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31. 发明授权

EP0728375B1 COOLING A LARGE MICROPROCESSOR IN A SMALL MODULE 失效
标题翻译：冷却微处理器的一个大，一个小团体
公开(公告)号：EP0728375B1
公开(公告)日：1999-07-21
申请号：EP95901925.8
申请日：1994-11-14
申请人： Elonex I.P. Holdings Limited
发明人： KIKINIS, Dan
IPC分类号： H02B1/00 , H05K7/20 , G06F1/20
CPC分类号： G06F1/203 , G06F1/1626 , G06F1/1632 , H04M1/2473 , H04M1/725 , H04M3/42323 , H04N2201/0049 , H04N2201/0051 , H04N2201/0053 , H05K5/0273 , H05K5/0291
摘要： A modular computer (11) with docking bays (12A, 12B) for receiving functional modules (13) and connecting the functional modules (13) to internal computer circuitry has translatable heat-sink structures (17, 19) for contacting docked functional modules (13) to extract waste heat generated by operation of the functional modules (13). The structures (17, 19) are mechanically actuated to retract to provide clearance for insertion and withdrawal of functional modules (13), and in some instances, the translation of the heat-sink structures (17, 19) is by electrically operable actuators, which may be actuated by signals from a CPU of the modular computer (11). In these instances, the computer (11) may be configured to require a security code or special input sequence to retract the heat-sink structures (17, 19) allowing a module (13) to be removed.

32. 发明公开

EP0908977A2 Card connector with improved grounding terminal 审中-公开
标题翻译： Kartensteckverbinder mit verbicultem Schutzleiteranschluss
公开(公告)号：EP0908977A2
公开(公告)日：1999-04-14
申请号：EP98118961.6
申请日：1998-10-07
申请人： MOLEX INCORPORATED
发明人： Hirata,Hideyuki , Watanabe,Soichi
IPC分类号： H01R23/70 , H01R13/648
CPC分类号： H05K5/0291 , H01R12/57 , H01R12/707 , H01R12/716 , H01R13/648 , H01R2201/06 , H05K5/0295
摘要： Disclosed is an improved card connector (1) comprising a shell assembly (2) and a pin connector assembly (3). The pin connector assembly includes an insulating housing mounting a upper and lower rows of signal terminals (19) and an upper and lower grounding terminal (27). The signal terminals include connection pins (20) are arranged in upper and lower rows and solder tails for connecting to an underlying printed circuit board. The upper grounding terminal (27) includes a downwardly extending rear wall (27b) having window apertures (27c) formed therein. The connection pins (20) pass through the window apertures (27c) without contacting the grounding terminal to and terminate at solder tails (21). The upper and lower grounding terminals are electrically coupled , and a single row of DIP-type solder tails extending from the lower grounding terminals can be soldered to selected conductors on a printed circuit board to couple both of the grounding terminals to a ground circuit of the printed circuit board.
摘要翻译：公开了一种改进的卡连接器（1），其包括壳体组件（2）和销连接器组件（3）。针连接器组件包括安装上下排的信号端子（19）和上下接地端子（27）的绝缘壳体。信号端子包括连接销（20），其布置在上排和下排以及用于连接到底层印刷电路板的焊尾。上接地端子（27）包括具有形成在其中的窗孔（27c）的向下延伸的后壁（27b）。连接销（20）穿过窗孔（27c），而不接触接地端子并终止于焊尾（21）。上接地端子和下接地端子电耦合，并且从下接地端子延伸的单排DIP型焊尾可以焊接到印刷电路板上的选定导体，以将两个接地端子耦合到接地端子的接地电路印刷电路板。

