专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明公开

EP1346825A2 Apparatus and method for laminating dry film using microwave 有权
标题翻译：装置和方法，用于使用微波的干膜层压
公开(公告)号：EP1346825A2
公开(公告)日：2003-09-24
申请号：EP02013152.0
申请日：2002-06-14
申请人： Kang, Lee
发明人： Kang, Lee
IPC分类号： B32B31/12 , B32B31/28
CPC分类号： B32B38/162 , B32B37/226 , B32B38/0036 , B32B2310/0862 , H05K3/0079 , H05K3/281 , H05K2203/102
摘要： The present invention relates to an apparatus and method for laminating a dry film using a microwave which are capable of quickly transforming a photosensitive substance of a dry film to a semi-liquid state by vibrating a water or acryl group copolymer molecular in a dry film for thereby implementing a laminating operation. The apparatus (200) for laminating a dry film includes a microwave oscillating apparatus (214) which includes an interior surrounded by a reflection film (215), for thereby heat-oscillating a water and acryl group copolymer molecular in a dry film, a caterpillar belt clean apparatus for removing foreign substances formed after pressurizing the film heated by the oscillating apparatus (214), a frame for performing a laminating work with respect to the substrate fed by the feeding apparatus, and a discharging apparatus for discharging the PCB photosensitive-processed by the microwave oscillating apparatus (214).

52. 发明公开

EP1059157A3 Functional film sticking apparatus and functional film sticking method 审中-公开
标题翻译：的装置和方法在基板上涂布的功能性膜
公开(公告)号：EP1059157A3
公开(公告)日：2001-05-09
申请号：EP00112307.4
申请日：2000-06-08
申请人： SONY CORPORATION
发明人： Kawada, Yasuo, c/o Sony Inazawa Corporation , Inose, Tsutomu, c/o Sony Inazawa Corporation , Setsuda, Takashi, c/o Sony Inazawa Corporation , Tanaka, Tatsuo, c/o Sony Inazawa Corporation
IPC分类号： B32B35/00 , B29C63/02
CPC分类号： B32B43/006 , B29C63/02 , B32B38/162 , B32B2309/65 , H01J9/20 , H01J2209/015 , Y10T156/14 , Y10T156/17 , Y10T156/1788
摘要： A functional film sticking apparatus includes: a separator peeling unit (A) for peeling a separator (F4) from a functional film (F) having the separator stuck on the functional film via an adhesive; a functional film sticking unit (B) for sticking the functional film (F), from which the separator (F4) has been peeled by the separator peeling unit, on a panel surface; and a film fixing portion for carrying the functional film at least from the separator peeling unit to the functional film sticking unit while holding the functional film by suction, the film fixing portion (22) being provided with a roller for sticking the functional film. The separator peeling unit is provided with a suction device (13) for sucking, upon peeling the separator from the functional film, the atmosphere at the portion to be peeled and its neighborhood, or is provided with an electrostatic eraser for removing, upon peeling the separator from the functional film, electrostatic charges at the portion to be peeled and its neighborhood. With this apparatus, it is possible to reduce the entrapment of air and foreign matters upon sticking a functional film on a product and hence to improve the quality of the product on which the function film has been stuck.
摘要翻译：一种功能贴膜装置，包括：用于从功能膜具有通过对粘合剂粘在功能膜分离器（F）剥离分离器（F4）的剥离分离器单元（A）; 的功能性薄膜粘着用于粘贴功能膜（F），从该分离器（F4）已经剥离通过剥离单元分离器，在面板表面上单元（B）; 以及用于执行至少从分离器剥离单元以所述功能膜粘着部，同时保持功能性膜的通过抽吸功能-在膜的膜固定部，所述膜固定部（22）设置有用于粘贴功能成膜的辊。隔板剥离单元设置有一个抽吸装置（13），用于吸入，剥离时从功能电影隔板，在所述部分中的气氛被剥离和其附近，或在静电擦除器用于除去设置有，在剥离从功能电影分离器，在该部分的静电荷被剥离和其邻域。有了这个设备，可以在粘在膜产品的功能，从而改善该函数的电影一直停留在产品的质量，减少空气和异物的滞留。

