专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明公开

EP1435631A4 SLIDING CONTACT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：滑动及其制造方法
公开(公告)号：EP1435631A4
公开(公告)日：2006-03-22
申请号：EP03703256
申请日：2003-02-07
申请人： TANAKA PRECIOUS METAL IND
发明人： SAYAMA M TANAKA , TANI K , SUZUKI H
IPC分类号： H01C10/00 , H01C10/30 , H01H1/36 , H01H11/04
CPC分类号： H01C10/30 , H01H1/36 , H01H11/04 , H01H2011/0087 , Y10T29/49117 , Y10T29/49204 , Y10T29/49211 , Y10T29/49213 , Y10T29/49222
摘要： A sliding contact in which the surface at the forward end part of the claw of a brush can be made smooth surely and the production yield can be increased, and its producing method. In the method for producing a sliding contact having a metallic brush, forward end part of the claw (12a’) of a sliding contact piece (10’) is melted and then solidified in gas thus making smooth the surface at the forward end of the claw (12a’). When the sliding contact is made by punching a thin metallic plate, for example, forward end part of the claw (12a’) of a brush (12’) of a punched sliding contact piece (10’) is irradiated with a laser beam and melted thermally. Consequently, sharp parts and burs existed before melted are eliminated. When the forward end part of the claw (12a’) is solidified subsequently in gas, a sliding contact having a brush provided with a claw in the shape of curved surface having smooth forward end face is produced.

42. 发明公开

EP1342294A4 I-CHANNEL SURFACE-MOUNT CONNECTOR 有权
标题翻译： I-CHANNEL表面安装连接器
公开(公告)号：EP1342294A4
公开(公告)日：2006-03-08
申请号：EP01964214
申请日：2001-08-20
申请人： DT INC DI , ROY APURBA
发明人： ROY APURBA
IPC分类号： H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H05K1/14 , H05K3/34 , H05K3/36 , H05K5/00 , H01R13/46
CPC分类号： H01R12/57 , H01L23/49811 , H01L2924/0002 , H01L2924/3011 , H01R12/52 , H05K3/3426 , H05K3/368 , H05K2201/1031 , H05K2201/10666 , H05K2201/10856 , Y02P70/611 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49211 , H01L2924/00
摘要： A low impedance surface mount connector (20) having an I-shaped cross section for connecting between the first and second circuit boards (51, 61).

43. 发明公开

EP1570277A2 METHOD OF MAKING A SOCKET TO PERFORM TESTING ON INTEGRATED CIRCUITS AND SUCH A SOCKET 有权
标题翻译：一种货架测试程序集成电路和此类基础工艺
公开(公告)号：EP1570277A2
公开(公告)日：2005-09-07
申请号：EP03796616.5
申请日：2003-12-02
申请人： FormFactor, Inc.
发明人： KHANDROS, Igor, K. , MATHIEU, Gaetan, L. , REYNOLDS, Carl, V.
IPC分类号： G01R1/073
CPC分类号： G01R3/00 , G01R1/0433 , G01R1/0483 , G01R1/07378 , G01R31/2863 , H01L24/13 , H01L2224/131 , H01L2924/01046 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49169 , Y10T29/49179 , Y10T29/49197 , Y10T29/49204 , Y10T29/4921 , Y10T29/49211 , Y10T29/49224 , Y10T29/53217 , Y10T29/53265 , H01L2924/014
摘要： A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

