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31. 发明授权

EP1333468B1 Stage device 有权
标题翻译：舞台设备
公开(公告)号：EP1333468B1
公开(公告)日：2010-05-26
申请号：EP03001225.6
申请日：2003-01-20
申请人： EBARA CORPORATION
发明人： Shinozaki, Hiroyuki , Sobukawa, Hirosi , Yoshikawa, Shoji
IPC分类号： H01L21/00 , H01L21/68 , G03F7/20
CPC分类号： H01L21/682 , H01L21/68 , H01L21/681

32. 发明授权

EP2027966B1 Sample traveling stage with flexure mechanism module to absorb the deformation of the slide 有权
标题翻译：样品与机制灵活的网络模块用于接收Gleitdeformation
公开(公告)号：EP2027966B1
公开(公告)日：2010-04-21
申请号：EP08013979.3
申请日：2008-08-05
申请人： Soonhan Engineering Corp. , Korea Advanced Institute of Science and Technology (KAIST)
发明人： Jung, Hun Taek , Kwon, Dae Gab , Kim, Jung Jae , Choi, Young Man , Ahn, Da Hoon
IPC分类号： B23Q1/62 , B23Q11/00 , H01L21/68
CPC分类号： H01L21/681 , B23Q2210/002 , G01R31/2893

33. 发明公开

EP1280186A3 Wafer transfer system, wafer transfer method and automatic guided vehicle system 审中-公开
标题翻译：晶片输送系统晶片输送方法和一种自动导向输送系统
公开(公告)号：EP1280186A3
公开(公告)日：2010-02-24
申请号：EP02014852.4
申请日：2002-07-04
申请人： MURATA KIKAI KABUSHIKI KAISHA , TOKYO ELECTRON LIMITED
发明人： Tomita, Masaru , Akiyama, Shuji, Tokyo Electron AT Limited,
IPC分类号： H01L21/00
CPC分类号： H01L21/681 , H01L21/67259 , H01L21/67294 , Y10S414/137 , Y10S414/141
摘要： The present invention relates to a wafer transfer system which reduces time for orienting a wafer in transferring the wafer and improves the efficiency of transferring the wafer.
The central position of a wafer 10 set on a place table 41 is calculated, the turn angle of a place table 41 when the wafer 10 is in the predetermined orientation is calculated based on the calculation result of the central position and positional information of an ID mark 11 received in advance and the quantity of expanding and contracting a transfer arm 30 and the turn angle of a turntable 39 are calculated for setting the wafer 10 such that the ID mark 11 is in the predetermined position and orientation to an optical character reader OCR 43, and the turn angle of the place table 41 calculated base on the turn angle of the turntable 39 is corrected, the place table 41 is turned only by the corrected turn angle and the wafer 10 is turned and transferred to the OCR 43 by the transfer unit 3 (Fig. 2).

34. 发明授权

EP1986215B1 Substrate processing apparatus 有权
公开(公告)号：EP1986215B1
公开(公告)日：2010-01-20
申请号：EP08013566.8
申请日：2001-05-28
申请人： EBARA CORPORATION
发明人： Mishima, Koji , Kunisawa, Junji , Makino, Natsuki , Kimura, Norio , Inoue, Hiroaki , Nakamura, Kenji , Matsumoto, Moriji , Nanjo, Takahiro , Odagaki, Mitsuko
IPC分类号： H01L21/00 , H01L21/68
CPC分类号： H01L21/67109 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67778 , H01L21/681

35. 发明公开

EP1424723A3 Ion beam for target recovery 有权
标题翻译：对准的清洁用离子束
公开(公告)号：EP1424723A3
公开(公告)日：2009-08-05
申请号：EP03026408.9
申请日：2003-11-19
申请人： FEI COMPANY
发明人： Miller, Brian
IPC分类号： H01L21/00 , H01L21/02 , H01L21/3213 , H01L23/544 , G03F9/00 , H01L21/027
CPC分类号： H01L21/02057 , G03F9/708 , H01J2237/30438 , H01J2237/3174 , H01L21/32131 , H01L21/67069 , H01L21/67282 , H01L21/681 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2223/5446 , H01L2223/54466 , H01L2223/5448 , H01L2223/54493 , H01L2924/0002 , H01L2924/00
摘要： A charged particle beam apparatus and method for locally removing material from a predetermined location on a workpiece, such as the removal of a metallization layer covering an alignment mark on a wafer. The invention is particularly suited for high-volume mass production of semiconductor chips or electromechanical devices. According to one embodiment of the invention, a layer of material covering an alignment mark on a wafer is removed by ion beam sputtering using a non-LMIS beam directed at an oblique angle to the sample surface.

