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1. 发明授权

EP3828294B1 LEAD-FREE SOLDER ALLOY AND SOLDER JOINT PART 有权
公开(公告)号：EP3828294B1
公开(公告)日：2022-11-16
申请号：EP20786727.6
申请日：2020-04-10
发明人： NISHIMURA, Tetsuro
IPC分类号： B23K35/26 , C22C13/02

2. 发明授权

EP3138658B1 LEAD-FREE SOLDER ALLOY 有权
公开(公告)号：EP3138658B1
公开(公告)日：2020-11-04
申请号：EP15785689.9
申请日：2015-04-28
申请人： Nihon Superior Co., Ltd.
发明人： NISHIMURA, Tetsuro , NISHIMURA, Takatoshi
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02 , B23K35/36 , B23K35/02 , B23K35/362 , B23K1/00

3. 发明授权

EP2698225B1 LEAD-FREE SOLDER ALLOY 有权
公开(公告)号：EP2698225B1
公开(公告)日：2018-07-25
申请号：EP12771978.9
申请日：2012-04-16
申请人： Nihon Superior Co., Ltd.
发明人： NISHIMURA Tetsuro
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/26 , C22C13/00 , H05K3/3463 , Y10T403/479
摘要： The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt% of Ag, 0.3 to 1.5 wt% of Cu, 0.01 to 0.2 wt% of Ni, 1.0 wt% or less of Ga, and the balance being Sn and unavoidable impurities.

4. 发明公开

EP2695701A1 SOLDER ALLOY 审中-公开
标题翻译：焊锡合金
公开(公告)号：EP2695701A1
公开(公告)日：2014-02-12
申请号：EP12768679.8
申请日：2012-04-06
申请人： Nihon Superior Co., Ltd. , The University of Queensland
发明人： NISHIMURA Tetsuro , NOGITA Kazuhiro , McDONALD, Stuart David , READ, Jonathan James , VENTURA, Tina
IPC分类号： B23K35/26 , C22C13/00
CPC分类号： B23K35/262 , C22C13/00
摘要： This solder alloy contains Al and/or Al 2 O 3 in the amount of 0.006-0.15 wt% in an Sn-Cu hypereutectic area. In addition, this solder alloy comprises Cu in the amount of 0.7-7.6 wt%, and Al and/or Al 2 O 3 in the amount of 0.006-0.5 wt%, with the remainder being Sn. Preferably, the amount of Cu contained is 2.0 wt% or greater. This solder alloy also has Ni substituted for Sn in the amount of 0.03-0.1 wt% of the composition thereof. Furthermore, this solder alloy has Ag substituted for Sn in the amount of 0.1-3.5 wt% of the composition thereof.
摘要翻译：这种焊料合金在Sn-Cu过共晶区域中含有0.006-0.15wt％的Al和/或Al 2 O 3。此外，该焊料合金包含0.7-7.6重量％的Cu和0.006-0.5重量％的Al和/或Al 2 O 3，其余为Sn。优选地，Cu含量为2.0重量％或更大。该焊料合金也具有用其组成的0.03-0.1重量％的量的Sn代替Sn。此外，该焊料合金中Ag的含量为其组成的0.1-3.5％（重量）。

5. 发明公开

EP2380695A4 WIRE SOLDER, METHOD OF FEEDING THE SAME AND APPARATUS THEREFOR 有权
标题翻译：钎料，饲料及其方法及其装置
公开(公告)号：EP2380695A4
公开(公告)日：2013-09-11
申请号：EP10731268
申请日：2010-01-14
申请人： NIHON SUPERIOR CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/14 , B23K3/06 , B23K35/02 , B23K35/36 , B23K35/40 , B23K101/42
CPC分类号： B23K3/063 , B23K35/0227 , B23K35/0238 , B23K35/3613 , B23K35/362 , B23K35/40 , B23K2201/42 , Y10T428/12222 , Y10T428/2938

6. 发明公开

EP3708292A1 LEAD-FREE SOLDER ALLOY 审中-实审
公开(公告)号：EP3708292A1
公开(公告)日：2020-09-16
申请号：EP20170413.7
申请日：2015-04-28
申请人： Nihon Superior Co., Ltd.
发明人： NISHIMURA, Tetsuro , NISHIMURA, Takatoshi
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02 , B23K35/36 , B23K35/02 , B23K35/362 , B23K1/00
摘要： Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn-Cu-Ni as a basic composition, which includes 0.1 to 2.0 mass% of Cu, and 0.01 to 0.5 mass% of Ni, 0.1 to 5 mass% of Bi, and 76.0 to 99.5 mass% of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.

7. 发明公开

EP2698225A4 LEAD-FREE SOLDER ALLOY 有权
标题翻译：无铅黄铜合金
公开(公告)号：EP2698225A4
公开(公告)日：2014-09-17
申请号：EP12771978
申请日：2012-04-16
申请人： NIHON SUPERIOR CO LTD
发明人： NISHIMURA TETSURO
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34
CPC分类号： B23K35/262 , B23K35/26 , C22C13/00 , H05K3/3463 , Y10T403/479
摘要： The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt% of Ag, 0.3 to 1.5 wt% of Cu, 0.01 to 0.2 wt% of Ni, 1.0 wt% or less of Ga, and the balance being Sn and unavoidable impurities.

