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    • 1. 发明公开
    • THERMOSETTING RESIN COMPOSITION
    • HITZEHÄRTBAREHARZZUSAMMENSETZUNG
    • EP1564257A4
    • 2007-07-04
    • EP03774101
    • 2003-11-20
    • NIPPON PETROCHEMICALS CO LTD
    • TAKASHIMA TSUTOMU
    • C08L101/00C08G59/42C08G59/68C08K5/098C08K5/56C08L23/26C08L61/04C08L63/00C08L63/04
    • C08L63/04C08G59/4215C08G59/686C08L23/26C08L61/04C08L63/00C08L101/00C08L2666/06
    • A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, oxidative degradation resistance and thermal degradation resistance without impairing the heat resistances such as HDT and is suitable for the encapsulation of semiconductors or the like. The composition is characterized by comprising (A) a thermosetting resin, (B) any of the following liquid monoolefin polymers (a) to (c): (a) a liquid monoolefin polymer having at least one epoxy group (hereinafter referred to as “epoxy-containing liquid monoolefin polymer”), (b) a liquid monoolefin polymer having at least one aldehyde group (hereinafter referred to as “aldehyde-containing liquid monoolefin polymer”), and (c) a liquid monoolefin polymer having at least one keto group (hereinafter referred to as “keto-containing liquid monoolefin polymer”) (hereinafter the polymers (a) to (c) are collectively referred to as “reactive liquid monoolefin polymer”), and (C) an organometallic compound and/or a metal ester compound. The composition can develop a sea-island phase structure composed of a continuous phase mainly made of a product of curing of the thermosetting resin (containing a curing agent) and a dispersed phase which is mainly made of the thermosetting resin (containing a curing agent) and the reactive liquid monoolefin polymer wherein the whole periphery of each dispersed particle is covered with least one interfacial phase.
    • 提供耐冲击性,耐热裂纹性,耐氧化劣化性,耐热劣化性等不损害HDT等耐热性的热固性树脂组合物,适用于半导体等的封装。 该组合物的特征在于包含(A)热固性树脂,(B)以下液体单烯烃聚合物(a)至(c)中的任一种:(a)具有至少一个环氧基的液态单烯烃聚合物(以下称为“ (b)具有至少一个醛基的液态单烯烃聚合物(以下称为“含醛液态单烯烃聚合物”),和(c)具有至少一个酮基的液态单烯烃聚合物 (以下称为“含酮液体单烯烃聚合物”)(以下将聚合物(a)〜(c)统称为“反应性液态单烯烃聚合物”)和(C)有机金属化合物和/或 金属酯化合物。 该组合物可以形成由主要由热固性树脂(含有固化剂)固化产物和主要由热固性树脂(含有固化剂)组成的分散相组成的连续相构成的海岛相结构, 和反应性液态单烯烃聚合物,其中每个分散颗粒的整个外围被至少一个界面相覆盖。
    • 2. 发明公开
    • THERMOSETTING RESIN COMPOSITION
    • 热固性树脂组合物
    • EP1564256A1
    • 2005-08-17
    • EP03774100.6
    • 2003-11-20
    • NIPPON PETROCHEMICALS CO., LTD.
    • TAKASHIMA, Tsutomu
    • C08L101/00C08L23/26
    • C08L23/20C08F8/00C08F8/48C08L61/06C08L63/00C08L101/00C08L2201/00C08L2666/02C08L2666/04C08L2666/06C08F110/08
    • A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, oxidative degradation resistance and thermal degradation resistance without impairing the heat resistance represented by HDT and which is suitable for the encapsulation of semiconductors and the like, is provided. The thermosetting resin composition comprises (A) a thermosetting resin, (B) a liquid polybutene containing an aldehyde gourp and (C) a curing agent added at need thereto, wherein the main component of the liquid polybutene has an aldehyde structure at a terminal and the main chain thereof as a structure in which 80% or more of the repeating unit have a structure represented by the Formula (1). The impact resistance and thermal crack resistance are attained by making a phase structure comprised with resin of the thermosetting resin composition after the curing reaction wherein a µm unit size of a dispersed phase which consists primarily of the component derived from an aldehyde group containing liquid polybutene, exists in a continuous phase which consists primarily of the thermosetting resin.
    • 提供一种耐冲击性,耐热裂纹性,耐氧化劣化性和耐热劣化性均得到改善而不损害由HDT表示的耐热性并且适用于半导体等的封装的热固性树脂组合物。 该热固性树脂组合物含有(A)热固性树脂,(B)含有醛基的液体聚丁烯和(C)根据需要加入的固化剂,其中液体聚丁烯的主要成分在末端具有醛结构, 其主链为重复单元的80%以上具有式(1)所示的结构的结构。 耐冲击性和耐热裂性可通过在固化反应后制备由热固性树脂组合物的树脂构成的相结构来实现,其中主要由来源于含醛基液体聚丁烯的组分构成的分散相的μm单位尺寸, 存在于主要由热固性树脂组成的连续相中。