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1. 发明授权

EP2788803B1 VARYING BEAM PARAMETER PRODUCT OF A LASER BEAM 有权转让
公开(公告)号：EP2788803B1
公开(公告)日：2020-05-27
申请号：EP12855735.2
申请日：2012-12-06
申请人： Lumentum Operations LLC , Amada Holdings Company Ltd.
发明人： MUENDEL, Martin, H. , KLINER, Dahv
IPC分类号： G02B6/32 , B23K26/06 , B23K26/073 , G02B6/42

2. 发明授权

EP2962779B1 PUNCH DIE 有权
公开(公告)号：EP2962779B1
公开(公告)日：2019-11-13
申请号：EP14757159.0
申请日：2014-02-19
申请人： Amada Holdings Company Ltd.
发明人： ENDO, Shigeru , NAKAI, Hiroshi
IPC分类号： B21D28/34 , B21D28/36

3. 发明公开

EP3208898A4 SEMICONDUCTOR LASER OSCILLATOR 审中-公开
公开(公告)号：EP3208898A4
公开(公告)日：2018-06-20
申请号：EP15851517
申请日：2015-10-13
申请人： AMADA HOLDINGS COMPANY LTD , LUMENTUM OPERATIONS LLC
发明人： USUDA KAORI , OGATA MINORU
IPC分类号： H01S5/068 , B23K26/00 , B23K26/70 , H01S5/00 , H01S5/022 , H01S5/042 , H01S5/0683 , H01S5/14 , H01S5/40
CPC分类号： H01S5/0427 , B23K26/00 , B23K26/702 , H01S3/131 , H01S5/005 , H01S5/0071 , H01S5/02252 , H01S5/02423 , H01S5/042 , H01S5/0617 , H01S5/0683 , H01S5/141 , H01S5/4012 , H01S5/4018 , H01S5/4025 , H01S5/4062 , H01S5/4087
摘要： A semiconductor laser oscillator (11) includes a diode unit (11u) configured from a plurality of banks, in which one bank is configured from a plurality of laser diodes connected in series. The diode unit (11u) includes a wavelength locking mechanism for locking to a plurality of wavelengths. The semiconductor laser oscillator (11) includes a controller (114) configured to control input currents to the laser diodes of each of the plurality of banks individually in correspondence to a characteristic of a wavelength locking efficiency, and to control an output of the diode unit (11u) as a whole to a required output.

4. 发明公开

EP3112040A4 PRESS BRAKE 有权转让
公开(公告)号：EP3112040A4
公开(公告)日：2017-11-29
申请号：EP15754509
申请日：2015-02-12
申请人： AMADA HOLDINGS COMPANY LTD
发明人： KURIHARA MASAKI , NISHIYAMA MASAHIRO
IPC分类号： B21D5/02
CPC分类号： B21D5/0272
摘要： A press brake has a lower table (9) arranged at lower part of left and right side frames (5L, 5R), an upper table (7) arranged at upper part of the side frames (5L, 5R) and facing the lower table (9), one of the upper and lower tables (7, 9) serving as a ram to be moved vertically, and left and right vertical driving units (11L, 11R) arranged on the side frames (5L, 5R), respectively, to move the ram vertically. Strain detecting sensors (15A, 15B, 15C, 15D) are arranged on inner and outer side faces, respectively, of each of the left and right side frames (5L, 5R), to detect strain of the side frames (5L, 5R) in such a way as to cancel horizontal deflection of the side frames and detect vertical deflection thereof.

