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1. 发明公开

EP2370996A4 THERMOCOUPLE 有权转让
标题翻译：热电偶
公开(公告)号：EP2370996A4
公开(公告)日：2017-02-01
申请号：EP09836647
申请日：2009-12-02
申请人： ASM INC
发明人： DARABNIA BUZ , YEDNAK ANDY , HALPIN MIKE , JACOBS LOREN , AGGARWAL RAVINDER
IPC分类号： H01L21/66 , G01K7/04 , G01K13/00 , H01L21/205
CPC分类号： G01K7/04 , C23C16/46 , G01K13/00
摘要： A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.
摘要翻译：描述了用于半导体加工反应的热电偶。热电偶包括具有测量尖端和相对端处的开口的护套。接收第一导线和第二导线的一部分的支撑构件容纳在护套内。第一和第二导线形成在测量尖端处与护套的内表面接触的连接点。间隔构件固定在护套的开口处并接收支撑构件。间隔构件允许支撑构件，第一线材和第二线材相对于彼此自由地热膨胀，而不会在其中引入压缩或拉伸应力。

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