44. 发明公开

EP1083594A2 Fired body for and manufacture of a substrate 失效
标题翻译：对于基板的制造烧结部件和
公开(公告)号：EP1083594A2
公开(公告)日：2001-03-14
申请号：EP00309912.4
申请日：1995-06-22
申请人： SHINKO ELECTRIC INDUSTRIES CO. LTD.
发明人： Horiuchi, Michio, Shinko Electric Ind. Co. Ltd , Harayama, Yoichi, Shinko Electric Ind. Co. Ltd. , Takeuchi, Yukiharu, Shinko Electric Ind. Co. Ltd.
IPC分类号： H01L21/48
CPC分类号： H05K3/0011 , H01L21/486 , H01L23/49861 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4038 , H05K2201/10287 , H05K2203/0235 , H05K2203/308 , Y10T29/49211 , Y10T428/24926 , H01L2924/00
摘要： A fired body (24) for manufacturing a substrate (14) is pillar shaped and includes metallic wires (10) arranged inside the fired body parallel with its axis. The melting point of the metallic wires (10) is higher than the melting point, pour point or softening point of an insulating base body (22) of the fired body. A method of manufacturing a substrate includes the steps of: forming a pillar shaped unfired body (22) in which metallic wire rods (10) having a melting point higher than the firing temperature of a fired body are embedded and parallel with the axis; firing the unfired body at a temperature higher than the melting point of the fired body; and cutting the fired body (24) in a direction perpendicular to the axis to provide a substrate (14) of a pre-determined thickness.

45. 发明授权

EP0564335B2 Procédé d'assemblage d'un connecteur présentant des éléments de contacts coudés 失效
标题翻译：一种组装具有角接触元件连接器的方法
公开(公告)号：EP0564335B2
公开(公告)日：2000-12-06
申请号：EP93400787.3
申请日：1993-03-26
申请人： FRAMATOME CONNECTORS INTERNATIONAL
发明人： Pesson, Michel , Fonteneau, Michel
IPC分类号： H01R43/20 , B29C51/00
CPC分类号： H01R43/20 , H05K3/306 , Y10T29/49147 , Y10T29/49211 , Y10T29/4922

46. 发明授权

EP0801521B1 Verfahren zur Herstellung von elektrisch leitenden Durchführungen in metallisierten Kunststoffgehäusen 失效
标题翻译：一种用于在金属化的塑料肠衣制备导电通道处理
公开(公告)号：EP0801521B1
公开(公告)日：1999-03-17
申请号：EP97105506.6
申请日：1997-04-03
申请人： TEMIC TELEFUNKEN microelectronic GmbH
发明人： Knödler, Dieter
IPC分类号： H05K9/00 , H01R43/20
CPC分类号： H05K1/116 , H01R43/20 , H05K3/045 , H05K3/308 , H05K3/3447 , H05K3/426 , H05K9/0018 , H05K2201/0715 , H05K2201/09036 , H05K2201/09045 , H05K2201/09118 , H05K2201/09827 , H05K2201/09845 , H05K2201/10303 , H05K2201/10871 , Y10T29/49139 , Y10T29/49153 , Y10T29/49211 , Y10T29/49222

47. 发明公开

EP0851536A2 Waterproof structure for conductor leading part 失效
标题翻译： Wasserdichte StrukturfürKabeldurchführungsteil
公开(公告)号：EP0851536A2
公开(公告)日：1998-07-01
申请号：EP97122278.1
申请日：1997-12-17
申请人： YAZAKI CORPORATION
发明人： Kato, Tetsuo, c/o Yazaki Parts Co., Ltd. , Shinchi, Akira, c/o Yazaki Parts Co., Ltd. , Asakura, Nobuyuki, c/o Yazaki Parts Co., Ltd.
IPC分类号： H01R13/52
CPC分类号： H01R13/5205 , H01R13/504 , H01R13/5216 , Y10T29/49211
摘要： A waterproof structure for a wire leading part of a housing is provided. The structure includes two cover bodies and two waterproof members carried by the cover bodies. The waterproof members are made of elastic materials which are soluble in each other and fusible in insulating covers of wires by ultrasonic oscillation under pressure. At the mutual welding of the cover bodies by the ultrasonic oscillation, the waterproof members are fused in each other, the waterproof members are fused in the insulating covers and the cover bodies are welded to the housing.
摘要翻译：提供了一种用于壳体的导线部分的防水结构。该结构包括由盖体承载的两个盖体和两个防水构件。防水构件由弹性材料制成，它们彼此可溶，并且在压力下通过超声波振荡熔接在电线的绝缘层中。在通过超声波振荡对盖体进行相互焊接时，防水构件彼此熔合，防水构件熔合在绝缘盖中，并且盖体焊接到壳体。

