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61. 发明公开

EP1284530A3 Optical module 审中-公开
标题翻译：光模块
公开(公告)号：EP1284530A3
公开(公告)日：2003-11-26
申请号：EP02014002.6
申请日：2002-06-26
申请人： The Furukawa Electric Co., Ltd.
发明人： Nasu, Hideyuki , Nomura, Takehiko
IPC分类号： H01S5/022
CPC分类号： G02B6/4277 , G02B6/4201 , G02B6/4251 , G02B6/4257 , G02B6/4271 , G02B6/4274 , G02B6/4286 , H01L2224/48091 , H01L2224/48137 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： An optical module includes a light-emitting devicel that outputs light, a sub-mount 2 made of a dielectric substance having thermal conductivity on which the light-emitting device is placed, a base made 3 of a metal on which the sub-mount is placed, a cooling device 4 on which the base is placed and which cools heat generated by the light-emitting device, and a power supply line 5 that is provided on the sub-mount and supplies the light-emitting device with a high-frequency modulating signal for driving the light-emitting device 1, where capacitances Cs and Cp of the sub-mount and the cooling device are connected in series to an equivalent circuit formed between the light-emitting device and the ground.
摘要翻译：光模块包括：输出光的发光元件;由具有导热性的电介质构成的子架2，其上放置发光器件;基座3，其上设置有子座放置有冷却装置4，在所述冷却装置4上放置所述基座并冷却由所述发光装置产生的热量;以及电源线5，设置在所述子座上并向所述发光装置供应高频调制用于驱动发光器件1的信号，其中子座架和冷却装置的电容Cs和Cp串联连接到形成在发光器件和地之间的等效电路。

62. 发明公开

EP1079484A3 Semiconductor laser device, semiconductor laser module, and fiber module 审中-公开
标题翻译： Halbleiterlaservorrichtung，Halbleiterlasermodul und Fasermodul
公开(公告)号：EP1079484A3
公开(公告)日：2002-10-30
申请号：EP00117345.9
申请日：2000-08-22
申请人： Mitsui Chemicals, Inc.
发明人： Okubo, Atsushi, c/o Mitsui Chemicals Inc. , Yamada, Yoshikazu, c/o Mitsui Chemicals Inc.
IPC分类号： H01S5/022 , G02B6/30
CPC分类号： H01S5/02284 , G02B6/4267 , G02B6/428 , G02B6/4286 , G02B6/4296 , H01L2224/48091 , H01L2224/48137 , H01L2224/48472 , H01L2224/49175 , H01S5/0021 , H01S5/02248 , H01S5/02272 , H01S5/02492 , H01S5/0683 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor laser device comprises a semiconductor laser chip comprising a semiconductor substrate and a compound semiconductor layer formed thereon, a base substrate formed of CuW, having a side on which the semiconductor laser chip is fixed in a junction-down fashion, and an intermediate section disposed on the side of the base substrate, comprising an electrically insulating portion and an electrically conductive portion insulated from the base substrate by the electrically insulating portion, the semiconductor substrate of the semiconductor laser chip and the electrically conductive portion being electrically interconnected. The semiconductor device of this construction is capable of outputting high power with high reliability over a long span.
摘要翻译：半导体激光器件包括半导体激光器芯片，其包括半导体衬底和形成在其上的化合物半导体层，由CuW形成的基底，其半导体激光器芯片以结合方式固定在其上;以及中间部分所述半导体激光芯片的所述半导体基板与所述导电部分电连接，所述基板包括电绝缘部分和通过所述电绝缘部分与所述基底基板绝缘的导电部分。这种结构的半导体器件能够在长跨度上输出高可靠性的高功率。

63. 发明公开

EP1221186A1 OPTOELECTRONIC DEVICE INCORPORATING A TUNABLE LASER AND METHOD OF CHARACTERISATION THEREOF 审中-公开
标题翻译：一个可调谐激光器含光学装置与方法研究表征
公开(公告)号：EP1221186A1
公开(公告)日：2002-07-10
申请号：EP00968155.2
申请日：2000-10-16
申请人： Tsunami Photonics Limited
发明人： O'DOWD, Ronan F.
IPC分类号： H01S5/022 , H01S5/0687 , G02B6/12 , G02B6/28 , G02B6/26
CPC分类号： H01S5/0687 , G02B6/42 , G02B6/4215 , G02B6/4243 , G02B6/4269 , G02B6/4271 , G02B6/4285 , G02B6/4286 , G02B2006/12107 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/0617
摘要： A hybridised optoelectronic device (1) having a multi-section laser (100) and a wavelength measuring component (110) such that stable operational characteristics remote from mode boundaries (141, 142) may be determined and stored in a look-up table. A fast means of characterising the device using sampling techniques is also disclosed. The device may incorporate a frequency-locking component (120) to enable the laser to emit radiation at predetermined frequencies.

