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    • 7. 发明公开
    • Method of forming multi-level coplanar metal/insulator films using dual damascene with sacreficial flowable oxide
    • 一种用于使用镶嵌工艺可流动Opferoxyd产生共平面的金属/绝缘多层膜过程
    • EP0895283A2
    • 1999-02-03
    • EP98110307.0
    • 1998-06-05
    • SIEMENS AKTIENGESELLSCHAFT
    • Feldner, KlausGrewal, VirinderVollmer, BerndSchnabel, Rainer Florian
    • H01L21/768
    • H01L21/76808
    • An improved method of performing a dual damascene etch through a layer stack disposed above a substrate. The layer stack includes an underlying device layer and an insulating layer disposed above the underlying device layer. The method includes forming a trench in a top surface of the insulating layer such that the trench is positioned over the underlying device layer and separated therefrom by insulating material at a bottom of the trench. The method also includes, depositing flowable oxide over the top surface of the insulating layer and into the trench followed by planarizing the flowable oxide down to about a level of the top surface of the insulating layer. Further, the method includes, etching through the flowable oxide within the trench and through insulating material at the bottom of the trench down to the underlying device layer to form a via.
    • 通过上述一个基板设置在层堆叠进行双镶嵌刻蚀的改进的方法。 层堆叠包括下器件层和上绝缘下器件层之上设置的层。 该方法包括:在检测所述绝缘层的顶表面上形成沟槽并在沟槽位于下器件层上且通过在所述沟槽的底部的绝缘材料从那里分离。 因此,该方法包括,在绝缘层的顶部表面并进入接下来的约绝缘层的顶表面的水平降低到可流动氧化物平坦化所述沟槽中沉积的可流动氧化物。 此外,该方法包括,通过在沟槽内的可流动氧化物和通过在沟槽底部的绝缘材料向下到下器件层,以形成通过蚀刻。