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31. 发明授权

EP1468042B1 MATERIAL ZUR HERSTELLUNG VON FUNKTIONSELEMENTEN MIT MINDESTENS EINEM AUFSCHÄUMBAREN BEREICH SOWIE VERWENDUNG DER FUNKTIONSELEMENTE ZUR POSITIONIERUNG UND MONTAGE VON OBJEKTEN 有权
标题翻译：材料生产操作具有至少一个可膨胀区和定位功能元件的使用和对象的安装
公开(公告)号：EP1468042B1
公开(公告)日：2007-04-18
申请号：EP03731660.1
申请日：2003-01-23
申请人： JENOPTIK Automatisierungstechnik GmbH
发明人： FEISTEL, Ulf , DIENER, Roland , WEINZIERL, Uwe
IPC分类号： C08J9/00 , C09J5/08
CPC分类号： G02B6/4405 , G02B6/4226 , H05K1/0281 , H05K1/0289 , H05K3/4084 , H05K2201/0112 , H05K2201/057 , H05K2201/2009 , H05K2203/107 , H05K2203/1189
摘要： The aim of the invention is to provide positioning and mounting options with improved handling characteristics even at places that are difficult to access or in other difficult conditions. Said aim is achieved by using functional elements comprising at least one area that can be foamed by supplying energy. At least one of said areas is used as a positioning element for positioning an object or for stiffening flexible or easily bendable materials in a shape-stabilizing manner.

32. 发明公开

EP1729556A2 Dispositif d'interconnexion reconfigurable de faisceaux électriques 有权
标题翻译： Rekonfigurierbare Verbindungsvorrichtung von elektrischenKabelbäumen
公开(公告)号：EP1729556A2
公开(公告)日：2006-12-06
申请号：EP06010732.3
申请日：2006-05-24
申请人： EUROCOPTER
发明人： Imbert, Nicolas , Chuc, Charles
IPC分类号： H05K7/14 , H01R12/06 , H01R12/16
CPC分类号： H05K7/1459 , H01R12/52 , H01R31/005 , H05K1/0289 , H05K1/14 , H05K1/148 , H05K7/1441 , H05K2201/044 , H05K2201/09236 , H05K2201/09254 , H05K2201/09972
摘要： La présente invention est relative à un dispositif (20) d'interconnexion de faisceaux électriques qui comporte plusieurs cartes (34 à 38) embrochables de brassage et de connexion des faisceaux électriques ; le dispositif comporte en outre un circuit imprimé "principal" (28, 28b) équipé de connecteurs ou "slots" (29 à 33) conçus et agencés pour recevoir les cartes embrochables, ce circuit imprimé comportant plusieurs pistes (46) parallèles permettant chacune de mettre au même potentiel deux pistes (61 à 63, 68) ou ébauches (70 à 72) de pistes respectivement prévues sur deux cartes embrochables distinctes embrochées dans les connecteurs du circuit imprimé principal, chacune de ces pistes (46) parallèles étant en contact avec une broche (50, 150) respective de plusieurs connecteurs du circuit imprimé principal.
摘要翻译：该设备具有配备有用于接收子板的连接器的主板。主板具有一组平行轨道，其中每个轨道允许在主板的连接器中放置轨道（61-63,68）和空白（70-72）。每个平行轨道与连接器的相应插脚接触。每个轨道（61-63,68）包括装备有具有不连续轨道的连续轨道和扩大部分（80）的颗粒状扩大部分（80）。桥（90）连接配备有连续轨道的扩大部分（80）。

