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31. 发明公开

EP3084493A4 HYBRID ELECTRICAL/OPTICAL CONNECTOR 审中-公开
标题翻译： ELEKTRISCHER / OPTISCHER HYBRIDSTECKER
公开(公告)号：EP3084493A4
公开(公告)日：2017-08-16
申请号：EP13899364
申请日：2013-12-19
申请人： INTEL CORP
发明人： FAW DONALD , HUANG ZINING , LIU ANSHENG
IPC分类号： G02B6/42 , G02B6/38 , G02B6/43 , H01R12/71
CPC分类号： G02B6/4293 , G02B6/3875 , G02B6/3885 , G02B6/4206 , G02B6/4214 , G02B6/4246 , G02B6/4284 , G02B6/43 , H01R12/716
摘要： A single hybrid electrical/optical connector simultaneously forms both electrical and optical input/output connections by a single step engagement between elements on a connector and corresponding elements of the opposite gender on a mating connector. The connector can be surface-mounted on a circuit board, and a mating connector can be vertically pluggable onto the connector. The optical elements on the connector and/or the mating connector can be detachable, which can simplify assembly of a system that includes the circuit board. The hybrid electrical/optical connector has applications for optical transceivers. The hybrid electrical/optical connector includes a housing that extends laterally along a housing plane. The housing includes electrical and optical sockets thereon. In some examples, the electrical sockets and the optical sockets are laterally arranged on opposite sides of a division plane perpendicular to the housing plane.
摘要翻译：单个混合电气/光学连接器通过连接器上的元件和配合连接器上相反性别的相应元件之间的单个阶梯式接合同时形成电气和光学输入/输出连接。连接器可以表面安装在电路板上，并且配合连接器可以垂直插入连接器。连接器和/或配合连接器上的光学元件可以是可拆卸的，这可以简化包括电路板的系统的组装。混合电气/光学连接器具有用于光学收发器的应用。混合电气/光学连接器包括沿壳体平面横向延伸的壳体。外壳上包括电气和光学插座。在一些示例中，电插座和光插座横向地布置在垂直于壳体平面的分割平面的相对侧上。

32. 发明公开

EP3182179A1 INTEGRALLY FORMED COUPLING MODULE 有权
标题翻译： INTEGRAL GEFORMTES KOPPLUNGSMODUL
公开(公告)号：EP3182179A1
公开(公告)日：2017-06-21
申请号：EP16203562
申请日：2016-12-12
申请人： HUAWEI TECH CO LTD
发明人： ZHANG YUANLIANG , ZHOU CHUANG
IPC分类号： G02B6/30 , G02B6/42 , H01S5/022 , H01S5/026 , H04B10/50
CPC分类号： G02B6/4214 , G02B6/30 , G02B6/32 , G02B6/4206 , G02B6/4213 , G02B6/428 , G02B6/4286 , H01S5/02236 , H01S5/02284 , H01S5/02292 , H01S5/0683 , H01S5/183 , H04B10/503
摘要： The present invention discloses an integrally formed coupling module, to offset polarized noise introduced by a medium air interface and an air medium interface, so that the integrally formed coupling module has no polarization-sensitive characteristic. In the integrally formed coupling module provided in the present invention, a total internal reflective surface reflects a first optical signal emitted by a laser to form a second optical signal, the second optical signal is output to the medium air interface, a medium air interface refracts the second optical signal to form a third optical signal, the third optical signal is output from air to the air medium interface, an air medium interface refracts the third optical signal to form a fourth optical signal, and then the fourth optical signal is output to an optical fiber. In addition, a refractive angle at which the medium air interface performs refraction to form the third optical signal is equal to an incidence angle at which the third optical signal is output to the air medium interface, and a first incident surface and a second incident surface are mutually perpendicular in space.
摘要翻译：本发明公开了一种整体形成的耦合模块，用于抵消由介质空气界面和空气介质界面引入的极化噪声，使得整体形成的耦合模块不具有偏振敏感特性。在本发明提供的整体成型的耦合模块中，全内反射表面反射由激光器发射的第一光信号以形成第二光信号，第二光信号被输出到中空介面，介质空气界面折射第二光信号形成第三光信号，第三光信号从空中输出到空气介质接口，空气介质界面折射第三光信号形成第四光信号，然后将第四光信号输出到光纤。另外，中间空气界面执行折射以形成第三光学信号的折射角等于第三光学信号输出到空气介质界面的入射角，并且第一入射面和第二入射面在空间中相互垂直。

