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61. 发明公开

EP1482547A2 Standoff/mask structure for electrical interconnect 审中-公开
标题翻译：。。。。。。。。。。。。。。。
公开(公告)号：EP1482547A2
公开(公告)日：2004-12-01
申请号：EP04012627.8
申请日：2004-05-27
申请人： Xerox Corporation
发明人： Andrews, John, R. , Gerner, Bradley, J. , Schmachtenberg, III, Richard , Slenes, Chad , Schultz, Samuel, V.
IPC分类号： H01L21/68 , H01L21/60
CPC分类号： H05K3/1225 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2224/05568 , H01L2224/05573 , H01L2224/11005 , H01L2224/1147 , H01L2224/11472 , H01L2224/11474 , H01L2224/1148 , H01L2224/13007 , H01L2224/13021 , H01L2224/13099 , H01L2224/13294 , H01L2224/133 , H01L2224/13309 , H01L2224/16013 , H01L2224/16145 , H01L2224/16227 , H01L2224/27003 , H01L2224/2711 , H01L2224/27438 , H01L2224/29006 , H01L2224/29011 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29339 , H01L2224/32013 , H01L2224/32145 , H01L2224/32225 , H01L2224/73103 , H01L2224/73203 , H01L2224/81191 , H01L2224/81801 , H01L2224/8185 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2224/83862 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H05K3/305 , H05K3/321 , H05K3/3484 , H05K3/361 , H05K2201/2036 , H05K2203/0537 , Y10T29/49126 , Y10T29/49144 , Y10T428/24843 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/0635 , H01L2924/066 , H01L2924/07025
摘要： A multi-layer standoff/mask structure including a standoff having a plurality of standoff openings and a mask having a plurality of mask openings aligned with the standoff openings. The structure is employed for forming interconnecting structures on electronic circuit structures.
摘要翻译：该结构具有附着到衬垫层的粘合隔离层。间隔孔（63）形成在衬垫层和粘合剂隔离层中。掩模粘合剂层附着到衬垫层。掩模衬垫层（75）附接到掩模粘合剂层。在掩模粘合剂层和掩模衬里层中与隔离孔对准形成掩模孔。还包括以下独立权利要求：（a）制造间隔/掩模结构的方法（b）制造互连的电路结构的方法。

62. 发明授权

EP1103021B1 SCHALTUNGSTRAGER MIT ÜBER BUSLEITUNGEN KOMMUNIZIERENDEN STEUERTEILEN 有权
标题翻译：与总线连接的传输控制组件的电路载体
公开(公告)号：EP1103021B1
公开(公告)日：2004-09-22
申请号：EP99940065.8
申请日：1999-07-27
申请人： Cherry GmbH
发明人： TÜRMER, Herbert , MILDE, Franz
IPC分类号： G05B19/10 , F24C7/08
CPC分类号： H05K1/148 , F24C7/082 , G05B19/108 , H05K1/0293 , H05K3/0052 , H05K3/225 , H05K3/361 , H05K2201/0909 , H05K2201/10189 , H05K2203/175
摘要： The invention relates to a circuit support (1) with several control elements (3a - 3d). Each of the control elements (3a - 3d) is positioned on the circuit support (1) in a spatial region (4a - 4d) which is assigned exclusively to the control element (3a - 3d) concerned. Said individual spatial regions (4a - 4d) are connected to each other via bus lines (7) which are firmly fixed to the circuit support (1). Adjacent spatial regions (4a - 4d) together with the bus line sections connecting them are configured in such a way that they each contain defined adjacent partial sections (12) along which it is possible to mechanically separate the individual spatial regions (4a - 4d) from each other without consequences for the control elements (3a - 3d) positioned thereon.

