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81. 发明公开

EP2138168A1 AGENT FOR ORAL ADMINISTRATION AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译： MITTEL ZUR ORALEN VERABREICHUNG UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP2138168A1
公开(公告)日：2009-12-30
申请号：EP08720926.8
申请日：2008-02-27
申请人： Lintec Corporation
发明人： SUGIURA, Yusaku , YANAGIMOTO, Kaisuke , SUZUKI, Eiji
IPC分类号： A61K9/70 , A61J3/07 , A61K9/00
CPC分类号： A61K9/0056 , A61J3/078 , A61K9/7007 , Y10T156/1052
摘要： Film-like orally administered medications are provided which are less likely to be attached to the oral mucous membrane upon intake and can be easily detached therefrom even if attached thereto. A film-like orally administered medication (1) includes at least a medical-agent-containing layer (11). Convex portions are formed on at least one surface of the orally administered medication (1). The convex portions have at least one type of shape selected from among tapers, columns, hemispheres, and frustums. The medical-agent-containing layer includes a medical agent and a base substance.
摘要翻译：提供薄膜状的口服药物，其在吸入时不太可能附着于口腔粘膜，并且即使附着在其上也可容易地从其中脱离。膜状口服药物（1）至少包含含药剂层（11）。在口服药物（1）的至少一个表面上形成凸部。凸部具有从锥形，立柱，半球和平截头体中选出的至少一种形状。含药剂层包括药剂和碱性物质。

82. 发明公开

EP2088179A8 RELEASABLE ADHESIVE SHEET 审中-公开
公开(公告)号：EP2088179A8
公开(公告)日：2009-10-07
申请号：EP07832781.4
申请日：2007-11-29
申请人： Lintec Corporation
发明人： TANAKA, Atsuhiro , SUZUKI, Tomomi , HAYAKAWA, Fumio , KUBOTA, Naoki , IKEDA, Katsuhiko
IPC分类号： C09J7/02 , C09J123/22 , C09J133/06 , C09J183/07
CPC分类号： C09J133/04 , C09J7/381 , C09J7/383 , C09J7/385 , C09J7/403 , C09J123/22 , C09J2203/306 , C09J2421/00 , C09J2433/00 , C09J2483/00 , Y10T428/24612
摘要： Provided is a releasable pressure sensitive adhesive sheet, which is mainly used for a coating film for an automobile, and which is applicable to a coating film with insufficient curing immediately after drying. Specifically provided is a releasable pressure sensitive adhesive sheet for a curable coating film, which has a pressure sensitive adhesive layer on one face of a front substrate, in which a face of the pressure sensitive adhesive layer out of contact with the front substrate has a rolling circle arithmetic mean waviness (Wea) specified in JIS B0610 of 0.30 µm or less.

83. 发明授权

EP1855277B1 Optical recording medium-producing sheet and optical recording medium and methods of producing the same 有权
标题翻译：板用于制造光学记录介质，光学记录介质及其制造方法
公开(公告)号：EP1855277B1
公开(公告)日：2009-09-02
申请号：EP07251935.8
申请日：2007-05-10
申请人： Lintec Corporation
发明人： Ito, Masaharu c/o Lintec Corporation , Hongo, Yuki c/o Lintec Corporation , Orui, Tomoo c/o Lintec Corporation
IPC分类号： G11B7/26 , G11B7/24 , G11B7/256
CPC分类号： G11B7/261 , G11B7/256

84. 发明公开

EP2091073A1 LASER DICING SHEET AND METHOD FOR MANUFACTURING CHIP BODY 有权
标题翻译： LASERZERTEILUNG UNTER VERWENDUNG EINER KLEBEFOLIE
公开(公告)号：EP2091073A1
公开(公告)日：2009-08-19
申请号：EP07832745.9
申请日：2007-11-29
申请人： Lintec Corporation
发明人： WAKAYAMA, Yoji , SATO, Yosuke , TAYA, Naoki
IPC分类号： H01L21/301 , C09J7/02 , C09J201/00
CPC分类号： B23K26/18 , B23K26/40 , B23K2203/50 , C09J7/25 , C09J2203/326 , C09J2475/006 , H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/68331 , H01L2221/68336 , H01L2221/68381
摘要： An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table.
A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.
摘要翻译：本发明的目的是提供一种激光切割片，其能够防止激光束切割切割片，卡盘台的损坏和切割片与卡盘台的融合。根据本发明的激光切割片包括含有聚氨酯丙烯酸酯的基材; 以及在其一个表面上形成的粘合剂层。