33. 发明公开

EP0731940A4 MODULAR PORTABLE COMPUTER 失效
标题翻译：模块化便携式计算机
公开(公告)号：EP0731940A4
公开(公告)日：1999-03-17
申请号：EP95902702
申请日：1994-11-29
申请人： ELONEX TECHNOLOGIES INC
发明人： KIKINIS DAN
IPC分类号： G06F1/16 , G06F1/18 , G06F3/033 , G06F13/40 , H04M1/247 , H04M1/725 , H04M3/42 , H04M11/06 , H04N1/00 , H04N1/107 , H04N1/195 , H04Q11/04 , H05K5/02 , H05K7/10
CPC分类号： H04N1/00127 , G06F1/1626 , G06F1/1632 , G06F1/1656 , G06F1/183 , G06F3/03541 , G06F3/03543 , G06F3/03545 , G06F3/03549 , G06F13/409 , H01H2223/052 , H04M1/2473 , H04M1/725 , H04M3/42314 , H04M3/42323 , H04M11/06 , H04M11/066 , H04N1/00236 , H04N1/00241 , H04N1/00326 , H04N1/00392 , H04N1/00538 , H04N1/107 , H04N1/195 , H04N2201/0049 , H04N2201/0051 , H04N2201/0053 , H04N2201/0063 , H04N2201/0093 , H04Q11/0428 , H04Q2213/13003 , H04Q2213/13034 , H04Q2213/1308 , H04Q2213/13093 , H04Q2213/13096 , H04Q2213/13098 , H04Q2213/13103 , H04Q2213/13106 , H04Q2213/13107 , H04Q2213/13174 , H04Q2213/13175 , H04Q2213/13179 , H04Q2213/13199 , H04Q2213/13209 , H04Q2213/1322 , H04Q2213/13299 , H04Q2213/13322 , H04Q2213/13389 , H04Q2213/13396 , H05K5/0273 , H05K5/0291
摘要： A modular computer has a framework (11) with module bays (19, 21, 23, 25) for receiving CPU modules, power modules, and peripheral function modules such as floppy and hard disk drives. The framework (11) has a built-in compressed bus and a variety of function modules which can be plugged into any of the module bays (19, 21, 23, 25). Function modules include, but are not limited to, CPU, power, floppy disk, hard disk, RAM memory, LAN communication, modem, FAX communication, and data acquisition. In some embodiments function modules are provided for communicating with separate inputs, such as voice, keyboards, and pen-pads. In one aspect the module bays and the function modules are configured according to dimensional and connective standards of the Personal Computer Memory Card International Association.

34. 发明授权

EP0600602B1 Electrical connector for a card reader 失效
标题翻译：对于读卡器的电连接器
公开(公告)号：EP0600602B1
公开(公告)日：1997-12-29
申请号：EP93308523
申请日：1993-10-26
申请人： WHITAKER CORP
发明人： WORATYLA JOHN ANTHONY , KAUFMAN JOHN WILSON , BROSCHARD JOHN LAWRENCE III
IPC分类号： H01R13/629 , G06K7/00 , H01R12/70 , H01R12/71 , H05K5/02 , H05K7/14 , H01R4/48
CPC分类号： H05K5/0291 , G06K7/0047 , G06K7/0082 , G06K13/0806 , H01R12/7005 , H01R12/707 , H01R12/716 , H05K7/1418

35. 发明公开

EP0784826A1 REMOVABLE MEDIA EJECTION SYSTEM 失效
标题翻译：弹射系统可再生MEDIA
公开(公告)号：EP0784826A1
公开(公告)日：1997-07-23
申请号：EP95938780.0
申请日：1995-10-04
申请人： APPLE COMPUTER, INC.
发明人： VISWANADHAM, Krishna , LAW, David , BOYLE, Dennis , HERRON, Matt
IPC分类号： G06F1 , G06K7 , G06K13 , H02N2 , H05K5
CPC分类号： H05K5/0265 , G06K7/0047 , G06K7/0086 , G06K13/08 , G06K13/0806 , H05K5/0291
摘要： A media ejection system includes a peripheral unit having a housing (12), an ejection mechanism (14), and a memory wire (16) coupled to the ejection mechanism. The system further includes a digital processor (42) for issuing ejection commands, and a controller (50) responsive to the ejection command for controlling a current flow through the memory wire. When sufficient current flows through the memory wire, it contracts to activate the ejection mechanism, thereby ejecting a removalbe medium (such as a PMCMCIA card) from the housing of the peripheral unit. A method of the invention includes the steps of receiving an injection request, issuing an ejection command in response to the ejection request, where the ejection command includes parameters for controlling current flow through the metal alloy, and electrically energizing the memory ally in accordance with the parameters such that the memory alloy undergoes a dimensional change to activate a removable medium ejection mechanism.