63. 发明公开

EP1434261A1 CIRCUIT DEVICE MOUNITNG METHOD AND PRESS 有权
标题翻译： VERFAHREN UND PRESSE ZUR MONTAGE EINER SCHALTUNG
公开(公告)号：EP1434261A1
公开(公告)日：2004-06-30
申请号：EP02765504.2
申请日：2002-09-12
申请人： Nikkiso Co., Ltd.
发明人： MATSUNO, Hisao, c/o NIKKISO CO., LTD. , OSUGI, Kenjiro, c/o NIKKISO CO., LTD.
IPC分类号： H01L21/60 , H05K3/32
CPC分类号： B30B15/024 , B30B5/02 , B30B15/065 , H01L24/29 , H01L24/31 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75315 , H01L2224/75317 , H01L2224/7598 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01058 , H01L2924/01082 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H05K3/323 , H05K3/361 , H05K2201/0133 , H05K2203/0278 , Y10T156/1089 , H01L2924/00 , H01L2224/0401
摘要： An anisotropic conductive film (14) and circuit elements (16) are superimposed and disposed on a substrate (10). An isotropic pressing operation is performed by a pressing mold having a flexible layer (22) on the surface to be brought into contact with the circuit elements, and simultaneously heating is performed to bond the circuit elements onto the substrate. Since the flexible layer absorbs differences in thickness of the circuit elements, the plurality of circuit elements can be pressed simultaneously. Further, since the plurality of circuit elements are simultaneously heated, it is unnecessary to consider an influence of heat on unheated adjacent circuit elements in a case where the elements are heated one by one. The isotropic pressing makes it possible to prevent the anisotropic conductive film from protruding sideways. As a result, spaces between the circuit elements can be reduced.
摘要翻译：各向异性导电膜（14）和电路元件（16）叠加并设置在基板（10）上。通过具有与电路元件接触的表面上的柔性层（22）的压模进行各向同性的加压操作，同时进行加热以将电路元件接合到基板上。由于柔性层吸收电路元件的厚度差异，所以可以同时按压多个电路元件。此外，由于多个电路元件被同时加热，因此在元件被逐个加热的情况下，不需要考虑热量对未加热的相邻电路元件的影响。各向同性按压使得可以防止各向异性导电膜侧向突出。结果，可以减少电路元件之间的空间。

64. 发明公开

EP1364788A3 Ink jet print head and method and apparatus for bonding flexible printed circuit cable for ink jet print head 审中-公开
标题翻译：喷墨打印头，用于在喷墨打印头连接的柔性印刷电路的方法和装置
公开(公告)号：EP1364788A3
公开(公告)日：2004-05-06
申请号：EP02257528.6
申请日：2002-10-30
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Kim, Jeong-seon , Cho, Seo-hyun , Son, Dae-woo , Kang, Sa-yoon , Jung, Myung-song
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： H05K3/361 , B41J2/14072 , H05K1/147 , H05K3/328 , H05K2201/0367 , H05K2201/0397 , H05K2203/0195
摘要： An ink jet print head, a method of bonding a flexible printed circuit (FPC) (60) cable for an ink jet print head, and an apparatus adopting the method are provided. In this bonding method, the bonding portion of an FPC conductor (61) is heated being pressed down on a corresponding pad (20) formed on a substrate (10) for an ink jet print head. Then, at least two pads (20) are bonded at a time. In this bonding method, an electrical defect due to pad peel-off phenomenon, which is created by an conventional tape automated bonding (TAB) method in which the conductors of an FPC cable are bonded to the pads on a substrate in a manner where one conductor is bonded to a pad at a time, is removed to increase the reliability of bonding. In addition, the bonding of a plurality of pads (20) at a time leads to a reduction in the time required for bonding.

65. 发明授权

EP0911678B1 Display device with terminals connected to a folded film substrate 有权
标题翻译：具有用于与折叠薄膜基板连接端子的显示装置
公开(公告)号：EP0911678B1
公开(公告)日：2003-12-10
申请号：EP98308666.1
申请日：1998-10-22
申请人： SEIKO INSTRUMENTS INC.
发明人： Matsuhira, Tsutomu , Suginoya, Mitsuru , Aizawa, Takamitsu
IPC分类号： G02F1/1333 , G02F1/13
CPC分类号： G02F1/13452 , H05K1/118 , H05K3/361