36. 发明授权

EP1137052B1 Automatic calibration system for wafer transfer robot 有权
标题翻译：用于晶片传送机械手自动校准系统
公开(公告)号：EP1137052B1
公开(公告)日：2008-04-30
申请号：EP00105965.8
申请日：2000-03-24
申请人： Berkeley Process Control, Inc.
发明人： Sagues, Paul , Peurach, John P. , Aggarwal, Sanjay D.
IPC分类号： H01L21/00
CPC分类号： H01L21/681 , H01L21/67766

37. 发明公开

EP1333468A3 Stage device and angle detecting device 有权
标题翻译：工作台装置和角感测装置
公开(公告)号：EP1333468A3
公开(公告)日：2008-01-16
申请号：EP03001225.6
申请日：2003-01-20
申请人： EBARA CORPORATION
发明人： Shinozaki, Hiroyuki , Sobukawa, Hirosi , Yoshikawa, Shoji
IPC分类号： H01L21/00 , H01L21/68 , G03F7/20
CPC分类号： H01L21/682 , H01L21/68 , H01L21/681
摘要： The present invention provides a stage device applicable to a semiconductor manufacturing apparatus. A stage device 10 comprises a Y-axis stage 20 and an X-axis stage 40, said Y-axis stage 20 including a fixed component 21 and a movable component 26 movable along the Y-axis, said X-axis stage 40 including a fixed component 41 and a movable component 43 movable along the X-axis, wherein the fixed component 41 of the X-axis stage 40 is disposed in the movable component 26 side of the Y-axis stage 20, the Y-axis is designed as a scanning axis, while the X-axis is designed as a stepping axis, and a non-contact sealing device is arranged between the fixed component 21 and the movable component 26 of the Y-axis stage 20.

38. 发明公开

EP1856730A1 VERFAHREN ZUR POSITIONIERUNG EINES WAFERS 有权
标题翻译：方法用于定位的晶圆
公开(公告)号：EP1856730A1
公开(公告)日：2007-11-21
申请号：EP06700022.4
申请日：2006-01-09
申请人： OC Oerlikon Balzers AG
发明人： SCHOLTE VAN MAST, Bart , CHRIST, Holger , SCHMUCKI, Ruedi
IPC分类号： H01L21/68 , H01L21/00
CPC分类号： H01L21/681 , H01L21/682
摘要： The invention relates to a method for positioning a wafer (3) with a reference mark (6) in a vacuum processing unit with a transport chamber containing a transport device (2, 20, 21) for moving the wafers (3) in a plane to a process chamber arranged on said chamber and a single sensor (1), arranged within the transport chamber before the process chamber for recording the position of the wafer (3) by means of recording the edge thereof at a first detection point (4) and a second detection point (5), such that the actual position of the wafer (12) with a known wafer diameter can be determined with electronic analysis of both measured detection points (4, 5) and the transport device (2, 20, 21) guides the wafer (3) to a desired set position. The wafer (3) is aligned in a given position on the transport device (2, 20, 21) in relation to the reference marks (6) thereof and the projection of the reference marks (6) determines a non-permitted zone (22) along a direction of movement on the wafer (3) and hence defines a free zone on the remainder of the wafer (3). The sensor (1) is arranged in the transport chamber such as to guarantee that the non-permitted zone (22) is not scanned and the sensor (1) can thus only record the circular art of the wafer edge and not parts of the reference mark (6).

39. 发明公开

EP1152906A4 LOCAL VECTORIAL PARTICLE CLEANING 审中-公开
标题翻译：清洁颗粒曲面的通过定向局部移除
公开(公告)号：EP1152906A4
公开(公告)日：2007-10-17
申请号：EP99961260
申请日：1999-12-23
申请人： ORAMIR SEMICONDUCTOR LTD
发明人： UZIEL YORAM , LEVINSOHN NATALIE , YOGEV DAVID , ELISHA YEHUDA , OFER YITZHAK , FRISMAN LEV , BARON JONATHAN
IPC分类号： C23F4/00 , H01L21/306 , B08B7/00 , B23K26/00 , B23K26/03 , B23K26/08 , B23K26/14 , G03F1/00 , H01L21/00 , H01L21/02 , H01L21/302 , H01L21/3065 , H01L21/68
CPC分类号： B23K26/147 , B08B7/0042 , B23K26/032 , B23K26/0823 , B23K26/1438 , G03F1/82 , H01L21/02046 , H01L21/02098 , H01L21/67028 , H01L21/681 , Y10S438/906
摘要： A method for removing particles (28) from the surface of a substrate (26) includes determining respective position coordinates of the particles on the surface. A beam of electromagnetic energy is directed at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

40. 发明授权

EP1661442B1 ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENTS 有权
标题翻译：安装设备电子元件和方法，电子元器件组装
公开(公告)号：EP1661442B1
公开(公告)日：2007-07-11
申请号：EP05729207.0
申请日：2005-04-08
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD
发明人： HAJI, Hiroshi c/o Matsushita Electric Ind. Co. Ltd , OZONO, Mitsuru c/o Matsuhita Electric Ind. Co.Ltd
IPC分类号： H05K13/04
CPC分类号： H01L21/67144 , H01L21/67132 , H01L21/681 , H01L21/6838 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/53039 , Y10T29/53174 , Y10T29/53178
摘要： In an electronic component mounting process for mounting electronic components (6) to a substrate (13), each of the electronic components (6) having an adhesive layer on a surface to be bonded to the substrate (13) is picked up with suction nozzle (33a) provided with individual heater (49), and a time taken for the mounting operation is so allotted that a first heating time (T1) of a duration from a moment when the suction nozzle (33a) comes into contact with the electronic component (6) for picking it up till another moment immediately before it begins a mounting motion to the substrate (13) is longer than a second heating time (T2) of a duration from the moment when the suction nozzle (33a) begins the mounting motion till another moment when it leaves the electronic component (6) mounted to the substrate (13).

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