48. 发明公开

EP0712266A2 Packaging electrical components 失效
公开(公告)号：EP0712266A2
公开(公告)日：1996-05-15
申请号：EP95308071.0
申请日：1995-11-10
申请人： VLT CORPORATION
发明人： Pullen, Stephen R. , Hedlund III,Walter R.
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20463 , H01L2224/05553 , H01L2224/73265 , H01L2924/09701 , H05K1/0203 , H05K1/021 , H05K1/141 , H05K1/182 , H05K3/0052 , H05K3/0061 , H05K3/3442 , H05K3/368 , H05K3/403 , H05K3/42 , H05K5/0095 , H05K7/209 , H05K2201/09072 , H05K2201/09181 , H05K2201/09645 , H05K2201/10666 , H05K2203/0455 , Y02P70/613 , Y10T29/49179 , Y10T29/49211
摘要： A structure comprising a baseplate, a circuit board parallel and adjacent to the baseplate, and an electronic component is described. The circuit board has an edge with a scallop formed in the edge, and the scallop is plated with a conductive material. The electronic component includes a power-dissipating surface and a pad for making electrical connection. The electronic component is mounted with the power-dissipating surface in contact with the baseplate and the pad electrically connected to the conductive material.

49. 发明公开

EP0469798A3 Micropin array and production method thereof 失效
标题翻译：微阵列及其生产方法
公开(公告)号：EP0469798A3
公开(公告)日：1993-01-13
申请号：EP91306834.2
申请日：1991-07-26
申请人： NEC CORPORATION
发明人： Inasaka, Jun
IPC分类号： H01R23/00 , H01R23/72 , H01R43/00
CPC分类号： H01R43/007 , H01L2924/0002 , H01R13/24 , Y10T29/4921 , Y10T29/49211 , Y10T156/1052 , H01L2924/00
摘要： The micropin array is comprised of a plurality of micropins having a given diameter and being aligned in parallel to one another at a given pitch, insulating tubular coatings disposed to cover individual micropins, and an adhesive provided to fill spacings among the insulating tubular coatings. This micropin array is produced by the steps of preparing a plurality of coated wire materials composed of a metal core having a given diameter and an insulating tubular coating of a given thickness formed around the metal core, aligning closely and successively the coated wire materials to form a bundle thereof, fixing the bundle of the coated wire materials by means of an adhesive, and cutting the fixed bundle of the coated wire materials by a given length to form a micropin array.

50. 发明公开

EP0469798A2 Micropin array and production method thereof 失效
标题翻译： von Mikroverbindungsstiften und Verfahren zu dessen Herstellung。
公开(公告)号：EP0469798A2
公开(公告)日：1992-02-05
申请号：EP91306834.2
申请日：1991-07-26
申请人： NEC CORPORATION
发明人： Inasaka, Jun
IPC分类号： H01R23/00 , H01R23/72 , H01R43/00
CPC分类号： H01R43/007 , H01L2924/0002 , H01R13/24 , Y10T29/4921 , Y10T29/49211 , Y10T156/1052 , H01L2924/00
摘要： The micropin array is comprised of a plurality of micropins having a given diameter and being aligned in parallel to one another at a given pitch, insulating tubular coatings disposed to cover individual micropins, and an adhesive provided to fill spacings among the insulating tubular coatings. This micropin array is produced by the steps of preparing a plurality of coated wire materials composed of a metal core having a given diameter and an insulating tubular coating of a given thickness formed around the metal core, aligning closely and successively the coated wire materials to form a bundle thereof, fixing the bundle of the coated wire materials by means of an adhesive, and cutting the fixed bundle of the coated wire materials by a given length to form a micropin array.
摘要翻译：微孔阵列由多个具有给定直径并且以给定间距彼此平行排列的微孔组成，设置成覆盖单个微孔的绝缘管状涂层以及用于填充绝缘管状涂层之间的间隔的粘合剂。该微型阵列通过以下步骤制造：制备由具有给定直径的金属芯构成的多个涂覆的线材料，以及形成在金属芯周围的给定厚度的绝缘管状涂层，使得涂覆的线材紧密地排列成形其捆束，通过粘合剂固定被覆线材的束，并将涂覆的线材的固定束切割一定长度以形成微阵列。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式