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71. 发明公开

EP1669163A1 Method and machine for sanding wooden panels 有权
标题翻译： Verfahren und Maschine zum Schleifen von Holzplatten
公开(公告)号：EP1669163A1
公开(公告)日：2006-06-14
申请号：EP05111798.4
申请日：2005-12-07
申请人： SCM GROUP S.p.A.
发明人： Ferrari, Adriano
IPC分类号： B24B21/06 , B24B21/22 , B24B7/06 , B24B7/28 , B24B47/22 , B24B21/18 , B24B21/20
CPC分类号： B24B7/28 , B24B7/06 , B24B21/06 , B24B21/18 , B24B21/20 , B24B21/22 , B24B47/22
摘要： A method of tensioning and operating a belt is applied to a sanding machine comprising an endless abrasive belt (3) trained around an operating unit (2) equipped with an orbiting sanding platen (4) at the bottom of the unit. A roller (14) at the top of the unit (2) is supported by supports (15) and comprises rotational drive means (6). While it operates, the belt (3) is kept in the tensioned state by means (16) for lifting the roller (14), and the tensioned state holds the belt (3) against the active surface (5) of the platen (4).
The turning of the belt (3) is enabled or inhibited by the rotation or stopping of the roller (14) during the steps of changing the working part (10) of the belt (3) and of sanding the panels (1), respectively.
The kinematic coupling between the roller (14) and the belt (3) is achieved by the friction produced by the tensioning action.
摘要翻译：一种张紧和操作带的方法被施加到砂光机上，该砂光机包括在装置的底部配备有旋转砂磨台（4）的操作单元（2）的环形研磨带（3）。在单元（2）的顶部的辊（14）由支撑件（15）支撑并且包括旋转驱动装置（6）。当操作时，带（3）通过用于提升辊（14）的装置（16）保持在张紧状态，并且张紧状态将带（3）保持抵靠压板（4）的有效表面（5））。在改变带（3）的工作部分（10）和分别对面板（1）进行打磨的步骤期间，通过旋转或停止滚子（14）可以使皮带（3）转动。辊（14）和带（3）之间的运动耦合通过张紧作用产生的摩擦来实现。

72. 发明授权

EP1405696B1 Pulley assembly for the belt of a notching machine 有权
标题翻译：带槽机皮带装配
公开(公告)号：EP1405696B1
公开(公告)日：2005-09-28
申请号：EP03425644.6
申请日：2003-10-01
申请人： CML International S.p.A.
发明人： Caporusso, Alessandro
IPC分类号： B24B9/00 , B24B21/16 , B24B21/18
CPC分类号： B24B9/007 , B24B21/16 , B24B21/18

73. 发明公开

EP1469971A4 GROOVED ROLLERS FOR A LINEAR CHEMICAL MECHANICAL PLANARIZATION SYSTEM 有权
标题翻译：槽辊轧线性CMP系统
公开(公告)号：EP1469971A4
公开(公告)日：2005-01-12
申请号：EP02792494
申请日：2002-12-20
申请人： LAM RES CORP
发明人： CANGSHAN XU
IPC分类号： B24B21/04 , B24B21/18 , B24B21/20 , B24B37/26 , H01L21/304 , B24B7/22
CPC分类号： B24B37/26 , B24B21/04 , B24B21/18
摘要： In a linear chemical mechanical planarization (CMP) systems (114), a surface of each roller (160a), (160b) of a pair of rollers is disclosed which includes a first set of grooves (150a) covering a first portion of the surface of the roller where the first set of grooves (150a) has a first pitch that angles outwardly toward a first outer edge of the roller. The surface also includes a second set of grooves (150b) covering a second portion of the surface of the roller where the second set of grooves (150b) has a second pitch that angles outwardly toward a second outer edge of the roller with the second pitch angling away from the first pitch. The surface further includes a first set of lateral channels (202a) arranged along the first portion, and a second set of lateral channels (202b) arranged along the second portion. The first set of lateral channels (202a) crosses the first set of grooves (150a), and the second set of lateral channels (202b) crosses the second set of grooves (150b).