33. 发明公开

EP1201505A3 Electrical junction box for a vehicle 有权
标题翻译： Elektrische Kraftfahrzeugverbindungsdose
公开(公告)号：EP1201505A3
公开(公告)日：2003-11-19
申请号：EP01308982.6
申请日：2001-10-23
申请人： Sumitomo Wiring Systems, Ltd.
发明人： Sumida, Tatsuya , Saka, Yuuji , Kobayashi, Noriko , Mayumi, Hisaki
IPC分类号： B60R16/02
CPC分类号： B60R16/0238 , B60R16/0239 , H05K1/0289 , H05K7/026 , H05K2201/0352 , H05K2201/10272 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156
摘要： An electrical junction box for a vehicle has a casing (14, 15, 17, 18), and an electrical circuit comprising a fuse connection circuit, a relay connection circuit and a connector connection circuit. The casing has at opposite sides connector sockets (70, 80) for electrical connectors. In the casing is a connector module (11) comprising a plurality of insulation substrates (20) stacked one on another and parallel elongate bus bars (22) on a first surface of each substrate and parallel flexible conductors (21) on a second surface of the substrate and extending orthogonally to said bus bars. Each said insulation substrate has apertures through it at which the bus bars and flexible conductors are connected to each other by welding to provide desired circuit connections (20b). The bus bars (22) extend from the insulation substrates and provide tabs projecting into the connector sockets (70, 80). A thin junction box is obtained.
摘要翻译：一种用于车辆的电接线盒具有壳体（14,15,17,18），以及包括熔丝连接电路，继电器连接电路和连接器连接电路的电路。壳体在相对侧具有用于电连接器的连接器插座（70,80）。在壳体中是连接器模块（11），其包括多个彼此层叠的绝缘基板（20）和平行的每个基板的第一表面上的细长汇流条（22），并且在第二表面上的平行的柔性导体并且与所述母线垂直延伸。每个所述绝缘衬底具有穿过其的孔，通过焊接，汇流条和柔性导体彼此连接以提供期望的电路连接（20b）。汇流条（22）从绝缘基板延伸并且提供突出到连接器插座（70,80）中的突片。获得了一个薄接线盒。

34. 发明公开

EP1201505A2 Electrical junction box for a vehicle 有权
标题翻译：车辆的电气接线盒
公开(公告)号：EP1201505A2
公开(公告)日：2002-05-02
申请号：EP01308982.6
申请日：2001-10-23
申请人： Sumitomo Wiring Systems, Ltd.
发明人： Sumida, Tatsuya , Saka, Yuuji , Kobayashi, Noriko , Mayumi, Hisaki
IPC分类号： B60R16/02
CPC分类号： B60R16/0238 , B60R16/0239 , H05K1/0289 , H05K7/026 , H05K2201/0352 , H05K2201/10272 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156
摘要： An electrical junction box for a vehicle has a casing (14, 15, 17, 18), and an electrical circuit comprising a fuse connection circuit, a relay connection circuit and a connector connection circuit. The casing has at opposite sides connector sockets (70, 80) for electrical connectors. In the casing is a connector module (11) comprising a plurality of insulation substrates (20) stacked one on another and parallel elongate bus bars (22) on a first surface of each substrate and parallel flexible conductors (21) on a second surface of the substrate and extending orthogonally to said bus bars. Each said insulation substrate has apertures through it at which the bus bars and flexible conductors are connected to each other by welding to provide desired circuit connections (20b). The bus bars (22) extend from the insulation substrates and provide tabs projecting into the connector sockets (70, 80). A thin junction box is obtained.
摘要翻译：一种用于车辆的电接线盒具有壳体（14,15,17,18）以及包括熔断器连接电路，继电器连接电路和连接器连接电路的电路。壳体在相对侧具有用于电连接器的连接器插座（70,80）。在壳体中是连接器模块（11），其包括在每个基板的第一表面上的多个绝缘基板（20）以及在每个基板的第一表面上的平行细长母线（22）以及在第二表面上的平行柔性导体（21）衬底并且正交于所述汇流条延伸。每个所述绝缘衬底具有穿过其的孔，汇流条和柔性导体在该孔处通过焊接彼此连接以提供期望的电路连接（20b）。汇流条（22）从绝缘衬底延伸并且提供突出到连接器插座（70,80）中的突片。获得一个薄型接线盒。

35. 发明公开

EP1100096A1 ELECTRONIC DEVICE AND MANUFACTURE THEREOF 有权
标题翻译： ELEKTRONISCHESGERÄTUND HERSTELLUNG
公开(公告)号：EP1100096A1
公开(公告)日：2001-05-16
申请号：EP00919143.8
申请日：2000-04-19
申请人： Matsushita Electric Industrial Co., Ltd.
发明人： HONDA, Kazuyoshi , ECHIGO, Noriyasu , ODAGIRI, Masaru , SUGIMOTO, Takanori
IPC分类号： H01G4/38
CPC分类号： H01G4/33 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16 , H01L2924/15311 , H01L2924/3011 , H05K1/0231 , H05K1/0289 , H05K1/141 , H05K1/162 , H05K3/0026 , H05K3/403 , H05K3/467 , H05K2201/0179 , H05K2201/049 , H05K2201/09236 , H05K2201/10734
摘要： Electrode layers (1, 2) are arranged on both sides of a dielectric layer (3) facing each other so as to configure a capacitor. Lead electrodes (4, 5) are formed in the electrode layers (1, 2). A penetrating electrode (6) that is insulated from the electrode layers (1, 2) is formed. An electronic component (10) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode (6), the semiconductor chip or the wiring board is connected to the lead electrodes (4, 5). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.
摘要翻译：电极层（1,2）布置在彼此面对的介电层（3）的两侧，以构成电容器。在电极层（1,2）中形成引线电极（4,5）。形成与电极层（1,2）绝缘的穿透电极（6）。以这种方式配置的电子部件（10）安装在布线板上，并且可以在其上安装半导体芯片。随着通过穿透电极（6）将半导体芯片连接到布线板，半导体芯片或布线板连接到引线电极（4,5）。以这种方式，在抑制安装区域的尺寸增加的同时，电容器等可以布置在半导体芯片附近。因此，更容易地以高频率驱动半导体芯片。