5. 发明公开

EP3075485A4 LASER MACHINING METHOD AND LASER MACHINING MACHINE 有权
标题翻译： LASERBEARBEITUNGSVERFAHREN UND LASERBEARBEITUNGSMASCHINE
公开(公告)号：EP3075485A4
公开(公告)日：2017-09-06
申请号：EP14865811
申请日：2014-11-07
申请人： AMADA HOLDINGS COMPANY LTD
发明人： IMAYA SHOICHI , YAMAIZUMI YOUHEI
IPC分类号： B23K26/382 , B23K26/08 , B23K26/142 , B23K26/16 , B23K26/38 , B23Q7/00 , G05B19/18
CPC分类号： B23K26/388 , B23K26/0876 , B23K26/142 , B23K26/16 , B23K26/38 , B23K26/389 , B23Q7/006 , G05B19/182 , G05B2219/36199 , G05B2219/45041
摘要： In a laser processing method for carrying out hole-forming on a plate-shaped workpiece (W), [A] a hole is formed by laser-cutting the workpiece along an outline of the hole (1) to be formed, [B] a laser processing head (31) is moved with respect to the workpiece after forming the hole, and [C] a cutout piece (7) inside the outline of the hole is dropped off by moving the laser processing head while jetting assist gas from the laser processing head to the cutout piece inside the outline. According to the laser processing method, the cutout piece generated when carrying out hole-forming by laser processing can be prevented from getting stuck in a hole.
摘要翻译：在用于在板状工件（W）上进行孔加工的激光加工方法中，[A]通过沿着要形成的孔（1）的轮廓激光切割工件来形成孔，[B] 在形成孔后，使激光加工头（31）相对于被加工物移动，通过使激光加工头移动，同时从该加工头喷出辅助气体，从而使孔的轮廓内的切断片（7）激光加工头到轮廓内的切割片。根据激光加工方法，可以防止在通过激光加工进行孔加工时产生的切割片卡在孔中。

6. 发明公开

EP3210715A1 LASER CUTTING PROCESSING METHOD, CONTROL DEVICE IN LASER CUTTING PROCESSING MACHINE, AND PROGRAMMING DEVICE 有权转让
标题翻译：激光切割加工方法，激光切割加工机中的控制装置及编程装置
公开(公告)号：EP3210715A1
公开(公告)日：2017-08-30
申请号：EP15852755.6
申请日：2015-10-13
申请人： Amada Holdings Company Ltd.
发明人： MASUDA, Kenji
IPC分类号： B23K26/38 , B23K26/00 , G05B19/4155 , G05B19/416
CPC分类号： B23K26/00 , B23K26/38 , B23K2201/18 , G05B19/4155 , G05B19/416
摘要： At a time of carrying out a laser cutting processing in a direction intersecting with a processing line (L) at which the laser cutting processing for a work (W) has been carried out, a laser cutting speed (V) is decelerated before a laser beam (LB) reaches the processing line (L) at an initial laser cutting speed (V), and the laser cutting speed (V) is accelerated when an axial center of the laser beam (LB) is positioned within a prescribed range in vicinity of a central position of the processing line (L), and the laser cutting speed (V) is returned to the initial laser cutting speed (V), in vicinity of a position at which the axial center of the laser beam (LB) crosses the processing line (L). Also, when the axial center of the laser beam (LB) and the central position of the processing line (L) almost coincide, the laser output (P) is made to be almost zero.
摘要翻译：在与进行工件（W）的激光切割加工的加工线（L）交叉的方向上进行激光切割加工时，激光切割速度（V）在激光光束（LB）以初始激光切割速度（V）到达加工线（L），并且当激光束（LB）的轴心位于附近的规定范围内时加速激光切割速度（V）在激光束（LB）的轴心相交的位置附近，激光切割速度（V）恢复到初始激光切割速度（V）处理线（L）。而且，当激光束（LB）的轴心和加工线（L）的中心位置几乎一致时，激光输出（P）几乎为零。