66. 发明公开

EP1353540A1 PRODUCTION METHOD OF CIRCUIT BOARD MODULE 有权
标题翻译：电路板模块的生产方法
公开(公告)号：EP1353540A1
公开(公告)日：2003-10-15
申请号：EP01272893.7
申请日：2001-12-27
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： SEGAWA, Shigetoshi
IPC分类号： H05K3/36
CPC分类号： H05K3/361 , H05K1/117 , H05K1/141 , H05K3/323 , H05K2201/09427 , Y10T29/49126 , Y10T156/10 , Y10T156/1089
摘要： The present invention provides a method of manufacturing a circuit board module for connecting a circuit conductor (2) of a first circuit board (1) to a circuit conductor (4) of a second circuit board (5) using at least one selected from the group consisting of an anisotropic conductive film (6), an anisotropic conductive paste and an adhesive resin, wherein a difference in a pattern width between the circuit conductor of the first circuit board and that of the second circuit board is in a range of 5 µm to 50 µm. In such a method of manufacturing a circuit board module, connection of a connecting conductor with a narrow pitch can be realized, and poor connection can be reduced, thus providing a method of manufacturing a circuit board module having higher reliability.
摘要翻译：本发明提供了一种制造电路板模块的方法，该电路板模块使用选自以下中的至少一个来连接第一电路板（1）的电路导体（2）和第二电路板（5）的电路导体（4）由各向异性导电膜（6），各向异性导电膏和粘合树脂构成的组，其中第一电路板的电路导体与第二电路板的电路导体之间的图案宽度的差异在5μm的范围内到50μm。在这种制造电路板模块的方法中，可以实现窄间距的连接导体的连接，并且可以减少连接不良，从而提供一种制造具有较高可靠性的电路板模块的方法。

67. 发明授权

EP1256144B1 VERFAHREN ZUR KONTAKTIERUNG EINER LEITERPLATTE MIT EINER AUF EINEM TRÄGER ANGEORDNETEN LEITERBAHN UND VORRICHTUNG 有权
标题翻译：方法用于接触电路板在车辆ARRANGED导体和设备
公开(公告)号：EP1256144B1
公开(公告)日：2003-10-01
申请号：EP01911408.1
申请日：2001-01-31
申请人： ROBERT BOSCH GMBH
发明人： PREISSL, Reinhold
IPC分类号： H01R12/04
CPC分类号： H01R12/57 , B60K2350/305 , H01R12/52 , H05K3/0014 , H05K3/182 , H05K3/308 , H05K3/321 , H05K3/361 , H05K3/4007 , H05K3/4015 , H05K2201/0187 , H05K2201/0367 , H05K2201/0382 , H05K2201/09118 , H05K2201/10234 , H05K2201/10242 , H05K2201/1059 , H05K2203/0195 , H05K2203/1476
摘要： Disclosed is a method which is used to simplify the contacting of printed circuit boards to a support which is preferably embodied as a cockpit module in a motor vehicle. According to the inventive method, the printed circuit board is initially connected to the conductors which are disposed on the support, whereby (preferably) various conductors arranged inside said vehicle are electroconductively connected to each other.

68. 发明公开

EP1217695A3 Flat flexible circuit interconnection 审中-公开
标题翻译：扁平电缆的电连接器系统
公开(公告)号：EP1217695A3
公开(公告)日：2003-08-13
申请号：EP01126993.3
申请日：2001-11-14
申请人： MOLEX INCORPORATED
发明人： Fuerst, Robert M. , Joshi, Prashat
IPC分类号： H01R12/10
CPC分类号： H01R12/613 , H05K1/0289 , H05K1/118 , H05K3/281 , H05K3/361 , H05K3/363 , H05K2201/09245
摘要： A system (10) and method are provided for interconnecting the generally parallel conductors (18) of a pair of flat circuits (12,14) out of sequential order relative to each other. The system includes a pair of flat circuits (12,14) each having a plurality of generally parallel conductors (18) covered by a dielectric film (20). A pattern of windows (24) are formed in the film (24) of each circuit (12,14) to expose the conductors at different locations longitudinally thereof. The patterns of windows (24) of the two circuits are coincident with each other when the flat circuits are overlapped with each other and with the circuits oriented so that the conductors of the circuits are at angles relative to each other. The conductors (18) of the respective circuits (12,14) are electrically connected through the windows.