36. 发明公开

EP1065768A2 Connection structure for bus bars 有权
标题翻译： VerbindungsstrukturfürStromsammelschienen
公开(公告)号：EP1065768A2
公开(公告)日：2001-01-03
申请号：EP00105142.4
申请日：2000-03-10
申请人： Harness System Technologies Research, Ltd. , SUMITOMO WIRING SYSTEMS, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Onizuka, Takahiro , Yamane, Shigeki , Oka, Yoshito , Kasai, Koji
IPC分类号： H02B1/20 , H01R25/16 , H02G5/00
CPC分类号： H05K3/4084 , H01R9/226 , H05K1/0289 , H05K3/202 , H05K3/328 , H05K7/026 , H05K2201/0394 , H05K2203/063
摘要： Bus bars (16(A to D)) and (17(A to C)) on the two faces of an insulating plate (15) can be electrically connected by arranging the longitudinal bus bars (17(A to C)) on one face of the insulating plate (15) and the transverse bus bars (16(A to D)) on the other face of the insulating plate (15), by fitting recesses (16a to 16d) of the bus bars (16(A to D)) into through holes (15a) of the insulating plate (15) to bring the recesses (16a to 16d) into contact with the bus bars (17(A to C)) at suitable positions, i.e. at intersecting portions of the bus bars (16(A to D)) and (17(A to C)), and to weld the recesses (16a to 16d) to the bus bars (17(A to C)).
摘要翻译：绝缘板（15）的两面上的母线（16（A〜D））和（17（A〜C））可以通过将纵向母线（17（A〜C））布置在一个上而进行电连接在绝缘板（15）的另一面上，通过将母线（16（A〜D））的凹部（16a〜16d）嵌合在绝缘板（15）和横向汇流条（16（A〜D） D））插入到绝缘板（15）的通孔（15a）中，以使凹部（16a至16d）与母线（17（A至C））接合在合适的位置，即在总线的相交部分（16（A〜D））和（17（A〜C）），并将凹部（16a〜16d）焊接到母线（17（A〜C））。

37. 发明公开

EP0740497A1 Elektrisches Verbindungssubstrat 失效
公开(公告)号：EP0740497A1
公开(公告)日：1996-10-30
申请号：EP96810156.8
申请日：1996-03-14
申请人： DYCONEX PATENTE AG , Hewlett-Packard GmbH
发明人： Schmidt, Walter , Dippon, Siegfried
IPC分类号： H05K3/42 , H05K3/40
CPC分类号： H05K3/421 , H05K1/0289 , H05K3/0041 , H05K3/0082 , H05K3/064 , H05K3/108 , H05K3/403 , H05K3/427 , H05K2201/0394 , H05K2201/09509 , H05K2201/09645 , H05K2201/09809 , H05K2201/09827 , H05K2203/0346 , H05K2203/0554 , H05K2203/1184
摘要： Die Erfindung betrifft mehrlagige Leiterplatten oder Folienleiterplatten und Verfahren zum Herstellen derselben, wobei die Leiterplatten oder Folienleiterplatten aus alternierend angeordneten Leit/Isolatorschichten. mit Durchleitungen (4,14) von Leitschichten (1) zu weiteren Leitschichten (2) durch diese elektrisch isolierende intermediäre Isolatorschichten (3) bestehen und in den Leitschichten (1,2) photochemisch strukturierten XY-Leiter (4.1,4.2,14.1, 14.2,14.3,14.5) und in schrägen oder senkrechten Oberflächen (4') von Öffnungen (4*) in Isolatorschichten (3) photochemisch strukturierte Durchleitungsleiter (4.4,14.4,14.14,14.24) verlaufen, derart, dass mindestens ein XY-Leiter (4.1,14,3) einer Leitschicht (1) an eine Durchleitung (4,14) mündet, dass jeder dieser XY-Leiter (4.1,14.3) über Durchleitungsleiter (4.4,14.4) mit jeweils mindestens einem XY-Leiter (4.2,14.5) der weiteren Leitschicht (2) elektrisch verbunden sein kann.
摘要翻译：衬底具有形成在导电层（1,2）中的结构化电导体（14.1,14.2,14.3），其中在通过中间绝缘层（3）中的开口（4'）提供的不同平面中的导体层之间的电连接。在这些开口的每一个内提供贯通连接导体（14.4），其垂直于导体层平面延伸并且在任一端耦合到每个导电层的相应电导体（14.3）。

