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31. 发明公开

EP1999779A1 VORRICHTUNG UND VERFAHREN ZUM BESCHICHTEN EINES MIKRO- UND/ODER NANOSTRUKTURIERTEN STRUKTURSUBSTRATS SOWIE BESCHICHTETES STRUKTURSUBSTRAT 有权
标题翻译： DEVICE AND METHOD FOR涂层的微观和/或纳米结构的结构基材和涂布结构体基板
公开(公告)号：EP1999779A1
公开(公告)日：2008-12-10
申请号：EP07723216.3
申请日：2007-03-13
申请人： Thallner, Erich, Dipl.-Ing.
发明人： Thallner, Erich, Dipl.-Ing.
IPC分类号： H01L21/00
CPC分类号： H01L21/6715 , G03F7/162
摘要： The invention relates to a device (1) and a method for coating a micro- and/or nano-structured structural substrate (8). According to the invention, coating proceeds in a vacuum chamber (3). The pressure level in the vacuum chamber (3) is increased while or after the coating substance is fed to the vacuum chamber (3).

32. 发明公开

EP1975979A1 COATING APPARATUS AND COATING METHOD 有权
标题翻译： BESCHICHTUNGSVORRICHTUNG UND BESCHICHTUNGSVERFAHREN
公开(公告)号：EP1975979A1
公开(公告)日：2008-10-01
申请号：EP06834803.6
申请日：2006-12-15
申请人： TOKYO ELECTRON LIMITED
发明人： SAWADA, Ikuo , MATSUZAKI, Kazuyoshi , TANAKA, Takashi , IWASHITA, Mitsuaki , MUNAKATA, Mizue
IPC分类号： H01L21/027 , B05C11/08 , B05C15/00
CPC分类号： B05D1/005 , B05C11/06 , B05C11/08 , B05D3/0406 , B05D3/0486 , B05D2203/30 , B05D2203/35 , G03F7/162 , H01L21/67017 , H01L21/67023 , H01L21/6715
摘要： The invention is a coating apparatus including: a substrate-holding part that holds a substrate horizontally; a chemical nozzle that supplies a chemical to a central portion of the substrate horizontally held by the substrate-holding part; a rotation mechanism that causes the substrate-holding part to rotate in order to spread out the chemical on a surface of the substrate by a centrifugal force, for coating the whole surface with the chemical; a gas-flow-forming unit that forms a down flow of an atmospheric gas on the surface of the substrate horizontally held by the substrate-holding part; a gas-discharging unit that discharges an atmosphere around the substrate; and a gas nozzle that supplies a laminar-flow-forming gas to the surface of the substrate, the laminar-flow-forming gas having a coefficient of kinematic viscosity larger than that of the atmospheric gas; wherein the atmospheric gas or the laminar-flow-forming gas are supplied to the central portion of the substrate.
摘要翻译：本发明是一种涂覆装置，包括：水平保持基板的基板保持部; 化学喷嘴，其将化学品供给到由所述基板保持部水平保持的所述基板的中央部; 旋转机构，其使基板保持部旋转以通过离心力在基板的表面上分散化学品，用化学品涂布整个表面; 气体流动形成单元，其在由所述基板保持部水平保持的所述基板的表面上形成气氛气体的向下流动; 气体排出单元，其排出基板周围的气氛; 以及气体喷嘴，其将层流形成气体供给到所述基板的表面，所述层流形成气体的运动粘度系数大于所述气氛气体的系数; 其中所述大气气体或层流形成气体被供应到所述基板的中心部分。

33. 发明公开

EP1950611A1 Procédé de dépôt d'une couche polymère sur une face d'un support, comportant au moins une zone en creux 有权
标题翻译：包括至少一个凹区中的背衬的表面上施加聚合物层的方法
公开(公告)号：EP1950611A1
公开(公告)日：2008-07-30
申请号：EP08354001.3
申请日：2008-01-16
申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE
发明人： Puget, Christiane , Henry, David
IPC分类号： G03F7/16
CPC分类号： G03F7/162
摘要： Une couche polymère (3) est déposée sur une face (5) d'un support (4), ladite face (5) comportant une partie principale plane (5a) et au moins une zone en creux (5b) par rapport à la partie principale plane (5a). La couche polymère (3) est réalisée par au moins les étapes successives suivantes :
- dépôt d'une quantité prédéterminée d'un mélange liquide au moins le polymère ou au moins un précurseur dudit polymère sur la partie principale plane (5a) de la face (5) du support (4),
- introduction d'au moins une partie du mélange liquide dans la zone en creux (5b) par déplacement d'un cylindre posé sur la partie principale plane (5a) de la face (5)
- dépôt d'une quantité supplémentaire de mélange liquide sur la partie principale plane (5a) de la face (5)
- et mise en rotation du support (4) selon un axe perpendiculaire au plan de la face (5).
摘要翻译：该方法包括在载体上的（4），其中所述液体混合物具有聚合物或聚合物前体的一个表面（5）的主平面部（5a）沉积的液体混合物的预定量。所述液体混合物的一部分在表面的中空区域（图5B）通过移动安装在表面的主平面部分的气缸中引入。所述液体混合物的附加量被沉积在所述表面的主面的一部分。该支撑件沿着轴线旋转垂直于该表面的平面。

