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    • 61. 发明公开
    • ERGONOMIC MOLD MANIPULATOR
    • 符合人体工程学的FORM机械臂
    • EP1015211A1
    • 2000-07-05
    • EP98918497.3
    • 1998-04-20
    • Textron Automotive Company Inc.
    • SWENSON, Harold, W.
    • B29C33/20B29C44/12
    • B29C33/72B29C33/26B29C33/30
    • A mold press (10) includes an upper mold carrier (12) mounted to slide up and down along an upright mold press frame (14) and to rotate about a horizontal rotation axis (23). The mold press frame (14) is supported on a mold press base (18) to tip forward and aft about a horizontal upper mold pivot axis (20) disposed parallel to and below the rotation axis (23). A lower mold carrier (16) is supported on the mold press base (18) below the upper mold carrier (12) and above the upper mold pivot axis (20). The lower mold carrier (16) includes an lower mold mounting plate (62) that is pivotally supported on the mold press base (18) for tipping motion along a hinged edge about a lower mold pivot axis (68) that lies parallel to and below the rotation axis (23) and above the upper mold pivot axis (20). An electronic, motion controller may be programmed to coordinate the reciprocating, tipping and rotating motions to accomodate a variety of mold/retainer configurations. The motion controller may also be programmed to move the upper mold carrier (12) and an attached upper mold portion into ergonomically optimum positions that meet different operators needs.
    • 64. 发明公开
    • Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same
    • 相同的清洗剂用于模具用于制造半导体装置和方法,用于使用清洁模具的
    • EP0847843A1
    • 1998-06-17
    • EP97110511.9
    • 1997-06-26
    • NITTO DENKO CORPORATION
    • Takashima, Kouichi
    • B29C33/72C11D17/04
    • C11D11/0047B29C33/72B29C33/722C11D3/28C11D7/3281C11D11/0041C11D17/049
    • A cleaning composition for a mold for molding a semiconductor device comprising an unvulcanized rubber, a cleaning agent, and water in an amount of from 1 to 30% by weight based on the total amount of the cleaning composition.
      The cleaning composition is preferably used as a sheet form comprising the cleaning composition itself, wherein a plurality of straight cuts are formed on the surface of the sheet in a definite direction in parallel at an definite interval for enabling folding of the sheet and at least one cutting cut may be formed on the surface such that the cutting cut crosses perpendicularly to the plural cuts.
      The cleaning sheet is very effective to remove soiled material on the inside surfaces of a mold formed by repeatedly molding semiconductor devices using a thermosetting resin composition.
    • 对于用于半导体器件基于所述清洁组合物的总量中的1〜30%的量的未硫化橡胶,清洁剂和水的包含按重量计成型模具的清洁组合物。 所述清洁组合物优选用作片材,其包含清洁组合物本身,worin直线切割的多元性并行处形成在片材的表面上以一定的方向在一定的间隔,用于使片材的折叠和至少一个 切割切口可以形成寻求DASS模切切口的表面上垂直交叉的多个切口。 清扫用片材是非常有效的通过使用热固性树脂组合物反复模塑半导体器件形成的模具的内表面上除去污染的材料。