69. 发明公开

EP1333461A2 Method of manufacturing plasma display device 有权
标题翻译： Verfahren zur Herstellung einer Plasma-Anzeigevorrichtung
公开(公告)号：EP1333461A2
公开(公告)日：2003-08-06
申请号：EP03002126.5
申请日：2003-01-30
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： Furukawa, Hiroyuki
IPC分类号： H01J9/24
CPC分类号： H01J11/12 , H01J11/46 , H05K1/147 , H05K3/305 , H05K3/361
摘要： Provided is a method of manufacturing a plasma display device. The device comprises a plasma display panel that has a plurality of terminals formed on each of at least two sides (38,39;40,41) thereof, and a plurality of circuit boards (27;28) to be connected to the terminals. In application of adhesive to the front faces and back faces of the circuit boards (27;28), the adhesive is applied to one of the sides (38;39) having the circuit boards (28) disposed at smaller intervals, and then to one of the sides (40;41) having the circuit boards (27) disposed at larger intervals. Alternatively, the adhesive is applied to a long side (38;39) of the plasma display panel, and then to a short side (40;41) thereof.
摘要翻译：提供了一种制造等离子体显示装置的方法。该装置包括等离子体显示面板，其具有形成在其至少两侧（38,39; 40,41）中的每一个上的多个端子以及要连接到端子的多个电路板（27; 28）。在将粘合剂施加到电路板（27; 28）的前表面和背面时，将粘合剂施加到具有以更小间隔设置的电路板（28）的一侧（38; 39），然后到具有以较大间隔设置的电路板（27）的侧面（40; 41）中的一个。或者，将粘合剂施加到等离子体显示面板的长边（38; 39），然后到其短边（40; 41）。

70. 发明公开

EP1323589A1 Heizungs- oder Klimaanlage, insbesondere für ein Kraftfahrzeug, mit einer Folienleiterbahn 有权
标题翻译：加热或空调，尤其用于机动车，具有柔性扁平电缆
公开(公告)号：EP1323589A1
公开(公告)日：2003-07-02
申请号：EP02027538.4
申请日：2002-12-09
申请人： Behr GmbH & Co.
发明人： Denk, Walter , Ghussein, Luay, Dipl.-Ing. , Kirschner, Volker, Dipl.-Ing.(FH) , Kreuzer, Walter , Liermann, Andreas, Dipl.Ing.(FH) , Lochmahr, Karl, Dipl.-Ing.(FH) , Otto, Jürgen,Dipl.-Ing.(FH) , Pubrl, Harald,Dipl.-Ing.(FH) , Schmadl, Dieter, Dipl.-Ing.(FH) , Voigt, Klaus, Dipl.-Ing.(FH) , Waibel, Klaus
IPC分类号： B60R16/02 , B60H1/00
CPC分类号： B60H1/00557 , B60H1/00514 , H05K1/118 , H05K3/361
摘要： Die Erfindung betrifft eine Heizungs- oder Klimaanlage für ein Kraftfahrzeug mit einem Luftführungsgehäuse, in und/oder an dem Komponenten der Anlage angeordnet sind, wobei die Komponenten Gebläse, gegebenenfalls Filter, wenigstens einen Wärmetauscher, Luftstromsteuerelemente, Aktoren und gegebenenfalls Sensoren umfassen und mit einer Steuerelektronik, in die von einer Bedieneinheit Steuersignale eingebbar sind und die Steuerelektronik über elektrische Leitungen mit wenigstens einigen der Komponenten der Anlage verbunden ist, wobei zumindest ein Teil der elektrischen Leitungen durch eine oder mehrere Folienleiterbahnen gebildet wird.
摘要翻译：加热器或空调单元在至少一部分用来与控制电子设备的连接导体的路径的集成了带状电缆。因此，该带状电缆包括一个或多个引线。

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