85. 发明公开

EP2080219A1 CHIP PICKUP METHOD AND CHIP PICKUP APPARATUS 审中-公开
标题翻译： CHIP摄像处理芯片拾取装置
公开(公告)号：EP2080219A1
公开(公告)日：2009-07-22
申请号：EP07829745.4
申请日：2007-10-12
申请人： Lintec Corporation
发明人： WATANABE, Kenichi , SEGAWA, Takeshi , FUJIMOTO, Hironobu
IPC分类号： H01L21/67 , H01L21/301 , H01L21/52
CPC分类号： H01L21/67132 , H01L21/6838
摘要： [PROBLEMS] To provide a pickup method and a pickup apparatus wherein pushing up of a chip is not required and a force for holding a chip which is not picked up is not varied as pickup progresses. [MEANS FOR SOLVING PROBLEMS] A method is provided for picking up a chip (13) from a fixed jig (3) to which the chip (13) is fixed. The fixed jig (3) consists of a jig base (30) having a plurality of protrusions (36) on one side and a sidewall (35) of substantially the same height as that of the protrusion (36) at the outer circumference of the one side, and an adhesion layer (31) laminated on the surface of the jig base (30) having the protrusions (36) and bonded on the upper surface of the sidewall (35). A section space (37) is formed on the surface of the jig base (30) having the protrusions by the adhesion layer (31), the protrusions (36) and the sidewall (35), and at least one through hole (38) penetrating the outside and the section space (37) is provided in the jig base (30). The pickup method comprises a step for fixing a chip, a step for deforming the adhesion layer (31) by sucking air in the section space (37) through the through hole (38), and a step for picking up the chip (13) completely from the adhesion layer (31) by sucking the chip (13) from the upper surface side of the chip (13) by means of a suction collet (70).

86. 发明公开

EP2065454A1 ADHESIVE SHEET FOR MARKING 审中-公开
标题翻译： HAFTFOLIEFÜRMARKIERUNG
公开(公告)号：EP2065454A1
公开(公告)日：2009-06-03
申请号：EP07828884.2
申请日：2007-09-21
申请人： Lintec Corporation
发明人： TOMINO, Tadahiro
IPC分类号： C09J7/02 , B32B27/00 , C09J201/00
CPC分类号： C09J7/29 , C09J2201/162 , C09J2475/006 , Y10T428/25 , Y10T428/265 , Y10T428/2848
摘要： A pressure sensitive adhesive sheet for marking which comprises a substrate of a non-vinyl chloride-based resin, a pressure sensitive adhesive layer disposed on one face of the substrate and a crosslinked acrylic urethane-based coating layer which comprises (A) an acrylic polyol resin modified with a polyester and having a weight-average molecular weight of 15,000 to 80,000 and (B) a polyisocyanate-based compound as the curing agent and is disposed on the other face of the substrate. The pressure sensitive adhesive sheet is a sheet using a non-vinyl chloride-based substrate which meets environmental requirements, exhibits excellent resistance to scratches, resistance to dipping into chemicals, resistance to cracks under stretching and weatherability and a desired gloss and can be advantageously used, for example, for automobiles.
摘要翻译：一种用于标记的压敏粘合片，其包含非氯乙烯类树脂的基材，设置在基材的一面上的压敏粘合剂层和交联的丙烯酸类氨基甲酸酯类涂料层，其包含（A）丙烯酸多元醇用聚酯改性的重均分子量为15,000至80,000的树脂和（B）作为固化剂的多异氰酸酯基化合物并且设置在基材的另一面上。压敏粘合片是使用满足环境要求的非氯乙烯类基材的片材，显示出优异的耐刮擦性，耐浸渍性，耐拉伸性和耐候性以及期望的光泽，并且可以有利地使用，例如汽车。

87. 发明公开

EP2063465A1 PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开
标题翻译： PROZESS ZUM HERSTELLEN EINES HALBLEITERBAUELEMENTS
公开(公告)号：EP2063465A1
公开(公告)日：2009-05-27
申请号：EP07792087.4
申请日：2007-08-07
申请人： Lintec Corporation
发明人： YAMAZAKI, Osamu , ICHIKAWA, Isao , SAIKI, Naoya
IPC分类号： H01L21/52 , H01L21/60
CPC分类号： H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/31 , H01L24/48 , H01L24/81 , H01L24/83 , H01L24/85 , H01L25/0657 , H01L2221/68327 , H01L2221/68377 , H01L2221/68381 , H01L2224/16 , H01L2224/27436 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/81801 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/181 , H01L2924/0715 , H01L2924/0675 , H01L2924/069 , H01L2924/066 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/0401 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： In a process for manufacturing a semiconductor device comprising heating a wiring board on which a chip and an uncured adhesive layer are laminated for curing the adhesive layer, the improvement includes performing a statically pressurizing step before the adhesive layer is cured, in which step the wiring board on which the chip and the uncured adhesive layer are laminated is subjected to a static pressure greater than atmospheric pressure by not less than 0.05 MPa. According to the invention, voids are easily eliminated irrespective of a design of the wiring board, and the adhesive is prevented from curling up on the chip.
摘要翻译：在制造半导体装置的方法中，包括加热其上层叠有芯片和未固化的粘合剂层的布线板以固化粘合剂层，其改进包括在粘合剂层固化之前执行静态加压步骤，其中布线将芯片和未固化的粘合剂层层压的板经受大于0.05MPa的大气压的静压。根据本发明，无论布线板的设计如何，容易消除空隙，并且防止粘合剂在芯片上卷曲。

