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41. 发明公开

EP2071663A1 Phased array antenna embedded in an integrated circuit package 有权转让
标题翻译：一个嵌入在集成电路封装中的相控阵天线
公开(公告)号：EP2071663A1
公开(公告)日：2009-06-17
申请号：EP08020760.8
申请日：2008-11-28
申请人： Broadcom Corporation
发明人： Rofougaran, Ahmadreza , Rofougaran, Maryam
IPC分类号： H01Q1/24 , H01Q3/36 , H01Q9/26 , H01Q21/00 , H01Q21/06 , H01Q23/00 , H01Q1/38 , H01L23/66 , H01L21/60
CPC分类号： H01Q23/00 , H01L23/48 , H01L23/66 , H01L24/16 , H01L24/81 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/73204 , H01L2224/81801 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/19105 , H01L2924/3011 , H01Q1/24 , H01Q1/38 , H01Q3/36 , H01Q9/265 , H01Q21/0093 , H01Q21/062 , H01L2924/00
摘要： Aspects of a method and system for configurable antenna (102) in an integrated circuit package (104) are provided. In this regard, a phased array antenna (102) embedded in a multi-layer integrated circuit (IC) package (104) may be utilized for transmitting and/or receiving signals. An IC (106) enabled to transmit and/or receive signals may be bonded to the multi-layer IC package and may communicate a reference signal and/or one or more phase shifted versions of said reference signal to the antenna. One or more phase shifters (252) (fabricated, for example, in planar transmission line) may be embedded in the multi-layer IC package (104) and may be controlled via an IC (106) bonded to the multi-layer IC package. The phased array antenna (102) may comprise a plurality of antenna elements (150) which may each comprise an interconnection for communicatively coupling to an associated transmitter and/or receiver (423), a feeder line (156), a quarter wavelength transformer (154), and a radiating portion (152) (e.g., a folded dipole).

42. 发明公开

EP2071625A1 Chip carrier with ferro/ferrimagnetic layers 审中-公开
标题翻译： Chipträgermit ferro / / ferrimagnetischen Schichten
公开(公告)号：EP2071625A1
公开(公告)日：2009-06-17
申请号：EP08021012.3
申请日：2008-12-03
申请人： Broadcom Corporation
发明人： Rofougaran, Ahmadreza , Rofougaran, Maryam
IPC分类号： H01L23/66 , H01L23/64 , H01L25/16
CPC分类号： H01L23/66 , H01L23/48 , H01L23/49822 , H01L23/645 , H01L25/16 , H01L2223/6677 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/01078 , H01L2924/15192 , H01L2924/15311 , H01L2924/1532 , H01L2924/15321 , H01L2924/19103 , H01L2924/19105 , H01L2924/3011
摘要： Methods and systems for an integrated circuit package with ferri/ferromagnetic layers are disclosed and may include processing a received signal via a hybrid including an integrated circuit bonded to a multi-layer package, the latter including integrated layers of ferrimagnetic material and/or ferromagnetic material (205A,205B,205C,207,209 and 217), metal interconnect materials (215A,215B) and insulating materials. The received signal may be filtered, amplified, and/or impedance matched via the integrated layers of ferrimagnetic material and/or ferromagnetic material. The integrated circuit (201) may be hybridized to the multi-layer package (213) utilizing a flip-chip bonding technique. The hybridized multi-layer package and integrated circuit may be coupled to a printed circuit board utilizing a flip-chip bonding technique. The ferromagnetic material and/or ferrimagnetic material may be deposited on the multi-layer package. The magnetic material may be deposited on the multi-layer package using an ink printing technique and/or a spin-on technique. One or more surface mount devices (219A,219B) may be coupled to the multi-layer package.
摘要翻译：公开了具有铁/铁磁性层的集成电路封装的方法和系统，并且可以包括经由混合物处理接收的信号，所述混合物包括结合到多层封装的集成电路，后者包括铁氧体材料和/或铁磁材料的集成层（205A，205B，205C，207,209和217），金属互连材料（215A，215B）和绝缘材料。所接收的信号可以经由铁磁材料和/或铁磁材料的集成层进行滤波，放大和/或阻抗匹配。集成电路（201）可以利用倒装芯片接合技术与多层封装（213）杂交。混合多层封装和集成电路可以利用倒装芯片接合技术耦合到印刷电路板。铁磁材料和/或铁磁材料可以沉积在多层封装上。可以使用油墨印刷技术和/或旋涂技术将磁性材料沉积在多层包装上。一个或多个表面贴装器件（219A，219B）可以耦合到多层封装。

43. 发明公开

EP1209869A1 IF FSK receiver with circuits for differentiators and peak detectors 有权
标题翻译： ZF FSKEmpfängermit SchaltungenfürDifferenzierer und Spitzenwertdetektor
公开(公告)号：EP1209869A1
公开(公告)日：2002-05-29
申请号：EP01250413.0
申请日：2001-11-26
申请人： Broadcom Corporation
发明人： Darabi, Hooman , Khorram, Shahla , Rofougaran, Maryam
IPC分类号： H04L27/152 , H04L27/14 , H04L25/06
CPC分类号： H04L25/062 , H04L27/142 , H04L27/1525 , H04L2027/0016 , H04L2027/0024
摘要： In one embodiment, the present invention is a low-power, and high performance receiver including an IF demodulator for high data rate, frequency modulated systems, such as Bluetooth. The IF demodulator is implemented in analog domain for simplicity and lower power consumption and operates at an IF frequency.
In one aspect, the present invention is an IF demodulator comprising: a first IF differentiator for differentiating an I signal; a second IF differentiator for differentiating a Q signal; a cross-coupled multiplier for multiplying the differentiated I signal with the I signal and multiplying the differentiated Q signal with the Q signal to extract frequency information from the I signal and the Q signal; and a slicer for converting the frequency information to digital data.
摘要翻译：在一个实施例中，本发明是低功率，高性能的接收机，其包括用于高数据速率的IF解调器，诸如蓝牙的调频系统。 IF解调器在模拟域中实现，以简化和降低功耗，并以IF频率工作。一方面，本发明是一种IF解调器，包括：用于区分I信号的第一IF微分器; 用于区分Q信号的第二IF微分器; 交叉耦合乘法器，用于将微分I信号与I信号相乘，并将微分Q信号与Q信号相乘，以从I信号和Q信号提取频率信息; 以及用于将频率信息转换为数字数据的限幅器。

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