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81. 发明公开

EP0614080A2 Apparatus for recognizing the shape of a semiconductor wafer 失效
标题翻译：一种用于检测半导体晶片的形状。
公开(公告)号：EP0614080A2
公开(公告)日：1994-09-07
申请号：EP94301426.6
申请日：1994-02-28
申请人： TOKYO SEIMITSU CO.,LTD.
发明人： Nishida, Tetsuro, c/o Tokyo Seimitsu Co., Ltd.
IPC分类号： G01N21/88 , H01L21/00
CPC分类号： H01L21/681
摘要： The present invention provides an apparatus for recognizing the shape of a semiconductor wafer, capable of stably achieving accurate shape recognition without being affected by a circuit pattern formed on the semiconductor wafer. The shape recognizing apparatus in accordance with the present invention comprises an illuminating means (1) for illuminating a semiconductor wafer (100), an image pickup means (3) for picking up an image of the semiconductor wafer (100) and providing video signals representing the image, disposed so that specular light reflected by the semiconductor wafer (100) will not fall thereon, and a shape recognizing means (6) which processes the video signals to recognize the shape of the semiconductor wafer (100), a first polarizing means (7) is disposed on a light path along which the illuminating light emitted by the illuminating means (1) travels, and a second polarizing means (8) is placed on a path along which reflected light from the semiconductor wafer (100) travels toward the image pickup means (3).

82. 发明公开

EP0597637A1 System and method for automated positioning of a substrate in a processing chamber 失效
标题翻译：系统和Verfahrenfürautomatische定位在einem Prozessraum的底层。
公开(公告)号：EP0597637A1
公开(公告)日：1994-05-18
申请号：EP93308849.4
申请日：1993-11-05
申请人： APPLIED MATERIALS, INC.
发明人： Shmookler, Simon , Weinberg, Andrew G. , McGrath, Martin J.
IPC分类号： H01L21/00
CPC分类号： H01L21/67259 , G05B2219/36405 , G05B2219/37283 , G05B2219/37608 , G05B2219/45031 , G05B2219/49299 , G05B2219/50151 , H01L21/681
摘要： The disclosure relates to a processing apparatus having a central transfer chamber (2); a plurality of peripheral chambers (3a, 3b) positioned around the periphery of said central transfer chamber; and a micro-processor controlled wafer transfer robot (4) disposed in said transfer chamber and having a wafer support (4a) for loading, moving and unloading wafer to and from said peripheral chambers. The wafer support is moved within said central transfer chamber generally along an arcuate path between the peripheral chambers. Reference signals are generated indicative of the position of a wafer support reference point (4c) by a sensor array (6, 8) having at least two sensors mounted along an axis generally transverse to the arcuate path which are triggered by the leading and trailing edges of the moving wafer as it passes to develop corresponding wafer position signals from which a wafer position reference point can be determined. The micro-processor (12) receiving wafer support reference signals and wafer position signals, calculates the location of the wafer relative to the wafer support, and controls movement of the the wafer support to a corresponding offset position relative to a preselected location (65a, 65b) in a peripheral chamber so as to position the wafer accurately at the preselected location in one of the peripheral chambers (3a, 3b).
摘要翻译：本公开涉及一种具有中央传送室（2）的处理设备; 位于所述中央传送室的周围的多个周边室（3a，3b）; 以及设置在所述传送室中的微处理器控制的晶片传送机器人（4），并且具有用于将晶片装载到所述外围室中并从所述外围室移出和移出晶片支撑件（4a）。晶片支撑件通常沿着周边室之间的弧形路径在所述中央传送室内移动。通过传感器阵列（6,8）产生指示晶片支撑参考点（4c）的位置的参考信号，传感器阵列（6,8）具有沿着大致横向于弧形路径的轴线安装的至少两个传感器，传感器阵列由前缘和后缘移动的晶片通过以形成相应的晶片位置信号，从晶片位置信号可以确定晶片位置参考点。接收晶片支撑参考信号和晶片位置信号的微处理器（12）计算晶片相对于晶片支撑件的位置，并且控制晶片支撑件相对于预选位置（65a， 65b），以便将晶片准确地定位在一个外围室（3a，3b）中的预选位置。

