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51. 发明公开

EP1807726A2 OPTICAL SCANNING SYSTEM COMPRISING THERMALLY COMPENSATED LIGHT EMITTING DIODE 失效转让
标题翻译：具有温度调节的发光二极管照明系统
公开(公告)号：EP1807726A2
公开(公告)日：2007-07-18
申请号：EP05849156.4
申请日：2005-11-03
申请人： Applera Corporation
发明人： OLDHAM, Mark, F. , MIRCHANDANI, Vinod, L. , HOSHIZAKI, Jon, A. , KING, Howard, G. , SLUIS, Johannes, P. , BOEGE, Steven, J.
IPC分类号： G02B26/10 , G01N21/64 , G05D23/00 , F21K7/00 , G01N33/53 , H05B33/08
CPC分类号： G01N21/64 , F21K9/00 , F21K9/64 , F21V29/54 , F21V29/677 , F21V29/74 , F21Y2115/10 , G01J3/0286 , G01J3/10 , G01N21/645 , G01N21/6452 , G01N2021/6439 , G01N2201/06113 , G01N2201/062 , G01N2201/0638 , G01N2201/1211 , G05D23/1919 , G05D23/20
摘要： Methods and optical systems for thermally compensated optical scanning of a target sample. The present invention also relates to methods and systems for performing sample assays, and for producing and measuring optical responses and signatures.

52. 发明公开

EP1704752A2 THERMAL MANAGEMENT METHODS AND APPARATUS FOR LIGHTING DEVICES 审中-公开
标题翻译：方法和散热管理照明设备装置
公开(公告)号：EP1704752A2
公开(公告)日：2006-09-27
申请号：EP04813843.2
申请日：2004-12-13
申请人： Color Kinetics Incorporated
发明人： NORTRUP, Edward , MUELLER, George, G. , MORGAN, Frederick, M. , LYS, Ihor, A. , DOWLING, Kevin, J.
IPC分类号： H05B1/00
CPC分类号： F21V29/763 , F21K9/23 , F21S45/43 , F21S45/46 , F21S45/47 , F21V19/001 , F21V23/0457 , F21V29/54 , F21V29/67 , F21V29/677 , F21V29/713 , F21V29/773 , F21V29/83 , F21W2131/205 , F21Y2105/10 , F21Y2115/10 , H01L2224/48091 , H01L2224/73265 , H01R13/6683 , H01R33/945 , H05B33/086 , Y10S362/80 , H01L2924/00014
摘要： A lighting system (7500) comprises an electrical facility for powering a LED light. The LED light comprises LEDs (7112), a circuit board (7114) and a back plate (7110) The back plate (7110) is thermally associated with a thermally conductive housing (7518) and an inner surface (7518) of a thermal transfer facility (7502) is thermally associated with the thermally conductive housing (7512) when the LED light is associated with the electrical facility.
摘要翻译：电气设备的照明系统（7500）包括用于LED灯供电。 LED灯包括发光二极管（7112），电路板（7114）和背板（7110）的后板（7110）的热与导热壳体（7518）相关联，并且在一个热传递的帧内表面（7518）设施（7502）与所述热导热壳体（7512）当LED的光被与所述电气设备有关的相关联。

