专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明公开

EP2820713A1 HALBLEITERMODUL MIT INTEGRIERTEM WELLENLEITER FÜR RADARSIGNALE 审中-公开
标题翻译：具有集成纤维半导体模块用于雷达信号
公开(公告)号：EP2820713A1
公开(公告)日：2015-01-07
申请号：EP13701029.4
申请日：2013-01-18
申请人： Robert Bosch GmbH
发明人： HASCH, Juergen , WOSTRADOWSKI, Uwe , PANCERA, Elena , GAIER, Stefan , POTRATZ, Carsten
IPC分类号： H01P3/12 , H01L23/66 , H01P5/107
CPC分类号： H01L23/66 , H01L21/4803 , H01L21/4846 , H01L21/565 , H01L23/293 , H01L23/528 , H01L25/16 , H01L27/144 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683 , H01L2924/0002 , H01P3/121 , H01P5/107 , H01L2924/00
摘要： The invention relates to a semiconductor module with an integrated circuit (14), a rewiring layer (38) for externally connecting the integrated circuit (14), and at least one waveguide (18) for radar signals that is integrated into the semiconductor module (10), said waveguide comprising a conductor structure (20, 22, 24) that laterally surrounds an interior of the waveguide (18), wherein the integrated circuit (14) and the at least one waveguide (18) are embedded, at least in certain regions, into a housing material of the semiconductor module (10); the invention further relates to a radar sensor, a motor vehicle radar system comprising such a semiconductor module and a method for producing a semiconductor module.

32. 发明公开

EP2814055A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD 有权
标题翻译： VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS的HALBLEITERBAUEMENT
公开(公告)号：EP2814055A1
公开(公告)日：2014-12-17
申请号：EP13820684.2
申请日：2013-07-04
申请人： Fuji Electric Co., Ltd.
发明人： KOMATSU, Kousuke
IPC分类号： H01L23/40
CPC分类号： H01L23/4006 , H01L21/565 , H01L23/24 , H01L23/3107 , H01L23/4093 , H01L2023/405 , H01L2023/4062 , H01L2023/4075 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device is closely attached to a cooler with a simple structure, without torque management. Therefore, it is possible to reduce contact thermal resistance, external dimensions, and manufacturing costs. A semiconductor device (100) includes a terminal case (1), a beam portion (4) which has elasticity and is connected to the terminal case (1), divided insulating substrates with a conductive pattern (5), a fastener (7) which is disposed at the center of the terminal case (1), and an elastic sealing resin (8) which fills the terminal case (1). According to the semiconductor device (100), it is possible to improve adhesion to a cooler and to reduce contact thermal resistance. Since a plurality of divided insulating substrates (5) with a conductive pattern are provided, they can be closely attached to the cooler. In addition, it is possible to simply attach the semiconductor device to the cooler only by inserting a hook portion (7b) provided at the leading end of the fastener (7) into a two-stage hole of the cooler. The attachment does not require torque management required in a screwing operation and it is possible to provide a semiconductor device at a low cost.
摘要翻译：半导体器件紧密地连接到具有简单结构的冷却器，而没有扭矩管理。因此，可以降低接触热阻，外部尺寸和制造成本。半导体器件（100）包括端子壳体（1），具有弹性并连接到端子壳体（1）的梁部分（4），具有导电图案（5）的分隔绝缘基板，紧固件（7）设置在终端壳体（1）的中心，以及填充终端壳体（1）的弹性密封树脂（8）。根据半导体装置（100），能够提高与冷却器的密合性，降低接触热阻。由于设置了多个具有导电图案的分隔绝缘基板（5），所以它们可以紧密地连接到冷却器。此外，仅通过将设置在紧固件（7）的前端的钩部（7b）插入到冷却器的两级孔中，可以简单地将半导体器件附接到冷却器。附件不需要在拧紧操作中所需的扭矩管理，并且可以以低成本提供半导体器件。

