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    • 3. 发明公开
    • AQUEOUS BINDER COMPOSITION AND METHOD FOR BINDING FIBROUS MATERIAL USING SAME
    • 维多利亚BINDEMITTELZUSAMMENSETZUNG UND VERFAHREN ZUR BINDUNG VON FASERMATERIAL DAMIT
    • EP3127956A1
    • 2017-02-08
    • EP15774413.7
    • 2015-03-31
    • Kcc Corporation
    • HONG, Seung MinKIM, Yong JooJEONG, Young Gi
    • C08L5/00C08K5/16C08J5/00C09J105/00
    • C08K5/16C03C25/14C03C25/26C03C25/321C03C25/34C03C25/42
    • The present invention relates to an aqueous binder composition and a method for binding fibrous materials by using the same, and more specifically, relates to an aqueous binder composition and a method for binding fibrous materials by using the same comprising one or more reducing sugars, one or more amino acids, and one or more ionic compounds including metal cation having oxidation number of 2 or higher. The present invention provides the same or better physical properties with lower price compared to traditional phenol formaldehyde resin (PFR), does not include or release toxic materials such as formaldehyde or phenol, and may decrease intoxication which is a vulnerable point of traditional PFR during manufacturing and remarkably enhances the mechanical properties such as water resistance, tensile strength and hardness of the manufactured product.
    • 本发明涉及水性粘合剂组合物和通过使用它的粘合纤维材料的方法,更具体地,涉及水性粘合剂组合物和通过使用包含一种或多种还原糖的纤维材料粘合纤维材料的方法,一种 或更多的氨基酸,以及一种或多种离子化合物,包括氧化数为2或更高的金属阳离子。 与传统的酚醛树脂(PFR)相比,本发明提供了与较低价格相同或更好的物理性质,不包括或释放有毒物质如甲醛或苯酚,并且可能减少中间产物,这在制造过程中是传统PFR的脆弱点 并且显着提高了制造产品的机械性能如耐水性,拉伸强度和硬度。
    • 6. 发明公开
    • METAL-BONDED CERAMIC SUBSTRATE
    • METALLGEBUNDENES KERAMIKSUBSTRAT
    • EP2546870A2
    • 2013-01-16
    • EP11753594.8
    • 2011-03-09
    • KCC Corporation
    • KIM, Kyong HwanHAN, Moon SuPARK, Jun Hee
    • H01L23/15
    • H01L23/3735C04B37/026C04B2237/343C04B2237/365C04B2237/366C04B2237/368C04B2237/402C04B2237/407C04B2237/86H01L23/15H01L2924/0002H01L2924/00
    • A metal-bonding ceramic substrate is provided. The ceramic substrate has a circuit pattern formed by bonding a metal layer on a surface thereof. A plurality of metal layers are disposed in rows and columns to form the circuit pattern. An additional metal layer is formed along an edge of at least one surface of the ceramic substrate to be disposed at the edge of the metal layer. In addition, the distance between the metal layers may be the same as that between the metal layer and the additional metal layer. Accordingly, dimension precision may be improved by reducing a variation of a circuit pattern in an etching process for forming a circuit, a bonding property of a semiconductor chip may be enhanced by reducing a temperature variation in thermal treatment of a lead ash layer for mounding the semiconductor chip, and bending of a substrate occurring due to a difference in the coefficient of thermal expansion between a metal and a ceramic may be reduced or artificially controlled.
    • 提供了金属结合陶瓷基板。 陶瓷基板具有通过在其表面上接合金属层而形成的电路图案。 多个金属层以行和列布置以形成电路图案。 沿着陶瓷基板的至少一个表面的边缘形成另外的金属层,以设置在金属层的边缘。 此外,金属层之间的距离可以与金属层和附加金属层之间的距离相同。 因此,通过减少用于形成电路的蚀刻工艺中的电路图案的变化,可以提高尺寸精度,通过降低用于堆焊的铅灰层的热处理的温度变化可以提高半导体芯片的接合性能 可以减少或人为地控制由于金属和陶瓷之间的热膨胀系数的差异而发生的基板的弯曲。