53. 发明公开

EP1158354A1 DISCHARGE LAMP AND LAMP DEVICE 审中-公开
标题翻译： ENTLADUNGSLAMPE
公开(公告)号：EP1158354A1
公开(公告)日：2001-11-28
申请号：EP00979037.9
申请日：2000-11-30
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KAI, Makoto , HORIUCHI, Makoto , TAKEDA, Mamoru , SEKI, Tomoyuki , ICHIBAKASE, Tsuyoshi
IPC分类号： G03B21/16 , F21S2/00 , H01J61/52 , H01J61/36
CPC分类号： F21V29/74 , F21V29/004 , F21V29/54 , F21V29/56 , F21V29/71 , F21V29/76 , F21V29/89 , G03B21/2026 , G03F7/70016 , H01J61/025 , H01J61/32 , H01J61/34 , H01J61/366 , H01J61/523 , H01J61/82 , H01J61/822 , H01J61/86
摘要： The present invention relates to a lamp device using a high-pressure vapor discharge lamp, particularly to an improvement for controlling the influence of the generation of heat, which accompanies an increase in lamp power and a reduction in the size of a reflector. A lamp device of the present invention comprises a discharge lamp having an arc tube enclosing luminescent materials and having a pair of opposing electrodes disposed therein and a pair of sealed portions extending from the arc tube; a reflector which reflects light radiated by the discharge lamp; a transparent member covering an open end of the reflector and accommodating the discharge lamp in a space between the transparent member and the reflector; and means for preventing an excessive temperature rise wherein the temperature rise of welded parts of wiring members electrically connected to the electrodes of the discharge lamp is restricted.
摘要翻译：本发明涉及一种使用高压蒸汽放电灯的灯装置，特别涉及伴随着灯功率的增加和反射器尺寸的减小的用于控制发热的影响的改进。本发明的灯装置包括放电灯，其具有包围发光材料的电弧管，并且具有设置在其中的一对相对电极和从电弧管延伸的一对密封部分; 反射器，其反射由放电灯辐射的光; 透明构件，其覆盖所述反射器的开口端并将所述放电灯容纳在所述透明构件和所述反射器之间的空间中; 以及用于防止过度温度上升的装置，其中电连接到放电灯的电极的布线构件的焊接部分的温度升高受到限制。

54. 发明授权

EP2938924B1 A LIGHT EMITTING DIODE (LED) LIGHTING SYSTEM 有权
标题翻译：发光二极管（LED）照明系统
公开(公告)号：EP2938924B1
公开(公告)日：2018-04-18
申请号：EP13815170.9
申请日：2013-12-18
申请人： ESJonsson ehf
发明人： JONSSON, Sturla , KRISJANSSON, Jon , JONSSON, Thorgeir
IPC分类号： F21V29/54 , F21V29/70 , F21V29/71 , F21Y115/10 , F21K9/00 , F21Y107/50
CPC分类号： F21V29/54 , F21K9/00 , F21V29/70 , F21V29/713 , F21V29/773 , F21V29/777 , F21Y2101/00 , F21Y2107/50 , F21Y2115/10
摘要： A light emitting diode (LED) lighting system including a first heat dissipation structure having a front side acting as a contact area to at least one LED and a back side. At least one second heat dissipation structure is positioned adjacent to the backside of the first heat dissipation structure. At least one thermoelectric module is positioned between the first heat dissipation structure. At least one second heat dissipation structure for conducting heat is produced from the at least one LED during operation from the first heat dissipation structure towards the at least one second heat dissipation structure. The front side of the first heat dissipation structure comprises at least one upwardly protruding structure extending distally away from the at least one second heat dissipation structure and the at least one upwardly protruding structure acts as the contact point to the at least one LED.

55. 发明授权

EP2980872B1 OPTICAL MODULE AND METHOD OF MAKING THE SAME 有权
标题翻译：光模块和方法及其生产
公开(公告)号：EP2980872B1
公开(公告)日：2017-01-25
申请号：EP15001923.0
申请日：2015-06-29
申请人： Hitachi-LG Data Storage, Inc.
发明人： Sakigawa, Yukio , Okamura, Masayuki , Furuichi, Hiroaki , Ogasawara, Hiroshi , Watabe, Kenji , Ichikawa, Fumihito , Yamasaki, Tatsuya
IPC分类号： G03B21/20 , H01L33/64
CPC分类号： F21V31/005 , F21V29/54 , G02B27/01 , G03B17/08 , G03B21/145 , G03B21/20 , G03B21/2033