64. 发明公开

EP0917263A4 COMPOSITE MODULE FOR OPTICAL FIBER AMPLIFIER 失效
标题翻译： ZUSAMMUSTRETZTES MODULFÜRFASEROPTICHCHENVERSTÄRKER
公开(公告)号：EP0917263A4
公开(公告)日：2002-06-05
申请号：EP98901563
申请日：1998-02-09
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MIYOKAWA JUN , TAKASE TAIJIRO
IPC分类号： G02B6/42 , H01S3/042 , H01S3/06 , H01S3/067 , H01S3/10 , H01S5/022 , H01S3/18
CPC分类号： H01S3/094003 , G02B6/4215 , G02B6/4263 , G02B6/4271 , G02B6/4272 , G02B6/4273 , G02B6/4286 , H01S3/005 , H01S3/09415
摘要： A composite module for an optical fiber amplifier which is capable of efficiently radiating heat generated at a Peltier element to outside of the module, in which an interference film filter component and a board are fixed to each other rigidly for a long period of time, and in which lateral offset of an optical axis between an LD element and the interference film filter component is further reduced. A portion of a board (1) where a Peltier element (12) is fixed in a high thermal conductive portion made of Cu or a Cu-W alloy. At least a part of a base (11) is a low thermal conductive portion made of a Fe-Ni-Co alloy, a Fe-Ni alloy, a Fe-Ni-Cr alloy, a Fe-Cr alloy, or stainless steel. An interference film filter component (5) is fixed to the low thermal conductive portion of the base (11) by laser beam welding.
摘要翻译：本发明提供了一种用于光纤放大器的集成模块，其能够通过珀耳帖元件有效地扩散由模块外部的LD元件产生的热量，具有将WDM滤光器部件和基板牢固地固定更长时间并进一步减少LD元件与WDM滤波器部件之间的光束轴失配，即使在减法器出现变形的情况下也是如此。固定有珀尔帖元件（12）的基板（1）的部分是由Cu或Cu-W基合金构成的高导热部分，并将基底（11）的至少一部分制成由Fe-Ni-Co系合金，Fe-Ni系合金，Fe-Ni-Cr系合金，Fe-Cr系合金或不锈钢构成的低热传导率部，WDM过滤器部件（5）固定在通过激光束焊接底座（11）的低导热部分。

65. 发明公开

EP1169757A1 VCSEL POWER MONITORING SYSTEM USING PLASTIC ENCAPSULATION TECHNIQUES 审中-公开
标题翻译： VCSEL功率监测系统采用塑料封装技术
公开(公告)号：EP1169757A1
公开(公告)日：2002-01-09
申请号：EP00918208.0
申请日：2000-03-20
申请人： Cielo Communications, Inc.
发明人： SCOTT, Jeffrey, W. , IAACSON, T., Dale , ABIDI, Tehseen
IPC分类号： H01S5/022 , G02B6/42
CPC分类号： H01S5/02296 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/4244 , G02B6/4246 , G02B6/4253 , G02B6/4263 , G02B6/4286 , H01L33/44 , H01L33/56 , H01S5/02228 , H01S5/02284 , H01S5/0683 , H01S5/183
摘要： A plastic encapsulated VCSEL and power monitoring system wherein the VCSEL and photodetector are encapsulated in an optoelectronic plastic molding material. A tilted window, with a partially reflective coating on one side, is attached to the top of the plastic molding material using an epoxy with a refractive index that substantially matches the molding material. The plastic encapsulated VCSEL and photodetector may be manufactured at low cost using standard molding techniques. The high optical quality of the tilted window and partially reflective coating provide an excellent surface to reflect a portion of the optical beam back to the photodetector. Also, the tilted window substantially reduces inconsistent power monitoring due to beam divergence and walk-off.
摘要翻译：一种塑料封装的VCSEL和功率监测系统，其中VCSEL和光电探测器被封装在光电塑料模制材料中。使用折射率基本上与模制材料相匹配的环氧树脂将倾斜的窗口（在一侧具有部分反射涂层）附接到塑料模制材料的顶部。使用标准模制技术可以低成本制造塑料封装的VCSEL和光电检测器。倾斜窗口和部分反射涂层的高光学质量提供了极好的表面，以将光束的一部分反射回光电探测器。而且，倾斜的窗口大大减少了由于波束发散和离散造成的不一致的功率监视。