33. 发明公开

EP2783833A1 IMPRINTING DEVICE AND IMPRINTING METHOD 有权
标题翻译： PRÄGEVORRICHTUNGUNDPRÄGEVERFAHREN
公开(公告)号：EP2783833A1
公开(公告)日：2014-10-01
申请号：EP12852199.4
申请日：2012-11-21
申请人： Scivax Corporation
发明人： KAWAGUCHI Hirosuke , TANAKA Satoru
IPC分类号： B29C59/02 , H01L21/027
CPC分类号： G03F7/0002 , B29C59/02 , B29C59/022 , B29C2059/023 , B29C2791/006 , H01L21/565
摘要： The purpose of the invention is to provide an imprinting device and an imprinting method with which the size of the device and the cost can be reduced. An imprinting device for transferring a molding pattern of a mold (1) to a substance being molded (2), the device being configured from: a case (33) that configures a controlled pressure chamber (30); a stage (32) that supports the mold (1) and the substance being molded (2); a frame (43) that surrounds the perimeter of the stage (32); a first movement means (not shown) capable of moving the case (33) relatively toward and away from the stage (32); a second movement means (46) capable of moving the case (33) relatively toward and away from the frame (43); a pressure-controlling means (35) for adjusting the pressure of the fluid in the controlled pressure chamber (30); and a pressure-reducing means (45) for reducing the pressure of a pressure reduction chamber (40) configured from the stage (32), the frame (43), and the mold (1) or the substance being molded (2), and re moving the fluid between the mold (I) and the substance being molded (2).
摘要翻译：本发明的目的是提供一种能够减小设备尺寸和成本的压印装置和压印方法。一种用于将模具（1）的模制图案转印到被模制物体（2）的压印装置，该装置由以下构成：构造受控压力室（30）的壳体（33）; 支撑模具（1）的阶段（32）和被模制的物质（2）; 围绕所述平台（32）的周边的框架（43）; 第一移动装置（未示出），其能够相对地朝向和远离所述平台（32）移动所述壳体（33）; 第二移动装置（46），其能够相对地朝向和远离框架（43）移动壳体（33）; 用于调节受控压力室（30）中的流体压力的压力控制装置（35）; 以及减压装置（45），用于降低由所述载物台（32），所述框架（43）和所述模具（1）或被模制物体（2）构成的减压室（40）的压力，并且在模具（I）和被模制物体（2）之间重新移动流体。

34. 发明公开

EP2731129A1 Molded semiconductor sensor device and method of producing the same at a wafer-level 审中-公开
标题翻译： Gegossene Halbleitersensorvorrichtung und Verfahren zu ihrer Herstellung auf Waferebene
公开(公告)号：EP2731129A1
公开(公告)日：2014-05-14
申请号：EP12191647.2
申请日：2012-11-07
申请人： ams AG
发明人： Schrank, Franz , Schrems, Martin
IPC分类号： H01L23/31 , B81C1/00 , G01N27/12 , H01L21/50
CPC分类号： H01L23/528 , G01N27/128 , H01L21/50 , H01L21/565 , H01L23/3121 , H01L23/3135 , H01L23/315 , H01L24/94 , H01L24/97 , H01L2224/02371 , H01L2224/02372 , H01L2224/0401 , H01L2224/04042 , H01L2224/05569 , H01L2224/0557 , H01L2224/06181 , H01L2224/13022 , H01L2224/13024 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73257 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2224/85 , H01L2224/81 , H01L2224/05552 , H01L2924/00 , H01L2924/00012
摘要： The semiconductor device comprises a substrate (1) of semiconductor material with a front side (4) and an opposite rear side (7), a wiring layer (5) at the front side (4), a further wiring layer (8) at the rear side (7), and a through-substrate via (3) connecting the wiring layer (5) and the further wiring layer (8). A mold compound (14) is arranged on the rear side (7) above the substrate (1), a cavity (17) is formed in the mold compound (14), a sensor layer (21) is arranged in the cavity (17), and the cavity (17) is covered with a membrane (15). The mold compound (14) is applied on the wafer, and a film assisted molding process can be used.
摘要翻译：半导体器件包括具有前侧（4）和相对的后侧（7）的半导体材料的衬底（1），在前侧（4）处的布线层（5），另一布线层（8）在背面（7）和连接布线层（5）和另一布线层（8）的贯穿基板通孔（3）。在基板（1）上方的后侧（7）上配置有模具化合物（14），在模具化合物（14）中形成有空腔（17），传感器层（21）配置在空腔），并且空腔（17）被膜（15）覆盖。将模具化合物（14）施加在晶片上，并且可以使用膜辅助成型工艺。