7. 发明公开

EP3210683A1 REPLACEMENT METHOD FOR ATTACHING AND DETACHING MOLD FOR PRESS BRAKE AND MOLD ACCOMMODATING DEVICE 有权
标题翻译：压力机制动装置及模具调节装置装卸模具的更换方法
公开(公告)号：EP3210683A1
公开(公告)日：2017-08-30
申请号：EP15852179.9
申请日：2015-07-03
申请人： Amada Holdings Company Ltd.
发明人： SATO, Masaaki
IPC分类号： B21D5/02 , B21D37/04
CPC分类号： B21D5/0254 , B21D5/02 , B21D37/04 , B21D37/145 , Y10T483/1731
摘要： A tool storage device (1) is disposed on a side of a press brake (3). In the tool storage device (1), a lower tool holder (105) is lifted up from lower tool holder support members (33L, 33R), is moved forward or backward, and both end sides in a left-and-right direction of the lower tool holder (105) are lowered after being passed through recessed portions (117) formed on the lower tool holder support members (33L, 33R) (step (a)). The lowered lower tool holder (105) is conveyed forward, and is positioned to a same height as a height of a lower tool mounting portion (11) in a lower table (13) (step (b)). The lower tool (103) held in the lower tool holder (105) is transferred to the lower tool mounting portion (11) by a tool replacement device (19L), and is mounted on the lower table (13) (step (c)). Reverse operations in order of step (c), step (b), and step (a) are performed, and the lower tool (103) mounted on the lower table (13) is returned into the tool storage device (1) (step (d)).
摘要翻译：工具储存装置（1）设置在压弯机（3）的一侧。在该工具收纳装置（1）中，下工具保持器（105）从下工具保持器支承构件（33L，33R）上抬起，向前或向后移动，并且沿左右方向的两个端侧下工具架105在通过形成在下工具架支撑构件33L，33R上的凹部117后下降（步骤（a））。下降的下部工具架105向前方输送，定位于与下部工作台13的下部工具安装部11的高度相同的高度（工序（b））。通过工具更换装置19L将保持在下部工具夹具105中的下部工具103转移到下部工具安装部11上，并安装在下部工作台13上（步骤c））。进行步骤（c），步骤（b）和步骤（a）的反向操作，并将安装在下台（13）上的下工具（103）返回到工具存储装置（1）中（d））。

8. 发明授权

EP3141330B1 WELDING MACHINE AND CONTROL METHOD THEREFOR 有权
公开(公告)号：EP3141330B1
公开(公告)日：2024-04-24
申请号：EP15789826.3
申请日：2015-01-15
IPC分类号： B23K26/21 , B23K26/02 , B23K26/04 , B23K26/03 , B23K26/042 , G05B19/402 , G06T7/13 , G06T7/00
CPC分类号： B23K26/02 , B23K26/04 , B23K26/21 , B25J9/1684 , G05B19/4083 , G05B2219/3756320130101 , G05B2219/4510420130101 , G05B2219/470520130101

9. 发明公开

EP3656481A1 TOOL/HAND STORING DEVICE, AND TOOL REPLACING METHOD BY ROBOT AND CONTROL DEVICE THEREOF 有权转让
公开(公告)号：EP3656481A1
公开(公告)日：2020-05-27
申请号：EP20151720.8
申请日：2013-04-10
申请人： Amada Holdings Company Ltd.
发明人： Sato, Masaaki
IPC分类号： B21D5/02 , B21D37/04 , B30B15/28
摘要： It is intended to simplify a configuration of the entire tool storing device and save an installation space by storing the punch and the die together, to reduce time for tool replacement, and to enable rapid and easy tool replacement by the bending robot by storing not only the tool made of the punch and the die but also the hand for the robot together.
In a tool storing device 2 handling a tool mounting stocker in which a punch P and a die D of a press brake 1 are mounted in one stocker with rear surfaces facing each other, each of the stockers S1 to S8 is supported on both sides by endless belts 8, 9 having one driving shaft, and the endless belts 8, 9 are circulated so that each of the supported stockers S1 to S8 does not protrude to a worker S side, whereby a position of a path line PL of the appropriate one of the stockers S1 to S8 can be freely positioned at a position of the path line PL of a tool holder 30, 31 on the press brake 1 side.

10. 发明授权

EP3064308B1 LASER PROCESSING MACHINE 有权
公开(公告)号：EP3064308B1
公开(公告)日：2019-08-21
申请号：EP14857259.7
申请日：2014-10-09
申请人： Amada Holdings Company Ltd.
发明人： HAJI, Shigeyuki , HIRASAWA, Taisuke
IPC分类号： B23K26/70 , B23K26/00 , B23K26/10 , B23K37/02 , B23K37/04 , B23K26/02 , B23K26/08 , B23K26/38 , B23K101/18

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