34. 发明授权

EP1654591B1 METHOD FOR DETERMINING OPTIMAL RESIST THICKNESS 有权
标题翻译：用于确定最适合的方式抗蚀剂厚度
公开(公告)号：EP1654591B1
公开(公告)日：2008-05-14
申请号：EP04769111.8
申请日：2004-08-07
申请人： NXP B.V.
发明人： ZIGER, David
IPC分类号： G03F7/16 , G03F7/26
CPC分类号： G03F7/162 , G03F7/16 , G03F7/168

35. 发明公开

EP1642715A4 METHOD AND DEVICE FOR MANUFACTURING RELIEF PRINTING PLATE TERMINAL FOR SEAMLESS PRINTING 有权
标题翻译：方法和设备用于生产凸版终端无缝PRINT
公开(公告)号：EP1642715A4
公开(公告)日：2007-09-19
申请号：EP04730635
申请日：2004-04-30
申请人： ASAHI KASEI CHEMICALS CORP
发明人： WATANABE MIYOSHI , KISHIDA TOMOHIRO
IPC分类号： G03F7/16 , B41C1/00 , B41C1/05 , B41C1/18 , G03F7/18
CPC分类号： G03F7/162 , B41C1/00 , B41C1/05 , B41C1/18 , B41C1/186 , G03F7/18
摘要： A method and a device for manufacturing a relief printing plate terminal for seamless printing, the method comprising the steps of setting a work (70) in a holding and rotating means, feeding liquid light-sensitive resin (10) to a resin coating and smoothening unit (150), while applying the liquid light-sensitive resin (10) on the outer peripheral surface of the work (70) by the resin coating and smoothening unit (150) while rotating the work (70), molding the coated resin to a uniform thickness, exposing the work (70) to highly intense ultraviolet ray (30) while rotating the work (70) to cure the light-sensitive resin layer, shaping the photo-cured surface of the light-sensitive resin layer, and removing the unnecessary resin layer, and post-treating the resin layer by performing the laser carving with an infrared laser beam (40).

36. 发明授权

EP1044074B8 PHOTORESIST COATING PROCESS CONTROL WITH SOLVENT VAPOR SENSOR 有权
标题翻译：过程控制。用溶剂蒸汽传感器PHOTO-耐性涂料
公开(公告)号：EP1044074B8
公开(公告)日：2007-08-08
申请号：EP98967092.2
申请日：1998-12-08
申请人： ASML Holding N.V.
发明人： Gurer, Emir , Litvak, Herbert , Savage, Richard
IPC分类号： B05D3/12 , B05D3/02 , B05D3/10 , H01L21/469 , B05C11/00 , B05C11/02 , C23C16/00
CPC分类号： B05D1/005 , B05C11/08 , B05D3/0486 , G03F7/162
摘要： An apparatus (2) for spin coating surfaces with liquid polymer comprises a spin coating chamber (6) having a rotatable chuck (4) for supporting an object (5) to be coated. A distributor (12) introduces gases into the chamber. A solvent vapor and carrier gas supply provides a carrier gas having a controlled level of solvent vapor therein within the range of from 0 to saturation concentrations of solvent vapor. A solvent vapor sensor (32) is positioned with respect to the coating chamber to produce signals which correspond to the concentration of solvent vapor in the coating chamber. A control means (20) is connected to the solvent vapor concentration sensor and to the solvent vapor and carrier gas supply means for controlling the level of solvent concentration in the carrier gas supplied by the solvent vapor and carrier gas supply means.

37. 发明公开

EP1693886A1 SUBSTRATE TREATMENT DEVICE CONTROL METHOD AND SUBSTRATE TREATMENT DEVICE 审中-公开
标题翻译： UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG UNG
公开(公告)号：EP1693886A1
公开(公告)日：2006-08-23
申请号：EP04820143.8
申请日：2004-11-30
申请人： TOKYO ELECTRON LIMITED
发明人： SHINOZUKA,S. Tokyo Elec.Kyushu Limited Koshi Plant , WADA,S. Tokyo Electron Kyushu Limited Koshi Plant , YAMASHITA, Masami
IPC分类号： H01L21/027 , G03F7/16
CPC分类号： H01L21/67745 , G03F7/162 , G03F7/3021 , H01L21/67276
摘要： It is an object of the present invention to realize, in a coating and developing apparatus including an inspection section, reduction in the startup time, cost reduction, and an improved operating rate of the inspection section.
In the present invention, a control program of the coating and developing apparatus is set such that a processing flow and an inspection flow can be independently executed, the processing flow being a flow in which a substrate is carried to a processing station from a cassette station to be processed in the processing station and an aligner and thereafter is returned to the cassette station, and the inspection flow being a flow in which the substrate is carried from the cassette station to an inspection station to be inspected there, and is thereafter returned to the cassette station. At startup of the coating and developing apparatus, the inspection flow and the processing flow are executed, and an evaluation work of an inspection unit of the inspection station and an adjustment work of a processing unit in the processing station can proceed simultaneously. When the inspection station is idle, a substrate can be carried from an external part to the cassette station to be inspected there.
摘要翻译：本发明的目的是在包括检查部分的涂覆和显影装置中实现起动时间的减少，成本降低和检查部分的提高的操作速度。在本发明中，涂布显影装置的控制程序被设定为能够独立地执行处理流程和检查流程，处理流程是将基板从盒式磁带机搬送到加工站的流程在处理站中进行处理和对准器，然后返回到盒式站，检查流程是将基板从卡带站运送到检查站的流程，然后返回到盒式电台。在涂布显影装置启动时，执行检查流程和处理流程，并且检查站的检查单元和处理站中的处理单元的调整工作的评估工作可以同时进行。当检查站空闲时，可以将基板从外部部件运送到要在那里进行检查的卡带站。