88. 发明公开

EP1707382A3 Method for recording information into rewritable thermal label of the non-contact type 有权
标题翻译：将信息记录到可重写热敏标签非接触式的方法
公开(公告)号：EP1707382A3
公开(公告)日：2008-09-17
申请号：EP06111836.0
申请日：2006-03-28
申请人： Lintec Corporation
发明人： Utagawa, Tetsuyuki , Iwabuchi, Hiroaki , Nishikawa, Takehiko , Iino, Chisato , Noda, Naoji , Mizutani, Kaoru
IPC分类号： B41J2/32
CPC分类号： B41J2/355 , B41J2/32 , B41J2/471 , B41J2/4753
摘要： A method for recording information into a rewritable thermal label of a non-contact type by irradiation with a laser beam is provided. When a prescribed drawing is conducted by irradiation with a laser beam focused on the rewritable thermal label of a non-contact type using an optical scanning apparatus, the optical scanning apparatus is driven continuously without activating oscillation for the laser light, and the drawing is conducted by activating the oscillation for the laser light and scanning with the laser light only when a locus of a laser beam which would be emitted if the oscillation for the laser light would be active (a virtual laser beam) moves at a substantially uniform speed. Damages to the recording face of a recording medium after repeated recording and erasure of information by a non-contact method are decreased, and the recording medium can be used repeatedly 1,000 times or more.

89. 发明授权

EP1419527B1 ADHESIVE TAPE 有权
标题翻译： TAPE
公开(公告)号：EP1419527B1
公开(公告)日：2008-01-09
申请号：EP02755877.4
申请日：2002-08-08
申请人： Lintec Corporation
发明人： SUMI, Takaji , YAMAZAKI, Osamu , SUGINO, Takashi , SENOO, Hideo
IPC分类号： H01L23/00 , C09J7/02 , C08G59/42 , C08K5/00
CPC分类号： H01L21/6836 , C08G59/24 , C08G59/3218 , C08G59/4021 , C08K5/0025 , C08K5/103 , C08L2666/02 , C08L2666/04 , C09J7/22 , C09J7/35 , C09J7/38 , C09J163/00 , C09J2203/326 , C09J2463/00 , G03F7/038 , H01L2221/68327 , H01L2924/0002 , Y10T428/2852 , Y10T428/287 , Y10T428/2891 , Y10T428/31511 , H01L2924/00
摘要： An adhesive tape comprising a base and, superimposed thereon, an adhesive layer, this adhesive layer comprising an adherent component (A), an epoxy resin (B), a thermally active latent epoxy resin curing agent (C), an energy radiation polymerizable compound (D) and a photopolymerization initiator (E), wherein either or both of the epoxy resin (B) and energy radiation polymerizable compound (D) have a dicyclopentadiene skeleton in its molecule or molecules thereof. The resultant adhesive tape has an adhesive layer which provides reduced water absorption of an adhesive curing product and which enables a lowering of the elastic modulus thereof during thermocompression bonding.

90. 发明公开

EP1852906A2 Sheet to form a protective film for chips and process for producing semiconductor chips 有权
标题翻译： Folie zur Herstellung eines SchutzfilmsfürChips und HerstellungsverfahrenfürHalbleiterchips
公开(公告)号：EP1852906A2
公开(公告)日：2007-11-07
申请号：EP07016260.7
申请日：2002-03-21
申请人： Lintec Corporation
发明人： Senoo, Hideo , Sugino, Takashi , Yamazaki, Osamu
IPC分类号： H01L21/68
CPC分类号： H01L23/3164 , H01L21/6836 , H01L21/78 , H01L23/293 , H01L23/562 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/83855 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/3025 , Y10T428/14 , H01L2924/0635 , H01L2924/00 , H01L2924/3512
摘要： The present invention provides a sheet (10) to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches.
The sheet (10) to form a protective film for chips of the present invention comprises a release sheet (1) and a protective film forming layer (2) formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component.
摘要翻译：本发明提供一种片材（10），用于形成用于芯片的保护膜，其可以容易地在芯片的背面形成为高度均匀的保护膜，并且即使在芯片的背面上形成微小的划痕作为机械磨削的结果，可以消除由划痕引起的不利影响。形成本发明的片状保护膜的片材（10）包括形成在剥离片的可拆卸表面上的剥离片（1）和保护膜形成层（2），其中所述保护膜形成层包括热固性或能量射线固化组分和粘合剂聚合物组分。

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