66. 发明公开

EP1047970A1 DIFFRACTIVE VERTICAL CAVITY SURFACE EMITTING LASER POWER MONITOR AND SYSTEM 有权
标题翻译：衍射成绩监控设备美国的制度与垂直谐振腔表面发射激光器
公开(公告)号：EP1047970A1
公开(公告)日：2000-11-02
申请号：EP99945268.3
申请日：1999-08-31
申请人： Digital Optics Corporation
发明人： TE KOLSTE, Robert , KATHMAN, Alan, D. , JOHNSON, Eric, G. , FELDMAN, Michael, R.
IPC分类号： G02B6/26
CPC分类号： H01S5/02296 , G02B6/4201 , G02B6/4206 , G02B6/424 , G02B6/4245 , G02B6/4251 , G02B6/4255 , G02B6/4259 , G02B6/4263 , G02B6/4286 , H01S5/0683 , H01S5/183
摘要： A power monitor for a light emitter emitting from a single face creates a monitor beam by deflecting a portion of the application beam and further manipulating the monitor beam to allow more efficient use of the monitor beam. For example, the monitor beam may be collimated to allow an increase in spacing between the light emitter and a detector for sensing the monitor beam. Alternatively or additionally, the monitor beam may be focused to allow use of a smaller detector and of a smaller percentage of the application beam. The diffractive element deflecting the beam may be either transmissive or reflective. The additionally manipulation of the monitor beam may be provided by the same diffractive element which deflects the beam, which is particularly useful when the diffractive element is reflective, and/or by additional optical elements.

67. 发明公开

EP1041419A1 Optical semiconductor module with fiber connection and its assembly process 审中-公开
标题翻译： Optisches Halbleitermodul mit Fiberanschluss und Verfahren zu seinem Zusammenbau
公开(公告)号：EP1041419A1
公开(公告)日：2000-10-04
申请号：EP00106943.4
申请日：2000-03-31
申请人： NEC CORPORATION
发明人： Kato, Hidenori, c/o NEC Corporation
IPC分类号： G02B6/42
CPC分类号： G02B6/4201 , G02B6/4202 , G02B6/4239 , G02B6/4243 , G02B6/4248 , G02B6/4251 , G02B6/4259 , G02B6/4265 , G02B6/4286
摘要： An optical semiconductor module has a housing (8, 9) having an opening (10), and an optical semiconductor element (1) is set in the housing (8, 9). An optical fiber (43) that penetrates the opening (10) is disposed. The optical fiber (43) is allowed to perform optical transmission between the optical semiconductor element (1) and elements arranged outside the housing (8, g). The opening (10) is sealed with a photo-curing resin (204), and a transparent plate (7) is arranged between the photo-curing resin (204) and the outside of the housing (8, 9).
摘要翻译：光学半导体模块具有具有开口（10）的壳体（8,9），并且在壳体（8,9）中设置光学半导体元件（1）。设置穿过开口（10）的光纤（43）。允许光纤（43）在光学半导体元件（1）和布置在壳体外部的元件（8g）之间执行光学传输。开口（10）用光固化树脂（204）密封，并且在光固化树脂（204）和壳体（8,9）的外侧之间设置有透明板（7）。

68. 发明公开

EP0943943A3 Optical module substrate, optical module, and method of manufacturing optical module 审中-公开
标题翻译：的光学模块，所述光学模块的模块基板及其制造方法
公开(公告)号：EP0943943A3
公开(公告)日：2000-09-06
申请号：EP99105301.8
申请日：1999-03-15
申请人： Sumitomo Electric Industries, Ltd.
发明人： Yoneyama, Shunichi Yokohama W. Sumitomo Elec. Ind. , Nakanishi, Hiromi Osaka W. of Sumitomo Elec. Ind.
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , G02B6/421 , G02B6/4224 , G02B6/4243 , G02B6/4245 , G02B6/4265 , G02B6/4286 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： The optical module comprises a substrate consisting of single member (25). This substrate can mount an optical fiber, a ferrule, and a semiconductor optical device. The substrate has first (25e), second (25f), and third (25g) regions successively arranged along a predetermined axis. The substrate also has a ferrule support groove, an optical fiber support groove, and a device mount portion. The ferrule support groove (7) is formed in the first region and extends along the predetermined axis. The optical fiber support groove is formed in the second region and extends along the predetermined axis. The device mount portion is formed in the third region. The semiconductor optical device is provided to be optically coupled to the optical fiber.