38. 发明公开

EP1044074A4 PHOTORESIST COATING PROCESS CONTROL WITH SOLENT VAPOR SENSOR 有权
标题翻译：过程控制用于光耐磨涂层MITSOLVENTDAMPFSENSOR
公开(公告)号：EP1044074A4
公开(公告)日：2006-03-01
申请号：EP98967092
申请日：1998-12-08
申请人： SILICON VALLEY GROUP
发明人： GURER EMIR , LITVAK HERBERT , SAVAGE RICHARD
IPC分类号： B05D1/40 , B05C11/00 , B05C11/08 , B05D1/00 , B05D3/04 , C23C16/00 , G03F7/16 , H01L21/027 , B05D3/12 , B05C11/02 , B05D3/02 , B05D3/10 , H01L21/469
CPC分类号： B05D1/005 , B05C11/08 , B05D3/0486 , G03F7/162
摘要： An apparatus (2) for spin coating surfaces with liquid polymer comprises a spin coating chamber (6) having a rotatable chuck (4) for supporting an object (5) to be coated. A distributor (12) introduces gases into the chamber. A solvent vapor and carrier gas supply provides a carrier gas having a controlled level of solvent vapor therein within the range of from 0 to saturation concentrations of solvent vapor. A solvent vapor sensor (32) is positioned with respect to the coating chamber to produce signals which correspond to the concentration of solvent vapor in the coating chamber. A control means (20) is connected to the solvent vapor concentration sensor and to the solvent vapor and carrier gas supply means for controlling the level of solvent concentration in the carrier gas supplied by the solvent vapor and carrier gas supply means.

39. 发明公开

EP1577930A1 COATING DEVICE AND COATING FILM FORMING METHOD 审中-公开
标题翻译：涂布装置和方法涂膜
公开(公告)号：EP1577930A1
公开(公告)日：2005-09-21
申请号：EP03780822.7
申请日：2003-12-17
申请人： TOKYO ELECTRON LIMITED
发明人： SHITE, Hideo, TOKYO ELECTRON KYUSHU LIMITED,
IPC分类号： H01L21/027 , B05C11/08 , G03F7/16
CPC分类号： H01L21/6715 , G03F7/162 , H01L21/67017
摘要： The resist coating unit (COT) has a spin chuck (41) which holds the wafer to be supplied with a resist liquid, and a process cup (50) which accommodates the spin chuck (41) and exhaustes an atmosphere around the wafer W from a bottom thereof. The process cup (50) comprises a first cup (51) with an outer circumferential wall (61a), and an airflow control member (52) laid out close to the wafer W in the first cup (51) in such a manner as to surround the wafer W. The airflow control member (52) has a vertical cross section of an approximately rectangular shape defined by the upper ring portion (62a) having a cross section of an approximately triangular shape and protruding upward, and a lower ring portion (62b) having a cross section of an approximately triangular shape and protruding downward. An exhaust passage (55) for substantially exhausting the atmosphere around the wafer W is formed between the outer circumferential wall (61a) and the airflow control member (52).

40. 发明公开

EP1552545A1 SPIN-COATING METHODS AND APPARATUSES FOR SPIN-COATING, INCLUDING PRESSURE SENSOR 审中-公开
标题翻译：对于压力传感器旋涂的旋涂法和装置
公开(公告)号：EP1552545A1
公开(公告)日：2005-07-13
申请号：EP03749722.9
申请日：2003-09-10
申请人： FSI INTERNATIONAL, INC.
发明人： COLLINS, Jimmy, D. , COOPER, Samuel, A.
IPC分类号： H01L21/00 , B05D1/00 , G03F7/16
CPC分类号： H01L21/67253 , G03F7/162 , G03F7/3021 , H01L21/6715
摘要： Described are methods and apparatuses useful for spin-coating process solutions onto substrates, wherein the methods and apparatuses incorporate a pressure sensor to detect the pressure of a process solution, such as a pressure related to a beginning or end of a dispense of process solution from a dispenser; some preferred methods and apparatuses measure pressure of a photoresist, developer, water, solvent, or cleaner in a dispense line; and some preferred methods and apparatuses incorporate process control systems involving interrupted, parallel control methods.

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