33. 发明公开

EP3170041A1 OPTICAL COUPLER 审中-公开
标题翻译：光耦合器
公开(公告)号：EP3170041A1
公开(公告)日：2017-05-24
申请号：EP15822707.4
申请日：2015-05-07
申请人： Intel Corporation
发明人： KRISHNAMURTHI, Mahesh , RYCKMAN, Judson D. , RONG, Haisheng , LIAO, Ling , FRISH, Harel , HAREL, Oshrit , BARKAI, Assia , NA, Yun-Chung , LIU, Han-Din
IPC分类号： G02B6/12 , G02B6/36
CPC分类号： G02B6/122 , G02B6/12002 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4296 , G02B2006/12061 , G02B2006/121 , G02B2006/12104 , G02B2006/12147 , G02B2006/12152
摘要： Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例针对用于光耦合器的技术和配置。在一些实施例中，该设备可以包括光波导以传输从光源输入的光。光波导可以包括半导体层，该半导体层具有沟槽，该沟槽具有一个小平面，该小平面包括在大约45度角下形成的边缘和基本垂直于半导体层形成的另一小平面。边缘可以与另一介质交界以形成反射镜以接收输入光并基本上垂直地反射接收到的光以传播所接收的光。其他实施例可以被描述和/或要求保护。

34. 发明公开

EP3163342A1 PHOTOELECTRIC CONVERSION ASSEMBLY 审中-公开
标题翻译：光电转换组件
公开(公告)号：EP3163342A1
公开(公告)日：2017-05-03
申请号：EP16194877.3
申请日：2016-10-20
申请人： AQUAOPTICS CORP.
发明人： CHANG, Chia-Chi , LEE, Tung-An , YO, Shih-Jye
IPC分类号： G02B6/42
CPC分类号： H04B10/2504 , G02B6/4214 , G02B6/4249 , G02B6/4259 , G02B6/428 , G02B6/4292 , H01L24/13 , H01L24/16 , H01L24/48 , H01L2224/131 , H01L2224/13144 , H01L2224/16227 , H01L2224/48227 , H01L2924/00014 , H01L2924/1204 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/014 , H01L2224/45099
摘要： A photoelectric conversion assembly is proposed. The photoelectric conversion module comprises three parts, photoelectric conversion module, a printed circuit board (PCB) and a hybrid cable. The photoelectric conversion module comprises an interposer, at least one optical element configured on the interposer, and an optical bench for the printed circuit board and the interposer configured thereon. Electrical wires are used for coupling to the printed circuit board. An optical ferrule is used for engaging with the photoelectric conversion module and an optical fiber component. A plug is used for electrically connecting the printed circuit board. A first lens array is configured under the interposer. A mirror is configured under the first lens array. A second lens array is configured left side of the mirror.
摘要翻译：提出了一种光电转换组件。光电转换模块由光电转换模块，印刷电路板（PCB）和混合电缆三部分组成。光电转换模块包括插入器，配置在插入器上的至少一个光学元件以及配置在其上的用于印刷电路板和插入器的光具座。电线用于连接印刷电路板。光学套圈用于与光电转换模块和光纤组件接合。插头用于电连接印刷电路板。第一透镜阵列配置在插入器下方。镜子配置在第一透镜阵列下面。第二透镜阵列配置在反射镜的左侧。

35. 发明授权

EP2813873B1 Integrated mirror in a semiconductor waveguide device 有权转让
标题翻译：在半导体波导器件集成镜
公开(公告)号：EP2813873B1
公开(公告)日：2017-03-29
申请号：EP14170945.1
申请日：2014-06-03
申请人： NXP USA, Inc.
发明人： Stephens, Tab A. , Pelley, Perry H. , McShane, Michael B.
IPC分类号： G02B6/125 , G02B6/13 , G02B6/136
CPC分类号： G02B6/136 , G02B6/125 , G02B6/131 , G02B6/4214 , G02B6/43 , G02B2006/12061 , G02B2006/12104
摘要： An integrated circuit optical backplane die and associated semiconductor fabrication process are described for forming optical backplane mirror structures for perpendicularly deflecting optical signals out of the plane of the optical backplane die by selectively etching an optical waveguide semiconductor layer (103) on an optical backplane die wafer using an orientation-dependent anisotropic wet etch process to form a first recess opening (107) with angled semiconductor sidewall surfaces (106) on the optical waveguide semiconductor layer, where the angled semiconductor sidewall surfaces (106) are processed to form an optical backplane mirror (116) for perpendicularly deflecting optical signals to and from a lateral plane of the optical waveguide semiconductor layer.

36. 发明授权

EP2523029B1 OPTICAL COUPLING STRUCTURE AND OPTICAL TRANSRECEIVER MODULE 失效转让
标题翻译：光耦合构造光传输/接收模块
公开(公告)号：EP2523029B1
公开(公告)日：2017-02-15
申请号：EP11731810.5
申请日：2011-01-06
申请人： Fujikura Ltd.
发明人： KIMURA, Naoki , TAKIGAHIRA, Masato
IPC分类号： G02B6/42 , H01S5/022
CPC分类号： H01S5/02284 , G02B6/4214 , G02B6/422 , G02B6/4239 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01S5/0226 , H01S5/02276 , H01S5/02292 , H01S5/4025 , H01L2924/00014