74. 发明公开

EP1268132A1 METHOD AND APPARATUS FOR FIXED-ABRASIVE SUBSTRATE MANUFACTURING AND WAFER POLISHING IN A SINGLE PROCESS PATH 审中-公开
标题翻译：设备用于生产的载体材料固定的研磨和抛光的半导体晶片在短短的一个步骤的过程
公开(公告)号：EP1268132A1
公开(公告)日：2003-01-02
申请号：EP01922770.1
申请日：2001-03-28
申请人： LAM Research Corporation
发明人： BOYD, John, M.
IPC分类号： B24B37/04 , B24B21/18 , B24D3/28 , B24D11/00 , B24D18/00
CPC分类号： B24D18/009 , B24B21/18 , B24B37/04 , B24D3/28 , B24D11/001
摘要： Methods and apparatus are provided for combining the manufacturing of a fixed-abrasive substrate and the chemical mechanical planarization of semiconductor wafers using a single process path (26). An electrostatic patterning device (58) produces an electrostatic charge of a predetermined pattern and density on a backing (52). An abrasive/binding agent container (60) deposits an abrasive/binding agent mixture on the surface of the backing (52). The mixture is attracted to the backing (52) in the pattern of the electrostatic charge. A vacuum force generator (62) removes the excess abrasive/binding agent mixture from the backing (52). An UV irradiation device (64) fixes the mixture to the backing (52). A conveyor (74) carries the fixed-abrasive substrate (54) to the CMP station (66).

75. 发明授权

EP0733437B1 Abrasive machining apparatus equipped with a device for facilitating replacement of abrasive tape 失效
标题翻译：一种磨削加工设备，配备有装置以便于磨削带变化
公开(公告)号：EP0733437B1
公开(公告)日：2001-10-17
申请号：EP96104627.3
申请日：1996-03-22
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Kiriyama, Kazuo , Tada, Hideyuki
IPC分类号： B24B19/12 , B24B21/00
CPC分类号： B24B21/18 , B24B19/12 , B24B21/004

76. 发明公开

EP1052060A2 Method for chemical mechanical planarization 审中-公开
标题翻译： Verfahren zum chemisch-mechanischen Planarisieren
公开(公告)号：EP1052060A2
公开(公告)日：2000-11-15
申请号：EP00303706.6
申请日：2000-05-03
申请人： Applied Materials, Inc.
发明人： Tietz, James T. , Li, Shijian , Birang, Manoocher , White, John M. , Rosenberg, Lawrence M. , Scales, Martin , Emami, Ramin
IPC分类号： B24B37/04 , B24B49/14 , B24B57/02 , H01L21/306
CPC分类号： B24B57/02 , B24B21/04 , B24B21/18 , B24B37/12 , B24B49/14 , B24B55/02 , H01L21/30625
摘要： A semiconductor substrate processing system for polishing a substrate that generally includes a platen (430) and a web (402) of polishing material disposed thereon. Embodiments of the system include a first fluid delivery arm (154) and a second fluid delivery arm (155) respectively adapted to dispose a first and a second polishing fluid on the polishing material. A sensor (226) produces a signal indicative of the temperature of the polishing process. In some embodiments, the step of regulating the rate of material removal may further comprise steps such as changing the temperature of a fluid circulated in a polishing head, changing the temperature of a fluid circulated in the platen and changing the chemistry of the polishing fluids. The step of sensing the indicia may include analyzing the effluent and sensing temperature.
摘要翻译：一种用于抛光基板的半导体基板处理系统，其通常包括设置在其上的抛光材料的压板（430）和网（402）。该系统的实施例包括分别适于在抛光材料上设置第一和第二抛光流体的第一流体输送臂（154）和第二流体输送臂（155）。传感器（226）产生指示抛光过程的温度的信号。在一些实施例中，调节材料去除速率的步骤还可以包括诸如改变在抛光头中循环的流体的温度，改变在压板中循环的流体的温度并改变抛光流体的化学性的步骤。感测标记的步骤可以包括分析流出物和感测温度。