56. 发明公开

EP3015764A4 LOW-LIGHT-FAILURE HIGH-POWER LED ROAD LAMP AND MANUFACTURING METHOD THEREFOR 有权
标题翻译： LEISTUNGSSTARKE LED-STRASSENLAMPE MIT GERINGEM LICHTFEHLER UND HERSTELLUNGSVERFAHRENDAFÜR
公开(公告)号：EP3015764A4
公开(公告)日：2016-06-29
申请号：EP14816753
申请日：2014-05-26
申请人： CHEN ZHIMING , GU WEI , SUZHOU WEIYUAN NEW MATERIAL TECHNOLOGY CO LTD
发明人： CHEN ZHIMING , GU WEI
IPC分类号： H01L35/32 , F21V29/51 , F21V29/54 , H01L35/34
CPC分类号： F21V29/76 , F21S8/086 , F21V29/51 , F21V29/54 , F21V29/71 , F21W2131/103 , F21Y2115/10 , H01L35/32 , H01L35/34
摘要： Disclosed is a low light failure high power LED street lamp and a method for manufacturing the same. A color mark is made in advance on a tail end surface used for manufacturing an N-type semiconductor element (6) or a P-type semiconductor element (7); then the N-type semiconductor element (6) and P-type semiconductor element (7) are arranged in a manner of matrix between an upper beryllium-oxide ceramic wafer (8) and a lower beryllium-oxide ceramic wafer (9), so that the head end of the N-type semiconductor element (6) is connected with the tail end of the P-type semiconductor element (7) or the tail end of the N-type semiconductor element (6) is connected with the head end of the P-type semiconductor element (7), then the lower beryllium-oxide ceramic wafer (9) is attached, through a graphene thermal conductive greaseon layer (4), on the backside of the circuit board (2) which is mounted with LED bulbs (3), and a heat sink (15) is mounted on the upper beryllium-oxide ceramic wafer (8), then the circuit board (2) together with the heat sink (15) are mounted into a street lamp housing (1).
摘要翻译：公开了一种低光衰大功率LED路灯及其制造方法。在用于制造N型半导体元件（6）或P型半导体元件（7）的尾端表面上预先制作彩色标记; 那么N型半导体元件（6）和P型半导体元件（7）以上铍氧化物陶瓷晶片（8）和下铍氧化物陶瓷晶片（9）之间的矩阵方式排列，因此 N型半导体元件（6）的前端与P型半导体元件（7）的尾端连接，或者N型半导体元件（6）的尾端与头端通过石墨烯导热油脂层（4），在安装有P型半导体元件（7）的电路板（2）的背面上安装下部铍氧化物陶瓷晶片（9）在上铍氧化物陶瓷晶片（8）上安装有LED灯泡（3）和散热器（15），然后将电路板（2）与散热片（15）一起安装在路灯壳体（ 1）。

57. 发明授权

EP1807726B1 ILLUMINATION SYSTEM WITH THERMALLY STABILIZED LIGHT EMITTING DIODE 失效转让
标题翻译：百日咳微量元素温度测定仪二极管
公开(公告)号：EP1807726B1
公开(公告)日：2016-04-27
申请号：EP05849156.4
申请日：2005-11-03
申请人： Life Technologies Corporation
发明人： OLDHAM, Mark, F. , MIRCHANDANI, Vinod, L. , HOSHIZAKI, Jon, A. , KING, Howard, G. , SLUIS, Johannes, P. , BOEGE, Steven, J.
IPC分类号： G01J3/10 , G01J3/02 , G05D23/20 , G05D23/19 , G01N21/64 , F21V29/74 , F21V29/54 , F21K99/00
CPC分类号： G01N21/64 , F21K9/00 , F21K9/64 , F21V29/54 , F21V29/677 , F21V29/74 , F21Y2115/10 , G01J3/0286 , G01J3/10 , G01N21/645 , G01N21/6452 , G01N2021/6439 , G01N2201/06113 , G01N2201/062 , G01N2201/0638 , G01N2201/1211 , G05D23/1919 , G05D23/20
摘要： Methods and optical systems for thermally compensated optical scanning of a target sample. The present invention also relates to methods and systems for performing sample assays, and for producing and measuring optical responses and signatures.
摘要翻译：用于目标样品的热补偿光学扫描的方法和光学系统。本发明还涉及用于进行样品测定以及用于产生和测量光学反应和特征的方法和系统。

