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51. 发明公开

EP0169294A3 A resin printing plate and preparation thereof 失效
标题翻译：树脂印刷板及其制备
公开(公告)号：EP0169294A3
公开(公告)日：1987-05-20
申请号：EP85100023
申请日：1985-01-02
申请人： Asahi Kasei Kogyo Kabushiki Kaisha
发明人： Uchida, Seiichi
IPC分类号： G03F07/20 , G03F07/02 , G03F01/00 , G03F07/16
CPC分类号： G03F7/2022 , G03F1/50 , G03F7/16 , G03F7/2012 , G03F7/2032 , Y10T428/14 , Y10T428/15 , Y10T428/24 , Y10T428/24322 , Y10T428/24736
摘要： A printing plate consisting of a base portion, a mount portion and a relief portion made of a liquid resin which is sensitive to and curable by irradiated activating rays, the plate being prepared by use of a masking sheet formed with a transmitting pattern having a contour corresponding to and slightly larger than the pattern of a negative film, a semi-transmitting pattern positioned outside the transmitting pattern and having a large contour for transmitting irradiated activating rays upon attenuation, and a blocking surface positioned outside the semi-transmitting pattern and having an effect to block the activating rays to an extent not to cure the liquid resin layer.

52. 发明公开

EP0164620A3 Positively acting light-sensitive coating solution 有权转让
标题翻译：最新动态感光涂料溶液
公开(公告)号：EP0164620A3
公开(公告)日：1987-04-15
申请号：EP85106264
申请日：1985-05-22
申请人： AMERICAN HOECHST CORPORATION
发明人： Pampalone, Thomas R.
IPC分类号： G03F07/08 , G03F07/16
CPC分类号： G03F7/0226

53. 发明公开

EP0154198A3 A method and an apparatus for applying an emulsion onto a screen-printing plate 有权
标题翻译：一种将乳液施加到丝网印刷板上的方法和装置
公开(公告)号：EP0154198A3
公开(公告)日：1987-01-28
申请号：EP85101388
申请日：1985-02-09
申请人： Tokai Shoji Co., Ltd.
发明人： Shirataki, Kenji
IPC分类号： G03F07/12 , G03F07/16
CPC分类号： G03F7/16 , G03F7/12 , Y10T156/1705 , Y10T156/179
摘要： A method and an apparatus for applying an emulsion onto a screen-printing plate are disclosed, in which an emulsion film having thereon an applying emulsion of a predeermined thickness is prepared, which film is closely contacted with the screen-printing plate on its printing side for applying the emulsion thereon. Preferably, a penetrable agent is supplied for facilitating the release and adhesion of the applying emulsion.

54. 发明公开

EP0136534A3 Method of forming a large surface area integrated circuit 有权
标题翻译：形成大面积整合电路的方法
公开(公告)号：EP0136534A3
公开(公告)日：1987-01-07
申请号：EP84110227
申请日：1984-08-28
申请人： ENERGY CONVERSION DEVICES, INC.
发明人： Vijan, Meera
IPC分类号： G03F07/16
CPC分类号： G03F7/16 , H05K1/0393 , H05K3/0091 , H05K3/0097
摘要： Disclosed is a method of forming a large area electronic element, e.g., a large area integrated circuit, having at least one dimension in excess of three inches, by forming a film of photoresist separate from a surface to be etched, and thereafter depositing the film of photoresist on the surface to be etched. The deposited photoresist film is then exposed to actinic radiation and developed, and the uncovered, underlying surface is thereafter etched.

55. 发明公开

EP0080363A3 Stencil making and utilization methods, apparatus and articles 失效
标题翻译：制造和利用方法，装置和文章
公开(公告)号：EP0080363A3
公开(公告)日：1983-11-30
申请号：EP82306218
申请日：1982-11-23
申请人： Rauch, Georg
发明人： Rauch, Georg
IPC分类号： G03F07/12 , G03F07/16
CPC分类号： G03F7/12
摘要： Methods and apparatus for preparing a foraminous stencil blank (25) for subsequent selective hardening of first and second individually soluble but jointly hardenable substances (13, 14) thereon impregnate the foraminous stencil blank (25) only with the first substance (13) as between the first and second substances (13, 14), until such time as selective hardening of the admixed first and second substances on or in the stencil blank is desired (see Fig. 3). Preferably, the second substance (14) is stored separately from the impregnated stencil blank (13, 25), and is applied to the impregnated stencil blank for admixture with the first substance (13) only immediately prior to a desired selective hardening of the admixed first and second substances.
摘要翻译：用于制备多孔模版坯料（25）的方法和装置用于随后选择性硬化第一和第二单独可溶但可共同硬化的物质（13,14），仅在第一物质（13）之间浸渍有孔模板坯料（25）第一和第二物质（13,14），直到期望混合的第一和第二物质在模版坯料上或模板坯料中的选择性硬化。优选地，第二物质（14）与浸渍的模版坯料（13,25），并且仅在混合的第一和第二物质的期望的选择性硬化之前立即施加到浸渍的模版坯料上以与第一物质（13）混合。

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