53. 发明公开

EP0932149A3 Method of and apparatus for laminating disc-shaped substrates 有权
标题翻译：用于层压圆盘状基板的方法和装置
公开(公告)号：EP0932149A3
公开(公告)日：2000-04-19
申请号：EP99101392.1
申请日：1999-01-26
申请人： Kitano Engineering Co., Ltd.
发明人： Amo, Mikuni c/o Kitano Engineering Co., Ltd.
IPC分类号： G11B7/26 , B32B31/00
CPC分类号： B29C65/52 , B29C63/0013 , B29C65/4825 , B29C65/483 , B29C65/4845 , B29C65/521 , B29C65/7847 , B29C66/1122 , B29C66/452 , B29C66/8322 , B29L2017/005 , B32B37/0007 , B32B37/1284 , B32B38/162 , B32B38/1875 , B32B2429/02 , G11B7/26 , Y10T156/1705 , Y10T156/1707
摘要： There is provided a method of and an apparatus for laminating disc-shaped substrates capable of automatically bonding an adhesive agent to the disc-shaped substrates very effectively and continuously. The method of laminating disc-shaped substrates comprising preparing an adhesive sheet body (S) comprising a plurality of adhesive agents (S2) each covered with a release paper (S3), peeling off the release paper (S3) from the adhesive sheet body (S), positioning the adhesive sheet body (S) from which the release paper (S3) is peeled off over a lower disc-shaped substrate (D1), pressing the adhesive sheet body (S) to allow the adhesive agent (S2) adhered to the lower surface of the adhesive sheet body (S) to bond or transfer onto a surface of the lower disc-shaped substrate (D1), peeling off the adhesive sheet body (S) from the adhesive agent (S2) bonded onto the surface of the lower disc-shaped substrate (D1), placing an upper disc-shaped substrate (D2) on the lower disc-shaped substrate (D1), pressing the upper disc-shaped substrate (D2) against the lower disc-shaped substrate (D1), thereby bonding the lower disc-shaped substrate (D1) and the upper disc-shaped substrate (D2). The laminating apparatus for laminating disc-shaped substrates comprising a holding table (2) to place a lower disc-shaped substrate (D1) thereon, supporting members (tension rollers 5A, 5B) for extending an adhesive sheet body (S) therebetween at a given interval over the holding table (2), a centering shaft (3) for positioning the adhesive sheet body (S), a laminating roller (1) for pressing the adhesive sheet body (S) against the lower disc-shaped substrate (D1) to bond the adhesive sheet body (S) onto it.

54. 发明公开

EP0992341A2 Verfahren und Vorrichtung zum Verkleben von zwei Substraten 失效
标题翻译：用于键合两个基板的方法和装置
公开(公告)号：EP0992341A2
公开(公告)日：2000-04-12
申请号：EP99120206.0
申请日：1998-04-02
申请人： Steag HamaTech AG
发明人： Weber, Klaus , Speer, Ulrich
IPC分类号： B32B31/12 , G11B7/26
CPC分类号： B29C65/48 , B29C65/1406 , B29C65/4845 , B29C65/52 , B29C65/521 , B29C65/78 , B29C65/7847 , B29C66/1122 , B29C66/342 , B29C66/345 , B29C66/452 , B29C66/8322 , B29D17/005 , B29L2017/005 , B32B37/0007 , B32B37/1284 , B32B38/162 , B32B2429/02 , C09J5/00 , G11B7/26 , B29C65/00
摘要： Ein Verfahren zum Verkleben von zwei Substraten (3, 6) zu einer Substratscheibe (23), bei dem ein Klebemittel auf eine zu verklebende Fläche eines ersten Substrats (3, 6) aufgebracht und ein zweites Substrat (6, 3) mit seiner zu verklebenden Fläche auf das erste Substrat (3,6) aufgelegt wird, ergibt sich eine besonders gute, gleichmäßige und schnelle Verklebung der Substrate ohne Lufteinschlüsse und mit einfachen Mitteln, wenn die Substrate (3, 6) zum Ausschleudern des Klebemittels um ihre Mittelachse gedreht werden. Vorrichtungen zur Durchführung des Verfahrens sind angegeben.