77. 发明公开

EP0950467A3 Abrasive machining apparatus equipped with a device for facilitating replacement of abrasive tape 失效
标题翻译：配备有便于更换砂带的装置的研磨加工设备
公开(公告)号：EP0950467A3
公开(公告)日：1999-11-03
申请号：EP99115910.4
申请日：1996-03-22
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Kiriyama, Kazuo , Tada, Hideyuki
IPC分类号： B24B19/12 , B24B21/00
CPC分类号： B24B21/18 , B24B19/12 , B24B21/004
摘要： An apparatus for abrasive machining of a predetermined portion of a workpiece (10, W) such that an abrasive tape (T) and the workpiece are moved relative to each other while the tape is held in pressing contact with the predetermined portion of the workpiece, and such that the abrasive tape is fed in the longitudinal direction, the apparatus including a tape holding portion (22, 24, 34), and a tape cartridge (70, 300, 302) removably held by the tape holding portion and carrying the abrasive tape (T), wherein the cartridge includes a housing (90), a tape supply portion (92) disposed in the housing and accommodating an unused length of the tape such that a portion of the unused length is exposed outside the housing, a pressing member (95) attached to the housing, for pressing the portion of the unused length outside the housing onto the predetermined portion of said workpiece (10, W), and a take-up portion (94) disposed in the housing and accommodating a used length of the tape which has been used for abrasive machining of the predetermined portion of the workpiece in pressing contact therewith. The tape holding portion may include two or more tape holders each holding the tape cartridge.
摘要翻译：一种用于对工件（10，W）的预定部分进行磨削加工的装置，使得当带被保持与工件的预定部分保持挤压接触时，砂带（T）和工件相对于彼此移动，并且使得所述砂带沿纵向进给，所述设备包括带保持部分（22,24,34）以及由所述带保持部分可移除地保持并承载研磨材料的带盒（70,300,302）（T），其中所述盒包括壳体（90）;布带供应部分（92），所述布带供应部分布置在所述壳体中并容纳未使用长度的所述带，使得所述未使用长度的一部分暴露在所述壳体的外部;压制（95），其用于将未使用长度的部分外壳压在所述工件（10，W）的预定部分上;以及卷取部分（94），其设置在所述外壳中并容纳用过的具有的磁带长度已经用于与其压接的工件的预定部分的磨削加工。带保持部可以包括两个或更多个均保持带盒的带保持器。

78. 发明授权

EP0691179B1 Device to facilitate the fitting of abrasive belts to sanding machines,especially for wooden panels 失效
标题翻译：用于促进研磨带的安装到砂光机，特别是对于木制面板的装置
公开(公告)号：EP0691179B1
公开(公告)日：1998-11-11
申请号：EP95830295.2
申请日：1995-07-07
申请人： SCM GROUP AUTEC DIVISION S.p.A.
发明人： Botteghi, Gino
IPC分类号： B24B21/18
CPC分类号： B24B21/18

