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    • 78. 发明公开
    • METHOD FOR PRODUCING SEALED STRUCTURE AND EPOXY RESIN COMPOSITION
    • EP4088900A1
    • 2022-11-16
    • EP22723534.8
    • 2022-01-28
    • Sumitomo Bakelite Co., Ltd.
    • MATSUO, MakotoSEKI, Hidetoshi
    • B29B9/06B29C45/02B29C45/14C08L91/06C08L63/00C08K3/013
    • A method for producing an encapsulated structure, the method including:
      a step of supplying granules or powder (1) formed from an epoxy resin composition to an extruder equipped with a screw (42) and a die (5) provided at the tip of the screw (42), and heating and melting the granules or powder (1) formed from the epoxy resin composition;
      a step of extruding the molten epoxy resin composition through the die (5) having a predetermined opening shape by rotation of the screw (42);
      a step of cutting the extruded epoxy resin composition (6) into a predetermined length to obtain a tablet formed from the epoxy resin composition, where the tablet has dimensions with a diameter of equal to or more than 40 mm and equal to or less than 100 mm and a length of equal to or more than 50 mm and equal to or less than 300 mm;
      a step of transferring the tablet to a transfer molding machine having a molding mold (30) in which an object to be encapsulated is disposed; and
      a step of obtaining an encapsulated structure by encapsulating the object to be encapsulated (11, 12) in the molding mold with the epoxy resin composition by a transfer molding method of using the transfer molding machine,
      in which the epoxy resin composition includes:
      an epoxy resin,
      a curing agent,
      an inorganic filler,
      a curing accelerator, and
      a wax having a melting point of equal to or higher than 30°C and equal to or lower than 90°C.