55. 发明公开

EP0979169A2 VERFAHREN UND VORRICHTUNG ZUM VERKLEBEN VON ZWEI SUBSTRATEN 失效
标题翻译：方法和装置键合二个衬底
公开(公告)号：EP0979169A2
公开(公告)日：2000-02-16
申请号：EP98921420.0
申请日：1998-04-02
申请人： Steag HamaTech AG
发明人： WEBER, Klaus , SPEER, Ulrich
IPC分类号： B32B31/12 , G11B7/26 , B05B5/10
CPC分类号： B29C65/48 , B29C65/1406 , B29C65/4845 , B29C65/52 , B29C65/521 , B29C65/78 , B29C65/7847 , B29C66/1122 , B29C66/342 , B29C66/345 , B29C66/452 , B29C66/8322 , B29D17/005 , B29L2017/005 , B32B37/0007 , B32B37/1284 , B32B38/162 , B32B2429/02 , C09J5/00 , G11B7/26 , B29C65/00
摘要： The invention relates to a method for gluing two substrates (3, 6) to a substrate disk (23), wherein an adhesive is applied to the surface of the first substrate (3, 6) which is to be glued and the surface of a second substrate (6, 3) which is to be glued is placed on top of the first substrate (3, 6). The inventive method provides for particularly good, homogenous and rapid gluing of the substrates without inclusion of air and requires only simple means since the substrates (3, 6) are rotated around their centre axis so that the adhesive can be ejected. The invention also relates to devices for carrying out the above method.

56. 发明公开

EP0974454A2 Verfahren und Vorrichtung zum Verkleben von zwei Substraten 失效
公开(公告)号：EP0974454A2
公开(公告)日：2000-01-26
申请号：EP99120207.8
申请日：1998-04-02
申请人： Steag HamaTech AG
发明人： Weber, Klaus , Speer, Ulrich
IPC分类号： B32B31/12 , G11B7/26 , B05B5/10
CPC分类号： B29C65/48 , B29C65/1406 , B29C65/4845 , B29C65/52 , B29C65/521 , B29C65/78 , B29C65/7847 , B29C66/1122 , B29C66/342 , B29C66/345 , B29C66/452 , B29C66/8322 , B29D17/005 , B29L2017/005 , B32B37/0007 , B32B37/1284 , B32B38/162 , B32B2429/02 , C09J5/00 , G11B7/26 , B29C65/00
摘要： Ein Verfahren zum Verkleben von zwei Substraten (3, 6) zu einer Substratscheibe (23), bei dem ein Klebemittel auf eine zu verklebende Fläche eines ersten Substrats (3, 6) aufgebracht und ein zweites Substrat (6, 3) mit seiner zu verklebenden Fläche auf das erste Substrat (3,6) aufgelegt wird, ergibt sich eine besonders gute, gleichmäßige und schnelle Verklebung der Substrate ohne Lufteinschlüsse und mit einfachen Mitteln, wenn die Substrate (3, 6) zum Ausschleudern des Klebemittels um ihre Mittelachse gedreht werden. Vorrichtungen zur Durchführung des Verfahrens sind angegeben.
摘要翻译：这种新颖的方法将两个基片（3,6）粘在一起，形成一个圆盘（23）。本产品特别是数码影碟（DVD）。将粘合剂涂布到第一基板（3）的表面上，并将第二基板（6）放置在其上。具体方面以这种方式结合在一起。该方法的新颖特征在于，组合的基板围绕其中心轴线旋转以喷射粘合剂。也声称是相应的设备。

57. 发明授权

EP0708707B1 METHOD OF LAMINATE MANUFACTURE 失效
标题翻译： LAMINATHERSTELLUNGSVERFAHREN
公开(公告)号：EP0708707B1
公开(公告)日：1998-10-14
申请号：EP94920562.9
申请日：1994-07-13
申请人： Teknek Electronics Limited
发明人： HAMILTON, Sheila , CANNON, Roy , ROBERTSON, Stewart , KENNETT, Jonathan
IPC分类号： B32B31/00 , B32B31/20 , B32B15/08
CPC分类号： B32B38/162 , B32B5/024 , B32B15/14 , B32B15/20 , B32B37/02 , B32B37/065 , B32B37/10 , B32B37/182 , B32B38/105 , B32B2260/021 , B32B2260/046 , B32B2305/18 , B32B2309/65 , B32B2311/12 , B32B2457/08 , H05K3/022 , Y10T156/103 , Y10T428/239
摘要： A laminate such as a PCB material is formed by stacking resin impregnated prepreg sheets (10) between copper foils (12), applying heat and pressure around the periphery of the stack to form an edge-sealed unit, and subjecting a number of such units to a lay-up process in a separate clean area into which they are introduced via surface-cleaning means.