83. 发明公开

EP0582295A2 Articulating endoscopic surgical apparatus 有权
标题翻译： Endoskopisches chirurgiches Gelenkwerkzeug。
公开(公告)号：EP0582295A2
公开(公告)日：1994-02-09
申请号：EP93112520.7
申请日：1993-08-04
申请人： United States Surgical Corporation
发明人： Nicholas, David A. , Aranyi, Ernest , Zvenyatsky, Boris , Matula, Paul A. , Remiszewski, Stanley H. , Green, David T. , Bolanos, Henry
IPC分类号： A61B17/28 , A61B17/02
CPC分类号： A61B17/29 , A61B17/0218 , A61B18/1445 , A61B2017/2929 , H01L21/67092 , H01L21/67282 , H01L21/681 , H01L21/78 , H01L2924/0002 , H01L2924/00
摘要： A surgical instrument 10 is provided for use in endoscopic or laparoscopic procedures. The instrument includes a handle portion 12 an endoscopic portion 18 extending from the handle portion, an articulating section 22 pivotably connected 24 to a distal end portion 26 of the endoscopic portion, and a retractor assembly 28 operatively associated with the articulating section. Structure 114, 116 is provided for manipulating the articulating section relative to the longitudinal axis of the endoscopic portion within an angular degree of rotation. An injection port 858 (fig 34) may also be provided to deliver fluids through the endoscopic portion to the operative site.
摘要翻译：提供外科器械10用于内窥镜或腹腔镜手术。仪器包括手柄部分12，从手柄部分延伸的内窥镜部分18，可枢转地连接到内窥镜部分的远端部分26的关节部分22和与关节部分可操作地相关联的牵开器组件28。结构114,116用于在角度旋转角度内相对于内窥镜部分的纵向轴线操纵铰接部分。还可以提供注射口858（图34）以将流体通过内窥镜部分输送到手术部位。

84. 发明公开

EP0569011A1 Semiconductor chip mounting method and apparatus 失效
标题翻译： Verfahren zur Montierung eines Halbleiterchips und Anordnung。
公开(公告)号：EP0569011A1
公开(公告)日：1993-11-10
申请号：EP93107357.1
申请日：1993-05-06
申请人： SUMITOMO ELECTRIC INDUSTRIES, LIMITED
发明人： Nishiguchi, Masanori, c/o Yokohama Works of
IPC分类号： H05K13/04 , H01L21/00
CPC分类号： H01L24/81 , H01L21/681 , H01L2224/75 , H01L2224/75743 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/10329 , H01L2924/12042 , H01L2924/3511 , H05K13/08 , Y10T29/49131 , Y10T156/1089 , H01L2924/00
摘要： The three-dimensional shape of the surface of a board (12) is measured, and the parallel degree between the board (12) and a semiconductor chip (10) is adjusted on the basis of the measurement result. A board mounting means (13) and a semiconductor chip holding means (11) are moved close to each other, and the semiconductor chip (10) is mounted on the board (12).
摘要翻译：测量板（12）的表面的三维形状，并且基于测量结果来调整板（12）和半导体芯片（10）之间的平行度。板安装装置（13）和半导体芯片保持装置（11）彼此靠近移动，半导体芯片（10）安装在板（12）上。

85. 发明授权

EP0272853B1 Method and apparatus for automated reading of vernier patterns 失效
标题翻译：自动阅读VERNIER PATTERNS的方法和装置
公开(公告)号：EP0272853B1
公开(公告)日：1993-04-14
申请号：EP87310918.5
申请日：1987-12-11
申请人： AT&T Corp.
发明人： Kuyel, Birol
IPC分类号： G03F7/20
CPC分类号： G03F7/70633 , H01L21/681

