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    • 43. 发明公开
    • Improvements in or relating to semiconductors
    • 半导体或与半导体有关的改进
    • EP0828287A3
    • 1998-09-02
    • EP97305923.1
    • 1997-08-05
    • TEXAS INSTRUMENTS INCORPORATED
    • Wilk, Glenn D.Wallace, Robert M.Wei, Yi, Motorola Flat Panel Display Division
    • H01L21/20H01L21/306
    • H01L21/02043H01L21/02046H01L21/02238H01L21/02255H01L21/02301H01L21/02312H01L21/02381H01L21/02532H01L21/0262H01L21/31662Y10S438/974
    • A method of preparing a surface for and forming a thin film on a single-crystal silicon substrate is disclosed. One embodiment of his method comprises forming an oxidized silicon layer (which may be a native oxide) on at least one region of the substrate, and thermally annealing the substrate in a vacuum while supplying a silicon-containing flux to the oxide surface, thus removing the oxidized silicon layer. Preferably, the thin film is formed immediately after removal of the oxidized silicon layer. The silicon-containing flux is preferably insufficient to deposit a silicon-containing layer on top of the oxidized silicon layer, and yet sufficient to substantially inhibit an SiO-forming reaction between the silicon substrate and the oxidized silicon layer. The method of the invention allows for growth or deposition of films which have exceptionally smooth interfaces (less than 0.1 nm rms roughness) with the underlying silicon substrate at temperatures less than 800°C, and is ideally suited for deposition of ultrathin films having thicknesses less than about 5 nm.
    • 公开了一种在单晶硅衬底上制备用于形成薄膜的表面的方法。 他的方法的一个实施例包括在衬底的至少一个区域上形成氧化硅层(其可以是自然氧化物),并且在真空中对衬底进行热退火,同时向氧化物表面供应含硅的焊剂,从而去除 氧化的硅层。 优选地,在去除氧化硅层之后立即形成薄膜。 含硅助熔剂优选不足以在氧化硅层上沉积含硅层,并且足以基本上抑制硅衬底和氧化硅层之间的SiO-形成反应。 本发明的方法允许在低于800℃的温度下与下面的硅衬底具有特别光滑的界面(小于0.1nm均方根粗糙度)的膜的生长或沉积,并且理想地适用于沉积厚度较小的超薄膜 大约5nm。