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    • 37. 发明公开
    • Polyamide-epichlorohydrin resin
    • 聚酰胺 - 二氯乙烯树脂
    • EP0515750A3
    • 1993-06-16
    • EP91307716.0
    • 1991-08-21
    • Borden, Inc.
    • Chan, Lock LimLau, Patrick Wan-Kit
    • C08G69/48D21H17/55
    • C08G69/48D21H17/55D21H21/20
    • This invention describes a method for making a thermosetting polyamide-epichlorohydrin wet strength resin which contains substantially reduced amounts of organic-chlorine contaminants while its wet strength property remains comparable to commercial polyamide-epichlorohydrin resins. The reduction of the contaminants is attained by reacting less than the total amount of epichlorohydrin with polyamide at any one time to substantially react all of the epichlorohydrin with the polyamide while retaining a part of the dual reactive functionality of the epichlorohydrin to provide thermosetting wet strength to the resin.
    • 本发明描述了一种制备热固性聚酰胺 - 表氯醇湿强度树脂的方法,其含有基本上减少量的有机氯污染物,同时其湿强度性能与商业聚酰胺 - 表氯醇树脂相当。 污染物的减少通过使任何一次的小于表氯醇与聚酰胺的总量反应而实现,以使所有表氯醇与聚酰胺基本上反应,同时保留表氯醇的一部分双重反应性官能团以提供热固性湿强度 树脂。