Lithographic apparatus, device manufacturing method, and device manufactured thereby
    • 石版画家Apparat,Verfahren zur Herstellung eines Artikels und dabei hergesteller Artikel
    • EP1503243A1
    • 2005-02-02
    • EP03077408.7
    • 2003-07-31
    • ASML Netherlands B.V.
    • Verhagen, Martinus Cornelis Maria
    • G03F7/20
    • G03F7/70808G03F7/70883G03F7/70933G03F7/70975
    • In a lithographic projection apparatus the beam path should be free of gaseous material and condensed material that absorb the beam, or could damage the optical components under influence of the beam. To remove this type of material a purge gas is supplied to a chamber that contains at least part of the beam path. The purge gas is supplied at a normal flow rate to purge an unwanted substance from an atmosphere in the beam path while the beam is passed through the beam path. The flow rate is switched back from the normal flow rate to a lower flow rate when the chamber has to be opened for access. The lower flow rate is so high that condensation of the unwanted substance onto an optical element in the beam path is substantially prevented by the flow of purge gas at the further flow rate, but not generally so high as would be necessary to prevent significant absorption from the beam.
    • 在光刻投影装置中,光束路径应该不含吸收光束的气态材料和冷凝材料,或者可能在光束影响下损坏光学部件。 为了去除这种类型的材料,吹扫气体被供应到包含至少一部分光束路径的室。 吹扫气体以正常流速供应,以在光束通过光束路径时从光束路径中的大气中吹扫不想要的物质。 当腔室必须打开以进入时,流量从正常流量切换回较低的流速。 较低的流速是如此之高,使得不必要的物质在光束路径中的光学元件上的冷凝基本上被进一步流速下的吹扫气体的流动阻止,但通常不会如此大以防止显着的吸收 梁。