35. 发明公开

EP2709144A3 Matrix lid heatspreader for flip chip package 审中-公开
标题翻译：矩阵盖散热器的倒装芯片封装
公开(公告)号：EP2709144A3
公开(公告)日：2014-05-14
申请号：EP13183374.1
申请日：2013-09-06
申请人： Freescale Semiconductor, Inc.
发明人： Leal, George R , Pham, Tim V
IPC分类号： H01L21/56 , H01L23/433 , H01L23/00
CPC分类号： H01L23/49568 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/3107 , H01L23/3675 , H01L23/3736 , H01L23/4334 , H01L23/49541 , H01L23/49838 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/97 , H01L25/0655 , H01L2224/16225 , H01L2224/29191 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83191 , H01L2224/83192 , H01L2224/92225 , H01L2224/97 , H01L2924/12042 , H01L2924/141 , H01L2924/14335 , H01L2924/1434 , H01L2924/15311 , H01L2924/17738 , H01L2924/17747 , H01L2924/181 , H01L2224/81 , H01L2924/00012 , H01L2924/00
摘要： A method and apparatus are provided for manufacturing a lead frame based thermally enhanced flip chip package with an exposed heat spreader lid array (310) designed for direct attachment to an array of integrated circuit die (306) by including a thermal interface adhesion layer (308) to each die (306) and encapsulating the attached heat spreader lid array (310) and array of integrated circuit die (306) with mold compound (321) except for planar upper lid surfaces of the heat spreader lids (312).

36. 发明公开

EP2721559A1 VERFAHREN ZUR HERSTELLUNG EINES DATENTRÄGERS 有权转让
标题翻译：一种用于生产DISC
公开(公告)号：EP2721559A1
公开(公告)日：2014-04-23
申请号：EP12729867.7
申请日：2012-06-14
申请人： Giesecke & Devrient GmbH
发明人： BÜTTNER, Bernhard , TARANTINO, Thomas , GRIESMEIER, Robert
IPC分类号： G06K19/077 , B29C45/14 , B29C45/37
CPC分类号： G06K19/07732 , B29C45/14647 , B29C45/2708 , B29C45/372 , G06K19/07724 , G06K19/07743 , H01L21/565 , H01L24/97 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to a method for producing a portable data carrier, especially a smart card, comprising the following steps: making a carrier strip (1) available which has a top side (101) and a bottom side (102) opposite said top side (101), a contact field (2) having at least one contact surface (200) being formed on the top side (101); arranging a semiconductor circuit (4) on the bottom side (102) of the carrier strip (1), said semiconductor circuit (4) being connected to the corresponding contact surface (200) in an electrically conductive manner; and carrying out an injection molding process such that a potting compound (6) enclosing the semiconductor circuit (4) is produced on the bottom side (102), said potting compound (6) having outer dimensions according to the standard specifications of a portable data carrier. The injection channel (7) for injecting the potting compound (6) is arranged on a side of the potting compound die (600) parallel to the bottom side (102) and a recess (702) remains in the finished data carrier due to the injection channel (7) once the potting compound (6) is injected. The invention further relates to a portable data carrier and to the use of the data carrier as a subscriber identity module.

37. 发明公开

EP2378547A4 METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, AND THREE-DIMENSIONAL STRUCTURE, ON THE SURFACE OF WHICH WIRING IS PROVIDED AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：法半导体芯片安装在由半导体元件，方法用于生产CONNECTING半导体芯片和三维结构与接线表面上并处理此过程
公开(公告)号：EP2378547A4
公开(公告)日：2013-12-04
申请号：EP10735804
申请日：2010-01-26
申请人： PANASONIC CORP
发明人： YOSHIOKA SHINGO , FUJIWARA HIROAKI
IPC分类号： H01L21/60 , G11B5/48 , H01L21/98 , H01L23/48 , H01L25/065
CPC分类号： H05K1/11 , G11B5/486 , H01L21/565 , H01L22/12 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/04042 , H01L2224/05554 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/24011 , H01L2224/2405 , H01L2224/24051 , H01L2224/24137 , H01L2224/24146 , H01L2224/24226 , H01L2224/245 , H01L2224/25175 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/82009 , H01L2224/82039 , H01L2224/82101 , H01L2224/82931 , H01L2224/82947 , H01L2224/8385 , H01L2224/85 , H01L2224/92244 , H01L2225/06524 , H01L2225/06551 , H01L2225/06565 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H05K1/111 , H05K1/117 , H05K1/181 , H05K3/184 , H05K2201/0376 , H05K2201/09472 , Y02P70/611 , Y10T428/1171 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： One aspect of the present invention is a method of mounting a semiconductor chip having: a step of forming a resin coating 3 on a surface of a path connecting a bonding pad 2a on a surface of a semiconductor chip 2 and an electrode pad 1a formed on a surface of an insulating base material 1; a step of forming, by laser beam machining, a wiring gutter 4 having a depth that is equal to or greater than a thickness of the resin coating 3 along the path for connecting the bonding pad 2a and the electrode pad 1 a; a step of depositing a plating catalyst 5 on a surface of the wiring gutter 4; a step of removing the resin coating 3; and a step of forming an electroless plating coating 6 only at a site where the plating catalyst 5 remains. Another aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, wherein, on the surface of the three-dimensional structure, a recessed gutter for wiring is formed, extending between mutually intersecting adjacent faces of the three-dimensional structure, and wherein at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