86. 发明公开

EP0434643A3 Quantitative assessment of the geometrical distortion suffered by the profile of a semiconductor wafer 失效
标题翻译：由半导体波形轮廓引起的几何失真的定量评估
公开(公告)号：EP0434643A3
公开(公告)日：1993-02-10
申请号：EP90830599.8
申请日：1990-12-18
申请人： SGS-THOMSON MICROELECTRONICS S.r.l.
发明人： Barlocchi, Gabriele , Ghironi, Fabrizio
IPC分类号： H01L21/66 , G01B5/28 , G01B5/30
CPC分类号： H01L21/681 , G01B7/28 , H01L22/12
摘要： A method for the quantitative assessment of the degree of geometrical deformation undergone by a surface profile of a wafer following the formation of a conformal surface layer employs a simple mechanical profilometer, whose stylus is run over a target morphological detail comprising at least two mutually parallel ridges or reliefs which rise above the plane of the surface of the wafer for a height of between 0.1 and 0.5 µm, and which enclose between them a depression of a width of between 2 and 4 µm, in order to determine the elevation of the bottom of the valley between the two ridges relative to the plane of the surface of the wafer from which the ridges rise following the formation of one or more similar surface layers. The vertical measurement of the elevation undergone by the bottom of the valley in itself represents a quantitative index of the vertical and horizontal geometrical deformation undergone by the details of the surface profile of the wafer. In order to determine characteristics of automatic alignability by a particular apparatus employing said target details for automatic alignment, it is possible to establish a maximum value for said distortion index, determined as above, above which the automatic alignment capability is lost.

87. 发明公开

EP0434643A2 Quantitative assessment of the geometrical distortion suffered by the profile of a semiconductor wafer 失效
标题翻译：引起的半导体晶片的轮廓的几何偏差的定量评价。
公开(公告)号：EP0434643A2
公开(公告)日：1991-06-26
申请号：EP90830599.8
申请日：1990-12-18
申请人： SGS-THOMSON MICROELECTRONICS S.r.l.
发明人： Barlocchi, Gabriele , Ghironi, Fabrizio
IPC分类号： H01L21/66 , G01B5/28 , G01B5/30
CPC分类号： H01L21/681 , G01B7/28 , H01L22/12
摘要： A method for the quantitative assessment of the degree of geometrical deformation undergone by a surface profile of a wafer following the formation of a conformal surface layer employs a simple mechanical profilometer, whose stylus is run over a target morphological detail comprising at least two mutually parallel ridges or reliefs which rise above the plane of the surface of the wafer for a height of between 0.1 and 0.5 µm, and which enclose between them a depression of a width of between 2 and 4 µm, in order to determine the elevation of the bottom of the valley between the two ridges relative to the plane of the surface of the wafer from which the ridges rise following the formation of one or more similar surface layers. The vertical measurement of the elevation undergone by the bottom of the valley in itself represents a quantitative index of the vertical and horizontal geometrical deformation undergone by the details of the surface profile of the wafer. In order to determine characteristics of automatic alignability by a particular apparatus employing said target details for automatic alignment, it is possible to establish a maximum value for said distortion index, determined as above, above which the automatic alignment capability is lost.
摘要翻译：一种用于通过一个晶片接着一个共形的表面层的形成的表面轮廓经历几何变形的程度的定量评价方法采用一个简单的机械轮廓仪，运行在目标形态细节，其包括至少两个相互平行的脊部谁的触针或浮雕哪个上升晶片为0.1和0.5之间微米的高度的表面的平面的上方，并且在它们之间包围的2和4微米之间的宽度的凹陷，以确定性矿的仰角相对于从中脊上升继一个或多个类似的表面层形成在晶片的表面的平面中的两个脊之间的谷的底部。通过在本身谷底经受的标高的垂直测量darstellt由晶片的表面轮廓的细节经受的垂直和水平的几何变形的定量指标。为了由特定装置采用用于自动对准所述目标的信息自动对准能力确定性矿的特性，有可能建立如上开采上述失真指数的，确定性的最大值，高于该自动对准能力丧失。