58. 发明授权

EP0458038B1 Fiber reinforced thermoplastic sheet-shaped molding and manufacturing thereof 失效
标题翻译：一种用于制造以这种方式和Thermoplastkunststoffgiesserzeugnisses制造的纤维增强制品的方法
公开(公告)号：EP0458038B1
公开(公告)日：1997-12-10
申请号：EP91105026.8
申请日：1991-03-28
申请人： KURARAY CO., LTD.
发明人： Hayashikoshi, Noriaki , Nishimori, Masahiko , Hori, Hisanobu , Ishii, Toshinori , Ohnishi, Isao
IPC分类号： B29C70/02 , B29C70/08 , B29B15/12
CPC分类号： B32B38/08 , B29C70/504 , B32B37/1027 , B32B38/162 , Y10T156/1712
摘要： An apparatus for and a method of manufacturing a fiber reinforced thermoplastic sheet-shaped molding comprising a pre-impregnating process and a final impregnating process. A sheet (a) of thermoplastic resin and a web (b) of reinforcement fibers are supplied through the pre-impregnating process during which the thermoplastic resin is sucked under the influence of a suction force so as to partially penetrate into interstices in the reinforcement fiber web while the both are transported around and by a perforated rotary drum (13), thereby to form a first preformed sheet (d). The first preformed sheet (d) is subsequently supplied to the final impregnating process during which an impregnating machine (7) known per se is employed. As the first preformed sheet (d) is passed through the impregnating machine (7) while compressed inwardly and heated by, the thermoplastic resin is allowed to completely penetrate into the interstices in the reinforcement fiber web to complete the fiber reinforced thermoplastic sheet-shaped molding upon cooling thereof. The fiber reinforced thermoplastic sheet-shaped molding is made of thermoplastic resin impregnated with reinforcement fibers. This fiber reinforced thermoplastic sheet-shaped molding has a void content not higher than 1% and having voids of a size not greater than 100 mu m as measured in a major axis of the shape of each void.

59. 发明公开

EP0708707A1 METHOD OF LAMINATE MANUFACTURE 失效
标题翻译：层叠片的方法
公开(公告)号：EP0708707A1
公开(公告)日：1996-05-01
申请号：EP94920562.0
申请日：1994-07-13
申请人： Teknek Electronics Limited
发明人： HAMILTON, Sheila , CANNON, Roy , ROBERTSON, Stewart , KENNETT, Jonathan
IPC分类号： B32B37 , B32B38 , H05K3
CPC分类号： B32B38/162 , B32B5/024 , B32B15/14 , B32B15/20 , B32B37/02 , B32B37/065 , B32B37/10 , B32B37/182 , B32B38/105 , B32B2260/021 , B32B2260/046 , B32B2305/18 , B32B2309/65 , B32B2311/12 , B32B2457/08 , H05K3/022 , Y10T156/103 , Y10T428/239
摘要： A laminate such as a PCB material is formed by stacking resin impregnated prepreg sheets (10) between copper foils (12), applying heat and pressure around the periphery of the stack to form an edge-sealed unit, and subjecting a number of such units to a lay-up process in a separate clean area into which they are introduced via surface-cleaning means.

60. 发明公开

EP0565752A1 Verfahren zum Beschichten von flächigem Trägermaterial sowie Beschichtungsanlage zur Durchführung des Verfahrens 失效
标题翻译：过程用于涂覆板状载体材料和涂覆设备用于执行该方法。
公开(公告)号：EP0565752A1
公开(公告)日：1993-10-20
申请号：EP92106427.5
申请日：1992-04-14
申请人： FRIZ MASCHINENBAU GmbH
发明人： Miller, Rainer
IPC分类号： B32B7/12 , B29C63/00 , B32B31/00
CPC分类号： B32B7/12 , B29C63/0065 , B32B38/162 , B32B2309/02
摘要： Beim Beschichten von flächigem Trägermaterial mit Beschichtungsmaterial im Durchlauf wird zur Verbesserung des Verklebungsergebnisses die Oberfläche des Trägermaterials beschichtungsseitig vor dem Kleberauftrag [7] bis in eine geringe Tiefe auf mindestens 60°C erwärmt, [5] der Abdunstvorgang ausschließlich durch Wärmeenergie aus der erwärmten Oberfläche des Trägermaterials gespeist und die Oberfläche des Beschichtungsmaterials unmittelbar vor dem Preßvorgang [14] zumindest trägermaterialseitig auf mindestens 80°C erwärmt.
摘要翻译：与在continuousOperation涂层材料的平坦基底的涂层，以改善粘合性的效果，基片的表面上的涂层侧到至少60℃的粘接剂施加之前被加热至一低深度[7] [5]排烟过程仅仅通过热能从所述基底和所述涂层材料的表面的加热表面直接供给的按压操作[14]之前被加热到至少80℃，至少在基片上侧。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式