79. 发明公开

EP0733437A1 Abrasive machining apparatus equipped with a device for facilitating replacement of abrasive tape 失效
标题翻译：一种磨削加工设备，配备有装置以便于磨削带变化
公开(公告)号：EP0733437A1
公开(公告)日：1996-09-25
申请号：EP96104627.3
申请日：1996-03-22
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Kiriyama, Kazuo , Tada, Hideyuki
IPC分类号： B24B19/12 , B24B21/00
CPC分类号： B24B21/18 , B24B19/12 , B24B21/004
摘要： An apparatus for abrasive machining of a predetermined portion of a workpiece (10, W) such that an abrasive tape (T) and the workpiece are moved relative to each other while the tape is held in pressing contact with the predetermined portion of the workpiece, and such that the abrasive tape is fed in the longitudinal direction, the apparatus including a tape holding portion (22, 24, 34), and a tape cartridge (70, 300, 302) removably held by the tape holding portion and carrying the abrasive tape (T), wherein the cartridge includes a housing (90), a tape supply portion (92) disposed in the housing and accommodating an unused length of the tape such that a portion of the unused length is exposed outside the housing, a pressing member (95) attached to the housing, for pressing the portion of the unused length outside the housing onto the predetermined portion of said workpiece (10, W), and a take-up portion (94) disposed in the housing and accommodating a used length of the tape which has been used for abrasive machining of the predetermined portion of the workpiece in pressing contact therewith. The tape holding portion may include two or more tape holders each holding the tape cartridge.
摘要翻译：用于对工件的预定部分的磨削加工的设备（10，W）的搜索没有到砂带（T）和工件相对于彼此而磁带在按压与工件的预定部分保持接触移动时，并且这样做的砂带在沿长度方向输送，其包括砂带夹持部份（22，24，34），和一个带盒（70，300，302）由砂带夹持部份可拆卸地保持并携带该研磨装置带（T），worin盒包括设置在所述壳体中并容纳于磁带的未使用长度检查没有未使用的长度的一部分被暴露在壳体的外部的壳体（90），带供给部（92），加压构件（95）附接到所述壳体，用于按压所述壳体外的未使用长度的所述部分到所述工件（10，W）的预定部分，以及卷取部（94），在所述壳体设置，并且容纳用于其具有带的长度被用于工件的预定部分的磨削加工中与有压接。带保持部可包括两个或多个砂带夹持器各保持的带盒。

80. 发明公开

EP0434533A1 Machine de superfinition pour des arbres, notamment des arbres à cames 失效
标题翻译：机器人on on on on en en。。。。。。。。。。。。。。。
公开(公告)号：EP0434533A1
公开(公告)日：1991-06-26
申请号：EP90403620.9
申请日：1990-12-17
申请人： SOCIETE PROCEDES MACHINES SPECIALES S.P.M.S.
发明人： Pineau, Jean-Claude
IPC分类号： B24B19/12 , B24B21/18
CPC分类号： B24B21/18 , B24B19/12
摘要： Machine d'usinage de superfinition par toilage des portées d'arbres, notamment des cames ou des cames et des tourillons d'arbres à cames, les arbres étant pris entre pointes et animés d'un mouvement de rotation autour de leur axe. La machine comprend une pluralité de bras (8) montés sur deux axes (9a, 9b) d'un même support (5) de manière à pouvoir pivoter dans des plans parallèles perpendiculaires à l'axe de l'arbre (3) à usiner, une pluralité de moyens de manoeuvre (22) à force préétablie agissant chacun sur l'un desdits bras, une pluralité de bandes abrasives (11) et une pluralité de moyens (14) d'application de bande abrasive associés auxdits bras, de telle manière que chaque bras puisse pivoter en direction de l'arbre, sous l'action de son moyen de manoeuvre, et appuyer une bande abrasive avec une pression prédéterminée contre l'une des portées (4) à usiner de l'arbre.
摘要翻译：用于通过砂轮轴承表面，特别是凸轮或凸轮和凸轮轴轴颈的磨光来进行超精加工的机器，轴保持在中心之间并且围绕其轴线以旋转运动被驱动。机器包括安装在同一支撑件（5）的两个轴（9a，9b）上的多个臂（8），以便能够垂直于待加工的轴（3）的轴线的平行平面旋转，多个预定力操作装置（22），每个预定力操作装置（22）各自作用在所述臂中的一个上，多个研磨带（11）和与所述臂相关联的多个研磨带施加装置（14）每个臂可以在其操作装置的作用下在轴的方向上枢转并且以预定压力将研磨带压靠在待加工的轴承表面（4）中的一个上。

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