58. 发明授权

EP2800931B1 A COLOR TUNABLE LIGHTING ASSEMBLY, A LIGHT SOURCE AND A LUMINAIRE 有权
标题翻译：灰度可调照明装置，光源和光
公开(公告)号：EP2800931B1
公开(公告)日：2016-03-16
申请号：EP12826548.5
申请日：2012-12-20
申请人： Koninklijke Philips N.V.
发明人： HIKMET, Rifat Ata Mustafa , VAN BOMMEL, Ties , XU, Shu
IPC分类号： F21V14/08 , F21V9/16 , F21V29/00 , F21V14/00 , F21V23/04
CPC分类号： H05B33/0872 , F21K9/64 , F21K9/65 , F21V9/30 , F21V9/40 , F21V14/003 , F21V14/08 , F21V17/02 , F21V23/0457 , F21V29/54 , F21V29/90 , F21Y2105/00 , F21Y2115/10 , F21Y2115/15 , F21Y2115/30 , H05B33/0869
摘要： A color tunable lighting assembly (100), a light source and a luminaire are provided. The color tunable lighting assembly (100) comprises a light emitter (110), a luminescent layer (108) and a temperature controlling means (106). The light emitter (110) emits light (112) of a first color distribution. The luminescent layer (108) receives light (112) emitted by the light emitter (110). The luminescent layer (108) comprises luminescent material to absorb a portion of the light (112) of the first color distribution and to convert a portion of the absorbed light into light (102) of a second color distribution. The second color distribution is dependent on the temperature of the luminescent layer (108). The temperature controlling means (106) actively controls a temperature of the luminescent layer (108) to obtain a light emission by the color tunable lighting assembly. The light emission has a specific color distribution.

59. 发明公开

EP2980872A1 OPTICAL MODULE AND METHOD OF MAKING THE SAME 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG DAVON的优化模块
公开(公告)号：EP2980872A1
公开(公告)日：2016-02-03
申请号：EP15001923.0
申请日：2015-06-29
申请人： Hitachi-LG Data Storage, Inc.
发明人： Sakigawa, Yukio , Okamura, Masayuki , Furuichi, Hiroaki , Ogasawara, Hiroshi , Watabe, Kenji , Ichikawa, Fumihito , Yamasaki, Tatsuya
IPC分类号： H01L33/64 , G03B21/20
CPC分类号： F21V31/005 , F21V29/54 , G02B27/01 , G03B17/08 , G03B21/145 , G03B21/20 , G03B21/2033
摘要： An optical module having a high-moisture-proof package structure in which dew condensation does not occur is provided.
An optical module includes optical components including a light source, a pedestal on which the optical components are mounted, a cover which is combined to the pedestal to seal the optical components, and an emitting window disposed in the cover to take light from the light source outside. The pedestal and the cover are sealed with an O ring and a liquid seal material such that a compression direction of the O ring and a compression direction of the liquid seal material are almost perpendicular to each other.
摘要翻译：提供了一种具有不会发生结露的高防潮包装结构的光学组件。光学模块包括光学元件，包括光源，其上安装有光学元件的基座，与基座结合以密封光学元件的盖子以及设置在盖子中以从光源照射的发光窗口外。基座和盖用O形环和液体密封材料密封，使得O形环的压缩方向和液体密封材料的压缩方向几乎彼此垂直。

60. 发明公开

EP1872401A4 ELECTRONIC DEVICE PACKAGE WITH AN INTEGRATED EVAPORATOR 有权转让
标题翻译：带有一体式蒸发器，电子BAUELEMENTEKAPSELUNG
公开(公告)号：EP1872401A4
公开(公告)日：2015-06-17
申请号：EP06721749
申请日：2006-04-04
申请人： KONINKL PHILIPS NV
发明人： SCHICK PHILIPPE
IPC分类号： H01L23/02 , H01L23/46 , H01L33/64
CPC分类号： F21V29/51 , F21V29/006 , F21V29/40 , F21V29/54 , F21V29/83 , F28D15/0275 , F28D15/04 , H01L23/3675 , H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H05K1/0203 , H05K1/0209 , H05K2201/10106 , H01L2924/00
摘要： The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.

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