69. 发明公开

EP0987801A3 Verfahren zur Herstellung eines optoelektronischen Bauelements 有权
标题翻译：一种用于制造光电子器件的过程
公开(公告)号：EP0987801A3
公开(公告)日：2000-06-07
申请号：EP99118259.3
申请日：1999-09-14
申请人： SIEMENS AKTIENGESELLSCHAFT
发明人： Auracher, Franz, Dr. , Gramann, Wolfgang
IPC分类号： H01S5/02 , G02B6/42
CPC分类号： G02B6/422 , G02B6/4214 , G02B6/4238 , G02B6/424 , G02B6/4244 , G02B6/4259 , G02B6/4273 , G02B6/4286 , H01S5/02248 , H01S5/02284 , H01S5/02292 , H01S5/0683
摘要： Bei einem Verfahren zur Herstellung eines optoelektronischen Bauelements wird ein Laserchip (1) auf einer mit metallischen Strukturen (13) versehenen Halbleiterscheibe (2) befestigt. Danach wird zu jedem Laserchip (1) eine den Strahlengang des Laserchips (1) umlenkende Linsenkoppeloptik (9) auf der Halbleiterscheibe (2) positioniert. Der Laserchip (1) wird betrieben und der Abstand zwischen dem Laserchip (1) und der Linsenkoppeloptik (9) wird so variiert und eingestellt, daß eine vorgegebene Strahlbedingung hinsichtlich der Lage der optischen Bildebene (15) erfüllt ist.

70. 发明公开

EP0864893A3 Packaging platform, optical module using the platform, and methods for producing the platform and the module 失效
标题翻译：安装平台，在该安装平台的光学模块，以及用于使平台的方法，并且所述模块
公开(公告)号：EP0864893A3
公开(公告)日：1999-09-22
申请号：EP98104508.1
申请日：1998-03-12
申请人： Nippon Telegraph and Telephone Corporation
发明人： Amano, Michiyuki, c/o Nippon Teleg. and Tel. Corp. , Tono, Shunichi, c/o Nippon Teleg. and Tel. Corp. , Sato, Hirotsugu, c/o Nippon Teleg. and Tel. Corp. , Tamura, Yasuaki, c/o Nippon Teleg. and Tel. Corp. , Shuto, Yoshito, c/o Nippon Teleg. and Tel. Corp. , Yokoyama, Kenji, c/o Nippon Teleg. and Tel. Corp. , Kozawaguchi, Haruki, c/o Nippon Teleg.& Tel. Corp. , Hikita, Makoto, c/o Nippon Telegraph & Tel. Corp. , Yoshimura, Ryoko, c/o Nippon Teleg. & Tel. Corp. , Tomaru, Satoru, c/o Nippon Teleg. & Tel. Corp. , Imamura, Saburo, c/o Nippon Teleg. & Tel. Corp. , Hashimoto, Toshikazu, c/o Nippon T. & T. Corp. , Yamada, Yasufumi, c/o Nippon T. & T. Corp. , Kato, Kuniharu, c/o Nippon T. & T. Corp. , Yanagisawa, Masahiro, c/o Nippon T. & T. Corp. , Sugita, Akio, c/o Nippon Teleg. & Tel. Corp.
IPC分类号： G02B6/42
CPC分类号： G02B6/423 , G02B6/30 , G02B6/421 , G02B6/4232 , G02B6/424 , G02B6/4244 , G02B6/4249 , G02B6/4253 , G02B6/4265 , G02B6/4274 , G02B6/4286 , G02B6/4292
摘要： A packaging platform (11, 21, 33, 61) for optically coupling one or more optical waveguides of one or more optical components (15, 22, 31, 65) having the optical waveguide to one or more optical fibers is provided with a reference structure portion (31-10a, 31-10b, 33-10a, 33-10b, 33-6, 80-10a, 80-10c, 80-10d) for the horizontal and vertical positioning of the optical component (15, 22, 31, 65) and one or more fiber positioning portions (33-1) for inserting and holding the optical fiber and positioning the optical fiber at a position where the optical fiber is optically connected to the optical waveguide; whereby the packaging platform (11, 21, 33, 61) and an optical module using the platform are provided which can simplify all alignment steps for optical coupling, electrical connection and sealing in the coupling of the optical component and the optical fiber.

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