88. 发明公开

EP0363525A1 Verfahren zur zweidimensionalen Lage- und Orientierungserkennung von vorher bekannten Körpern 有权
标题翻译：一种用于先前已知的机构的二维位置和方位检测方法。
公开(公告)号：EP0363525A1
公开(公告)日：1990-04-18
申请号：EP88117265.4
申请日：1988-10-17
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Brendes, Martin, Dipl.-Ing. , Doemens, Günter, Dr. Ing. , Mengel, Peter, Dr. rer. nat.
IPC分类号： G06F15/70 , H01L21/00 , G01B11/00
CPC分类号： G06K9/32 , G01B11/00 , G06T7/73 , H01L21/681
摘要： Die Mustererkennung im industriellen Bereich nutzt großteils dreidimensionale Bildauswerterverfahren. Um einfache, im speziellen ebene Erkennungsaufgaben bezüglich der Lage- und Orientierung von in der Form bekannten Körpern (1) auszuführen, wird ebenfalls auf dreidimensionale aufgenommene Bilddaten zurückgegriffen. Durch die vorhandene Einschränkung der Freiheitsgrade müssen jedoch lediglich zwei Koordinaten einer Ebene und ein Drehwinkel φ, der eine Drehung des bekannten Körpers (1) innerhalb der Ebene kennzeichnet, als Variable behandelt werden. Die Schnittbildung mit einem Volumenprimitiv (2), im speziellen einem Kreiszylinder, liefert Schnittlinien (3), die als Vergleichskriterien zwischen einem Meßobjekt und einer Referenzlage zu verwenden sind. Die Schnittlinien (3) sind in ihrer Form konstant und werden nur in Abhängigkeit vom Drehwinkel φ beschrieben.
摘要翻译：在工业界图案识别采用的大部分三维图像成就分析过程。为了进行相对于所述对象的位置和取向简单，爱尤其平面识别任务（1），其形式是已知的，办法是同样三维记录的图像数据制成。由于自由度的通行限制，但是，有必要只有两个平面的坐标和旋转披，其平面内表征已知的对象（1）的旋转的一个角度当作变量。与原始卷（2），爱尤其圆柱体的交点，产生交叉点（3），其将被用作测量对象和参考位置之间的比较的标准的线条。交叉点（3）的线的形状是恒定的，仅作为旋转披的角度的函数说明。

89. 发明公开

EP0326425A3 Positioning mechanism and method 失效
标题翻译：定位机制
公开(公告)号：EP0326425A3
公开(公告)日：1989-12-20
申请号：EP89300838.3
申请日：1989-01-27
申请人： CANON KABUSHIKI KAISHA
发明人： Mizusawa, Nobutoshi , Tanaka, Yutaka , Ebinuma, Ryuichi
IPC分类号： H01L21/68 , H01L21/00
CPC分类号： G03F7/70691 , H01L21/681
摘要： A positioning device includes a movable table supported by a rectilinear guide mechanism or rotary mechanism, the movable table being moved by a driving mechanism so as to position a member, to be conveyed, placed on the movable table, with respect to a predetermined site. After the member being conveyed is conveyed to the predetermined site, the conveyed member is contacted intimately to a stationary table which provides a reference with respect to the attitude of the conveyed member, such that the attitude correction of the conveyed member is attained.

90. 发明公开

EP0312046A2 Apparatus and method for inspecting defect of mounted component with slit light 失效
标题翻译：装置和用于在固定部件的缺陷检查，使用狭缝光方法。
公开(公告)号：EP0312046A2
公开(公告)日：1989-04-19
申请号：EP88117015.3
申请日：1988-10-13
申请人： HITACHI, LTD.
发明人： Takagi, Yuji 211 Hachimanyama-apartment , Katsuta, Daisuke , Hata, Seiji
IPC分类号： G01N21/88 , G01B11/02 , G01R31/28 , G06F15/70
CPC分类号： H05K13/08 , G01R31/2806 , G01R31/308 , G01R31/309 , H01L21/681
摘要： Light projectors for slit lights are so arranged that at least two slit lines (72) developed by projecting the slit lights on a chip component (9) or the like obliquely thereto intersect each other, and the slit lines (72) are imaged from above the component (9) or the like by TV cameras (1) so as to extend horizontally in the corresponding images. The shapes of the slit lines (72) in the images are analyzed by an image processor (8, 53, 71), to detect the state change of the chip component (9) or the like, such as the misplacement thereof. Further, if necessary, in order to enhance the contrast of the pattern of the slit line (72), the slit light is projected by a stroboscopic lamp (52) within the exposure time of the Tv camera (1), for a short time interval which is not longer than the exposure time.
摘要翻译：用于狭缝灯的光投影仪被布置并通过投影上的芯片部件（9）或类似物倾斜地相交海誓山盟，并且切割线（72）的狭缝灯开发至少两个切割线（72）从上面成像由电视摄像机的部件（9）或类似物（1），以便在相应的图像水平地延伸。在图像中的切割线（72）的形状由图像处理器（8，53，71）进行分析，以检测所述芯片部件的状态变化（9）或类似物，：诸如其错位。另外，如果需要，为了提高切割线（72）的图案的对比度，狭缝光被由TV摄像机（1）的曝光时间内的频闪灯（52）伸出，在短时间内间隔所有这一切并不比曝光时间更长。

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