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    • 33. 发明公开
    • Eigenspannungsarmes Verbundbauteil
    • 固有张力臂复合部件
    • EP1225032A2
    • 2002-07-24
    • EP02000126.9
    • 2002-01-04
    • Bayer Aktiengesellschaft
    • Wagenblast, Joachim, Dr.Goldbach, Hubert
    • B32B3/10B32B3/26B32B3/30
    • B32B7/08B32B3/10B32B3/26B32B3/30Y10T428/24339
    • Es wird ein Verbundbauteil beschrieben, das wenigstens aufgebaut ist aus einem Grundkörper (2) bestehend aus einem hochfesten Werkstoff und einem an den Grundkörper angeformten Kunststoffteil (1) aus thermoplastischem Kunststoff, wobei der Grundkörper (2) an diskreten Verbindungsstellen (9; 13; 14; 15) mit dem Kunststoffteil (1) verbunden ist. An ausgewählten Durchbrüchen (9; 14; 15) tritt das Kunststoffteil (1) durch die Durchbrüche (9; 14; 15) hindurch, bildet im Bereich der Durchbrüche (9; 14, 15) senkrecht zur Ebene des Grundkörpers (2) einen Formschluss mit dem Grundkörper (2), und weist in wenigstens einer Richtung x oder y in der Ebene des Grundkörpers (2) eine kraftschlüssige Verbindung zum Grundkörper (2) auf, die eine Relativbewegung zwischen Grundkörper (2) und Kunststoffteil (1) entlang der Richtungen x und/oder y zulässt.
    • 公开的是,其至少由基体(2)由高强度材料制成的,并整体模制在基体上的塑料部件的复合部件(1)的热塑性材料,其中所述基体(2)在离散连接点(9; 13; 14 ; 15)与塑料部(1)连接。 在选定的穿孔(9; 14; 15)所采用的通过所述开口(9; 14; 15)的塑料部分(1)穿过其中,在所述开口的区域上形成(9; 14,15)垂直于所述基体(2)的形状闭合的平面 到所述基体(2),并具有在至少一个方向x或y中的基体的平面(2)上的力配合连接到所述基体(2)在其上的基体之间的相对运动(2)和塑料部件(1)沿着所述方向 x和/或y许可证。
    • 38. 发明公开
    • Semiconductor supporting device
    • HaltevorrichtungfürHalbleiter
    • EP0896362A1
    • 1999-02-10
    • EP98306154.0
    • 1998-07-31
    • NGK INSULATORS, LTD.
    • Katsuda, YujiAraki, KiyoshiOhashi, Tsuneaki
    • H01L21/00
    • G03F7/70691H01L21/6831Y10T279/23Y10T428/24322Y10T428/24331Y10T428/24339Y10T428/24347
    • A semiconductor-supporting device comprising a substrate made of an aluminum nitride-based ceramic material and having a semiconductor-placing surface, wherein an orientation degree of the aluminum nitride-based ceramic material specified by the following formula is not less than 1.1 and not more than 2.0. Orientation degree = [I'(002)/I'(100)]/[I(002)/I(100)] in which in an X-ray diffraction measurement, I'(002) is a diffraction intensity of a (002) face of the aluminum nitride-based ceramic material when X-rays are irradiated from the semiconductor-placing surface, I'(100) is a diffraction intensity of a (100) face of the aluminum nitride-based ceramic material when X-rays are irradiated from the semiconductor-placing surface, I(002) is a diffraction intensity of the (002) face of the aluminum nitride ceramic according to a JCPDS Card No. 25-1133, and I(100) is a diffraction intensity of the (100) face of the aluminum nitride ceramic according to a JCPDS Card No. 25-1133.
    • 一种半导体支撑装置,包括由氮化铝基陶瓷材料制成并具有半导体放置表面的衬底,其中由下式确定的所述氮化铝基陶瓷材料的取向度不小于1.1且不大于 超过2.0。 其中,在X射线衍射测定中,I'(002)是从半导体放置面照射X射线时的氮化铝系陶瓷材料的(002)面的衍射强度,I '(100)是从半导体放置面照射X射线时的氮化铝系陶瓷材料的(100)面的衍射强度,I(002)为(002)面的衍射强度 根据JCPDS卡25-1133的氮化铝陶瓷和I(100)是根据JCPDS卡25-1133的氮化铝陶瓷的(100)面的衍射强度。
    • 40. 发明公开
    • Metal reinforced plastic article and method of forming same
    • MetallverstärkterKunststoffgegenstand und Verfahren zu seiner Herstellung
    • EP0819515A1
    • 1998-01-21
    • EP97303751.8
    • 1997-06-03
    • Hettinga, Siebolt
    • Hettinga, Siebolt
    • B29C70/70B29C70/82B29C65/34
    • B29C37/0085B29C65/1412B29C65/1425B29C65/344B29C65/3476B29C65/364B29C65/3676B29C65/44B29C65/46B29C66/1122B29C66/45B29C66/71B29C66/742B29C66/8322B29C70/687B29K2105/206Y10T428/24289Y10T428/24322Y10T428/24339Y10T428/24347B29K2023/08B29K2023/06
    • A metal reinforced plastic article is provided and comprises a first plastic member (12) and a second plastic member (14) bonded together through a plurality of apertures in a metal reinforcing member (16). Preferably, the metal reinforcing member (16) has a plurality of angled protrusions on a first and second side. The protrusions (30) on the first side are pressed into the first plastic member (12) and first plastic member is bonded to the protrusions, and the protrusions (32) on the second side are pressed into the second plastic member (14) and the second plastic member is bonded to the protrusions (32).
      A method of forming a metal reinforced plastic article is provided and comprises providing a first plastic member (12) and a second plastic member (14). A metal reinforcing member (16) having a plurality of apertures therein, and having a plurality of angled protrusions (30,32) on a first and second side is provided. The metal reinforcing member (16) is heated and is placed between the plastic members, and the plastic members are pressed together resulting in the protrusions (30) on the first side of the metal reinforcing member pressing into the first plastic member (12) and the first plastic member bonding to the protrusions, and the protrusions (32) on the second side of the metal reinforcing member pressing into the second plastic member (14) and the second plastic member bonding to the protrusions. Additionally, the pressing of the plastic members together results in the plastic members bonding together through the apertures in the metal reinforcing member.
    • 提供金属增强塑料制品,并且包括通过金属加强构件(16)中的多个孔结合在一起的第一塑料构件(12)和第二塑料构件(14)。 优选地,金属加强构件(16)在第一侧和第二侧上具有多个成角度的突起。 第一侧的突起(30)被压入第一塑料构件(12)中,并且第一塑料构件接合到突起,并且第二侧上的突起(32)被压入第二塑料构件(14)中,并且 第二塑料构件结合到突起(32)上。 提供了一种形成金属增强塑料制品的方法,包括提供第一塑料构件(12)和第二塑料构件(14)。 提供了一种在其中具有多个孔并且在第一和第二侧上具有多个成角度的突起(30,32)的金属加强构件(16)。 金属加强件(16)被加热并且被放置在塑料件之间,并且塑料件被挤压在一起,从而在金属加强件的第一侧上压入第一塑料件(12)中的突起(30)和 第一塑料构件接合到突起,以及压在第二塑料构件(14)中的金属加强构件的第二侧上的突起(32)和与突起接合的第二塑料构件。 此外,将塑料构件压在一起导致塑料构件通过金属加强构件中的孔接合在一起。