37. 发明公开

EP3126888A1 SUBSTRATE MOUNTED OPTICAL RECEPTACLE 审中-公开
标题翻译： SUBSTRATMONTIERTEOPTIKBEHÄLTER
公开(公告)号：EP3126888A1
公开(公告)日：2017-02-08
申请号：EP15716299.1
申请日：2015-03-27
申请人： Corning Optical Communications LLC
发明人： ISENHOUR, Micah Colen , LEWALLEN, Christopher Paul , LUTHER, James Phillip
IPC分类号： G02B6/42
CPC分类号： G02B6/4214 , G02B6/4231 , G02B6/4261 , G02B6/428 , G02B6/4292
摘要： Disclosed are optical receptacles for use with electronic devices. In one embodiment, the optical receptacle comprises an optical lens body for receiving and transmitting optical signals and the optical lens body comprising a front face with a recess and a total internal reflection (TIR) surface. A cover is disposed in the recess of the optical lens body for protecting a surface of the optical lens body and also provides a cleanable surface. The optical receptacle also includes a receptacle shell with an open side for housing the optical lens body. and a cover disposed in the recess of the optical lens body.
摘要翻译：公开了用于电子设备的光学插座。在一个实施例中，光学插座包括用于接收和传输光学信号的光学透镜体，并且光学透镜体包括具有凹部和全内反射（TIR）表面的正面。在光学透镜体的凹部中设置有用于保护光学透镜主体的表面并且还提供可清洁表面的盖。光学插座还包括具有用于容纳光学透镜主体的开放侧的插座壳体。以及设置在光学透镜主体的凹部中的盖。

38. 发明公开

EP3125008A1 METHOD TO MANUFACTURE OPTOELECTRONIC MODULES 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG OPTOELEKTRONISCHER MODULE
公开(公告)号：EP3125008A1
公开(公告)日：2017-02-01
申请号：EP15178897.3
申请日：2015-07-29
申请人： CCS Technology Inc.
发明人： Schaevitz, Rebecca , Yadlowsky, Michael , Renfro, James , McKay, Ian
IPC分类号： G02B6/42 , H01S5/022 , H01S5/183
CPC分类号： G02B6/4228 , G02B6/12002 , G02B6/4204 , G02B6/4206 , G02B6/4214 , G02B6/4231 , G02B6/4239 , G02B6/424 , G02B6/4274 , G02B6/428 , G02B6/4292 , H01S5/02248 , H01S5/02252 , H01S5/02284 , H01S5/183
摘要： A method to manufacture optoelectronic modules comprises a step of providing a first wafer (100) comprising a plurality of first module portions (101), wherein each of the first module portions (101) comprises at least one passive optical component (110), providing a second wafer (200) comprising a plurality of second module portions (201), wherein each of the second module portions comprises at least one optoelectronic component (210). The wafers (100, 200) are disposed on each other to provide a wafer stack that is diced into individual optoelectronic modules (1) respectively comprising one of the first and the second and the third module portions.
摘要翻译：制造光电子模块的方法包括提供包括多个第一模块部分（101）的第一晶片（100）的步骤，其中每个第一模块部分（101）包括至少一个无源光学部件（110），提供第二晶片（200），包括多个第二模块部分（201），其中每个所述第二模块部分包括至少一个光电子部件（210）。晶片（100,200）彼此设置以提供晶片堆叠，其被切割成分别包括第一和第二和第三模块部分中的一个的各个光电子模块（1）。

39. 发明公开

EP3096164A4 OPTICAL COUPLING DEVICE AND OPTICAL COUPLING UNIT 审中-公开
标题翻译： OPTISCHE KUPPLUNGSVORRICHTUNG UND OPTISCHE KUPPLUNGSEINHEIT
公开(公告)号：EP3096164A4
公开(公告)日：2017-01-25
申请号：EP14878417
申请日：2014-08-20
申请人： ZTE CORP , UNIV SHANGHAI
发明人： PANG FUFEI , WANG TINGYUN , XIA QIAN , CHEN SHIQIONG , ZHANG RENWU , GU XIN , ZHAO LI , LIU ZHE , WANG YU
IPC分类号： G02B6/42 , G02B6/34 , H04B10/25
CPC分类号： G02B6/4214 , G02B6/34 , G02B6/423 , G02B6/4244 , G02B6/425

40. 发明授权

EP1918747B1 Small-form-factor fiber optic transceiver module having built-in test capability and method 有权
标题翻译：光纤发射机和具有小形状因子接收机模块和内置测试能力和方法
公开(公告)号：EP1918747B1
公开(公告)日：2017-01-25
申请号：EP07254187.3
申请日：2007-10-22
申请人： The Boeing Company
发明人： Chan, Eric Y. , Koshinz, Dennis G. , Huang, Yuing
IPC分类号： G02B6/42 , G01M11/00
CPC分类号： G02B6/4214 , G01M11/3136 , G02B6/421 , G02B6/4246 , H01L2224/48137

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