38. 发明公开

EP0715773A1 CROSS-CONNECT SYSTEM 失效
标题翻译：按连接系统
公开(公告)号：EP0715773A1
公开(公告)日：1996-06-12
申请号：EP94927163.0
申请日：1994-08-23
申请人： Conx Corpopration
发明人： ROGERS, Wesley, D. , HARD, Douglas, G.
IPC分类号： H01H67 , H01R29 , H01R31 , H01R43 , H04M3 , H04Q1 , H04Q5 , H05K1 , H05K3
CPC分类号： H04Q1/147 , H01R12/523 , H01R29/00 , H01R31/08 , H01R43/205 , H04M3/42153 , H04Q1/023 , H04Q1/136 , H04Q1/145 , H05K1/0289 , H05K3/308 , Y10T29/49153
摘要： A switching matrix (10) includes at least two parallel circuit boards (11, 13, 15, 17) each having plural conductive traces and multiple matrix holes (20) therethrough arranged to permit traces (21, 22) on one board to be connected to traces (23, 24) on the second board. Connection is achieved by means of a flexible non-conductive circuit jumper pin (40) having a resilient conductive sleeve (47, 49) arranged to extend between an aligned pair of holes in the two boards. The holes are conductively plated to define female contacts to radially compress the conductive sleeve. Circuit jumper pins may be moved between different matrix positions manually or by a pick and place mechanism (50) controlled from a remote location. In one embodiment, connections are made in pairs, there being four circuit boards and two conductive sleeves (47, 49) on each pin, each sleeve interconnecting a pair of traces on a respective pair of boards.

39. 发明授权

EP0600052B1 VERFAHREN ZUR HERSTELLUNG VON NACHTRÄGLICH KONDITIONIERBAREN KONTAKTSTELLEN AN SCHALTUNGSTRÄGERN UND SCHALTUNGSTRÄGER MIT SOLCHEN KONTAKTSTELLEN 失效
标题翻译：用于生产NACHTRÄGLICHconditionable接触点电路载体和电路载体与联系点
公开(公告)号：EP0600052B1
公开(公告)日：1996-04-17
申请号：EP93909756.4
申请日：1993-06-10
申请人： DYCONEX PATENTE AG
发明人： SCHMIDT, Walter , MARTINELLI, Marco
IPC分类号： H05K3/40
CPC分类号： H05K3/4084 , H05K1/0287 , H05K1/0289 , H05K1/0393 , H05K1/05 , H05K1/115 , H05K3/0041 , H05K3/0061 , H05K3/0064 , H05K3/0097 , H05K3/386 , H05K3/427 , H05K3/429 , H05K3/4652 , H05K2201/0195 , H05K2201/0355 , H05K2201/0394 , H05K2201/0397 , H05K2201/066 , H05K2201/0909 , H05K2201/09327 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/09609 , H05K2201/09627 , H05K2201/09781 , H05K2201/09836 , H05K2201/09945 , H05K2201/10666 , H05K2203/0554 , H05K2203/0746 , H05K2203/1184 , H05K2203/1545 , H05K2203/1572
摘要： The process for producing subsequently contactable contact points between two conductive track planes on a circuit substrate separated by an electrically insulating layer makes it possible to produce, for example, a basic conductor pattern which can subsequently be easily adapted to requirements. By laying windows in the conductive track planes out in such a way that, when the electrically insulating layer is subsequently through-etched due to under-etching, rod-like parts connected to the aperture periphery are revealed between or in the apertures which can be brought into contact with electrically conductive parts of the other conductive track plane, these conductive tracks can be electrically interconnected by mechanical bending.

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