36. 发明授权

EP0627785B1 Connector apparatus for IC packs 失效
标题翻译：为IC封装连接器装置
公开(公告)号：EP0627785B1
公开(公告)日：1997-07-16
申请号：EP94108070.7
申请日：1994-05-26
申请人： MOLEX INCORPORATED
发明人： Gardner, Michael J. , Kachlic, Jerry Dean , O'Brien, Paul M.
IPC分类号： H01R13/62 , H01R13/506 , H01L23/32
CPC分类号： H05K5/0265 , G06K13/08 , G06K13/0806 , H01R12/721 , H05K5/0291

37. 发明公开

EP0648404A4 MODULAR NOTEBOOK COMPUTER. 失效
标题翻译：模块化便携式计算机。
公开(公告)号：EP0648404A4
公开(公告)日：1996-09-18
申请号：EP93916815
申请日：1993-06-29
申请人： ELONEX TECHNOLOGIES INC
发明人： KIKINIS DAN
IPC分类号： G06F1/16 , G06F1/18 , G06F3/033 , G06F13/40 , H04M1/247 , H04M1/725 , H04M3/42 , H04M11/06 , H04N1/00 , H04N1/107 , H04N1/195 , H04Q11/04 , H05K5/02 , H05K7/10
CPC分类号： G06F3/03541 , G06F1/1626 , G06F1/1632 , G06F1/1656 , G06F1/183 , G06F3/03543 , G06F3/03545 , G06F3/03549 , G06F13/409 , H01H2223/052 , H04M1/2473 , H04M1/725 , H04M3/42314 , H04M3/42323 , H04M11/06 , H04M11/066 , H04N1/00127 , H04N1/00236 , H04N1/00241 , H04N1/00326 , H04N1/00392 , H04N1/00538 , H04N1/107 , H04N1/195 , H04N2201/0049 , H04N2201/0051 , H04N2201/0053 , H04N2201/0063 , H04N2201/0093 , H04Q11/0428 , H04Q2213/13003 , H04Q2213/13034 , H04Q2213/1308 , H04Q2213/13093 , H04Q2213/13096 , H04Q2213/13098 , H04Q2213/13103 , H04Q2213/13106 , H04Q2213/13107 , H04Q2213/13174 , H04Q2213/13175 , H04Q2213/13179 , H04Q2213/13199 , H04Q2213/13209 , H04Q2213/1322 , H04Q2213/13299 , H04Q2213/13322 , H04Q2213/13389 , H04Q2213/13396 , H05K5/0273 , H05K5/0291
摘要： A modular notebook computer has a framework (11) with module bays (19, 21, 23, 25) for receiving CPU modules, power modules, and peripheral function modules such as floppy and hard disk drives. The framework has a built-in compressed bus and a variety of function modules which can be plugged into any one of the module bays. Function modules include, but are not limited to, CPU, power, floppy disk, hard disk, RAM memory, LAN communication, modem, FAX communication, and data acquisition.

38. 发明公开

EP0728375A1 COOLING A LARGE MICROPROCESSOR IN A SMALL MODULE 失效
标题翻译：免疫抑制剂雷帕霉素和杂环酯含组合物Pharmaceutische
公开(公告)号：EP0728375A1
公开(公告)日：1996-08-28
申请号：EP95901925.0
申请日：1994-11-14
申请人： ELONEX TECHNOLOGIES, INC.
发明人： KIKINIS, Dan
IPC分类号： G06F1 , H02B1 , H04M1 , H05K7 , H04M3
CPC分类号： G06F1/203 , G06F1/1626 , G06F1/1632 , H04M1/2473 , H04M1/725 , H04M3/42323 , H04N2201/0049 , H04N2201/0051 , H04N2201/0053 , H05K5/0273 , H05K5/0291
摘要： A modular computer (11) with docking bays (12A, 12B) for receiving functional modules (13) and connecting the functional modules (13) to internal computer circuitry has translatable heat-sink structures (17, 19) for contacting docked functional modules (13) to extract waste heat generated by operation of the functional modules (13). The structures (17, 19) are mechanically actuated to retract to provide clearance for insertion and withdrawal of functional modules (13), and in some instances, the translation of the heat-sink structures (17, 19) is by electrically operable actuators, which may be actuated by signals from a CPU of the modular computer (11). In these instances, the computer (11) may be configured to require a security code or special input sequence to retract the heat-sink structures (17, 19) allowing a module (13) to be removed.