8. 发明公开

EP0619162A3 Soldering flux 失效
标题翻译： Weichlotflüssmittel。
公开(公告)号：EP0619162A3
公开(公告)日：1995-12-27
申请号：EP94105206.0
申请日：1994-04-01
申请人： Takeda Chemical Industries, Ltd. , NIHON SUPERIOR Co., Ltd.
发明人： Arita, Kazuhiro , Nishimura, Tetsuro
IPC分类号： B23K35/363 , C08G69/44 , C08G69/42 , C08L93/04 , C08L77/12 , C08L33/02
CPC分类号： C08G69/42 , B23K35/3612 , B23K35/3613 , B23K35/3615 , B23K35/3618
摘要： A soldering flux comprising a bis (2-oxazoline) compound, a dithiol compound, an organic carboxylic acid compound and an activator which does not require post-soldering cleaning and, yet, does not cause corrosion of the base metal or deterioration of electrical characteristics and helps to clear the statutory regulations on the use of chlorofluorohydrocarbons. A soldering flux comprising, in addition to the above components, an organic solvent, a thermoplastic resin or/and an epoxy group-containing compound.

9. 发明公开

EP3138658A1 LEAD-FREE SOLDER ALLOY 有权
标题翻译：无铅焊接合金
公开(公告)号：EP3138658A1
公开(公告)日：2017-03-08
申请号：EP15785689.9
申请日：2015-04-28
申请人： Nihon Superior Co., Ltd.
发明人： NISHIMURA, Tetsuro , NISHIMURA, Takatoshi
IPC分类号： B23K35/26 , C22C13/00 , C22C13/02 , B23K1/00
摘要： Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn-Cu-Ni as a basic composition, which includes 0.1 to 2.0 mass% of Cu, and 0.01 to 0.5 mass% of Ni, 0.1 to 5 mass% of Bi, and 76.0 to 99.5 mass% of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.
摘要翻译：本发明提供即使在焊接后的高温状态下也能够维持牢固的接合强度，并且可靠性高且通用性高的无铅焊料合金及软钎料。本发明的无铅焊料合金组合物以Sn-Cu-Ni为基本组成，含有0.1〜2.0质量％的Cu，0.01〜0.5质量％的Ni，0.1〜5质量％的Bi，，从而即使在长时间暴露于高温的状态下，也不会降低钎焊接合部的接合强度，能够实现高可靠性的钎焊，并且能够实现此时的接合强度的结合。

10. 发明公开

EP3020493A1 NANOPARTICLE PRODUCTION METHOD, PRODUCTION DEVICE AND AUTOMATIC PRODUCTION DEVICE 有权转让
标题翻译： NANOPARTIKELHERSTELLUNGSVERFAHREN，HERSTELLUNGSVORRICHTUNG UND AUTOMATISCHE HERSTELLUNGSVORRICHTUNG
公开(公告)号：EP3020493A1
公开(公告)日：2016-05-18
申请号：EP13889209.6
申请日：2013-07-11
申请人： Applied Nanoparticle Laboratory Corporation , Nihon Superior Co., Ltd.
发明人： KOMATSU Teruo
IPC分类号： B22F9/24
CPC分类号： B22F9/24 , B22F1/0018 , B22F1/0044 , B22F9/02 , B22F2009/245 , B22F2301/255 , B22F2304/05 , B22F2998/10 , B22F2999/00 , B82Y30/00 , B82Y40/00 , B22F3/003
摘要： A nanoparticles production method, production apparatus and automatic production apparatus that allow continuous mass production of nanoparticles, with a uniform particle diameter and allow freely adjusting the generation time are provided. This nanoparticles production apparatus is characterized by being configured from: reaction tubes (30, 40) which are filled with the same solvent (11) as that in a ingredient liquid (18), which is used in nanoparticle production and comprises an ingredient material (12) mixed into the solvent (11); a heating apparatus (22) which controls the temperature of the solvent (11) in the reaction tubes (30, 40) to the synthesis temperature of the nanoparticles (26); inflow ends (30e, 40e) of the reaction tubes into which the ingredient liquid (18) is supplied; rotors (35, 45) which form spiral flows (e, j) along the inner surface of the outer walls (30h, 40h) of the reaction tubes while mixing the ingredient liquid (18) supplied and the solvent (11) present in the reaction tubes (30, 40); and outflow ends (30f, 40f) of the reaction tubes (30, 40) for forming, in the spiral flows (e, j), nanoparticles (26) from the ingredient material (12) and discharging a generation liquid (65) containing the nanoparticles (26).
摘要翻译：提供允许连续大规模生产具有均匀粒径并允许自由调节生成时间的纳米颗粒的纳米粒子制备方法，生产装置和自动生产装置。该纳米颗粒制备装置的特征在于：由反应管（30,40）构成，反应管（30,40）填充与成分液体（18）中相同的溶剂（11），其用于纳米颗粒生产中并且包含成分材料 12）混合到溶剂（11）中; 控制反应管（30,40）中的溶剂（11）的温度相对于纳米颗粒（26）的合成温度的加热装置（22）。供给成分液体（18）的反应管的流入端（30e，40e）转子（35,45），其在反应管的外壁（30h，40h）的内表面上形成螺旋流（e，j），同时混合供应的成分液体（18）和存在于反应管（30,40）; 和反应管（30,40）的流出端（30f，40f），用于在螺旋流（e，j）中从成分材料（12）形成纳米颗粒（26）并排出含有纳米颗粒（26）。

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