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    • 3. 发明公开
    • POWER MODULE AND PROCESS FOR MANUFACTURING THE SAME
    • EP4343841A2
    • 2024-03-27
    • EP24156196.8
    • 2021-06-18
    • SwissSEM Technologies AG
    • Matthias, SvenSchnell, RaffaelToker-Bieri
    • H01L25/07
    • This power module has a top-part housing assembly (30) with power terminals and signal terminals in a plastic matrix. There are multiple downward facing press-fit pins in this plastic matrix for the electrical connections between the terminals and soldered/sintered substrates (12). The bottom-part assembly has a baseplate (10) with the preformed soldered/sintered substrates (12) being soldered by a liquefiable solder/sinter (42) onto the baseplate (10) using temporarily applied fixtures (43) on the baseplate (10). There is an alignment frame (35) which consists of a temperature resistant plastic with incorporated Copper sheets for the electrical substrate-to-substrate connection. Multiple soft Copper sleeves (36, 40) are precisely positioned and oriented in that alignment frame (35) to fit to the press-fitted pins of the top-part housing assembly (30) and for positioning the ceramic substrates (12) with a conductive Cu-top and bottom-side on the baseplate (10). These substrates (12) with their IGBTs, diodes and wirebonds are attached to the alignment frame (35) by pre-applied solder or sinter (42) at the corresponding positions of the Copper-structures incorporated in the alignment frame (35). The top-part housing assembly (30) and the entire bottom-part assembly are connected mechanically and electrically solely by the press-fitted pins in the respective sleeves (36, 40) in the alignment frame (35).