39. 发明公开

EP0663141A1 CARD SYSTEM WITH RETAINING LATCHES 失效
标题翻译：与锁元件卡设备。
公开(公告)号：EP0663141A1
公开(公告)日：1995-07-19
申请号：EP93922733.0
申请日：1993-09-24
申请人： BERG TECHNOLOGY, INC.
发明人： LWEE, Nai, Hock
IPC分类号： G06K17 , H01R12 , H01R13 , H01R43 , H05K5 , H05K7
CPC分类号： H05K5/0291 , H05K7/1405
摘要： A memory card system (12) is provided which prevents slippage of a memory card (16) from a header device (14). The header has latch windows (26) at its opposite side end faces. The card has a package having a pair of slits (38) formed at one end face (32b) and latch windows (40) formed one at each side wall (32c) in a direction transverse to the one end face of the card and at those areas corresponding to latch windows of the header device. Latch members (36) provided in the package of the card are normally pushed by compression springs and latched to the latch windows of the header device via the latch windows of the package. The card is unlatched from the header device by manually moving the latch members which are projected out of the slits of the package against an action of the compression springs.

40. 发明公开

EP0648404A1 MODULAR NOTEBOOK COMPUTER 失效
标题翻译：模块化便携式计算机。
公开(公告)号：EP0648404A1
公开(公告)日：1995-04-19
申请号：EP93916815.0
申请日：1993-06-29
申请人： OAKLEIGH SYSTEMS, INC.
发明人： KIKINIS, Dan
IPC分类号： G06F1 , G06F3 , G06F13 , H04M1 , H04M3 , H04M11 , H04N1 , H04Q11 , H05K5
CPC分类号： G06F3/03541 , G06F1/1626 , G06F1/1632 , G06F1/1656 , G06F1/183 , G06F3/03543 , G06F3/03545 , G06F3/03549 , G06F13/409 , H01H2223/052 , H04M1/2473 , H04M1/725 , H04M3/42314 , H04M3/42323 , H04M11/06 , H04M11/066 , H04N1/00127 , H04N1/00236 , H04N1/00241 , H04N1/00326 , H04N1/00392 , H04N1/00538 , H04N1/107 , H04N1/195 , H04N2201/0049 , H04N2201/0051 , H04N2201/0053 , H04N2201/0063 , H04N2201/0093 , H04Q11/0428 , H04Q2213/13003 , H04Q2213/13034 , H04Q2213/1308 , H04Q2213/13093 , H04Q2213/13096 , H04Q2213/13098 , H04Q2213/13103 , H04Q2213/13106 , H04Q2213/13107 , H04Q2213/13174 , H04Q2213/13175 , H04Q2213/13179 , H04Q2213/13199 , H04Q2213/13209 , H04Q2213/1322 , H04Q2213/13299 , H04Q2213/13322 , H04Q2213/13389 , H04Q2213/13396 , H05K5/0273 , H05K5/0291
摘要： A modular notebook computer has a framework (11) with module bays (19, 21, 23, 25) for receiving CPU modules, power modules, and peripheral function modules such as floppy and hard disk drives. The framework has a built-in compressed bus and a variety of function modules which can be plugged into any one of the module bays. Function modules include, but are not limited to, CPU, power, floppy disk, hard disk, RAM memory, LAN communication, modem, FAX communication, and data acquisition.

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