38. 发明公开

EP2639822A2 Method of producing a resin molded semiconductor device 无效
标题翻译： Verfahren zur Herstellung einer Halbleitervorrichtung aus Formharz
公开(公告)号：EP2639822A2
公开(公告)日：2013-09-18
申请号：EP13001109.1
申请日：2013-03-05
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Shiobara, Toshio , Sekiguchi, Susumu , Akiba, Hideki
IPC分类号： H01L21/56
CPC分类号： H01L21/565 , H01L21/561 , H01L23/293 , H01L23/3128 , H01L24/97 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/10253 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/85
摘要： It is an obj ect of the present invention to provide a method for producing a semiconductor apparatus in which the warp and break of a substrate after sealing can be suppressed even when a large substrate is sealed. The present invention provides a method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, including:
an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200°C, and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted;
an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and
a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.
摘要翻译：本发明的目的是提供一种半导体装置的制造方法，其中即使在大的基板被密封时也能够抑制密封后的基板的翘曲和断裂。本发明提供一种具有模具的半导体装置的制造方法，所述模具具有上半模和下半模，该模具包括：将模具的上半模和下半模的一个上设置在基板上的布置步骤安装半导体器件，将模具保持在室温或加热至高达200℃的温度，并且在上半模和下半模的另一个上设置半个没有安装半导体器件的基板 ; 通过在其上配置有基板的模具上模制热固性树脂来整合其上安装有半导体器件的基板和不安装半导体器件的基板的积分步骤; 以及将从模具取出的集成基板切割以获得单独的半导体装置的步骤。

39. 发明公开

EP2577727A1 METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY 有权
标题翻译：过程来产生彩色影像存储DEVICES
公开(公告)号：EP2577727A1
公开(公告)日：2013-04-10
申请号：EP11860699.5
申请日：2011-09-02
申请人： SanDisk Semiconductor (Shanghai) Co., Ltd. , SanDisk Information Technology (Shanghai) Co., Ltd
发明人： FU, Peng , LU, Zhong , CHIU, Chin-Tien , YU, Cheeman , CHEN, Matthew , JIANG, Weiting
IPC分类号： H01L23/544
CPC分类号： H01L21/565 , H01L21/56 , H01L21/561 , H01L21/566 , H01L23/28 , H01L23/544 , H01L23/552 , H01L24/73 , H01L24/97 , H01L2223/54406 , H01L2223/5442 , H01L2223/54433 , H01L2223/54486 , H01L2224/16225 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06568 , H01L2924/1431 , H01L2924/1434 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device.

40. 发明公开

EP2474401A3 Method of resin molding and resin molding apparatus 审中-公开
标题翻译：一种用于树脂成型体和树脂模塑装置的过程
公开(公告)号：EP2474401A3
公开(公告)日：2012-10-24
申请号：EP12150560.6
申请日：2012-01-10
申请人： Apic Yamada Corporation
发明人： Ikeda, Masanobu , Morimura, Masahiro , Nakayama, Hideo , Sato, Hisashi
IPC分类号： B29C33/68 , B29C45/02 , B29C45/16 , B29C45/18 , H01L21/56
CPC分类号： B29C45/02 , B29C33/68 , B29C45/14655 , B29C45/1671 , B29C45/1866 , B29C45/2669 , B29C45/34 , H01L21/565 , H01L24/97 , H01L2224/48091 , H01L2924/13055 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The resin molding method comprises the steps of: feeding a first resin (15, 15a) to a cavity concave portion (11a, 18a) of a molding die set (1), which is opened, and a second resin (16, 16a) to a pot (9) thereof; closing the molding die set (1) so as to clamp the work (W); and pressurizing and sending the molten second resin (16, 16a), which has been molten in the pot (9), to the cavity concave portion (11a, 18a), by a manner of transfer-molding, so as to mix the molten first resin (15, 15a), which has been molten in the cavity concave portion (11a, 18a), and the molten second resin (16, 16a) and cure the mixed resin with maintaining a prescribed resin pressure.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式