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    • 30. 发明公开
    • METAL SURFACE PROTECTION FILM FORMING AGENT AND APPLICATION THEREOF
    • METALLOBERFLÄCHENSCHUTZFILMBILDNER和DENEN ANWENDUNG
    • EP1413650A4
    • 2004-12-08
    • EP02720614
    • 2002-04-26
    • AJINOMOTO KK
    • FURUTA KIYONORIKURAUCHI MASAHIKOSATO HIROYUKI
    • C09K13/06C09G1/02C09G1/04C23C22/68C23F3/00C23F3/04C23F11/10C23F11/14H01L21/304H01L21/3205H01L21/321C23F11/00
    • C09G1/02C09G1/04C23C22/68C23F3/00C23F3/04C23F11/144H01L21/3212
    • A metal surface protection film forming agent containing a specific Α−amino acid such as leucine and phenyl alanine, and a metal abrasive liquid using this. The agent can be used as an abrasive liquid used in a chemical−mechanical polishing method in semiconductor circuit fabrication, is composed of various safe additives light in environmental load, and can restrict the dishing of metal wiring especially copper metal wiring and corrosion during polishing. Such a specific Α−amino acid used adsorbs to a wiring metal surface, especially a copper metal surface buried in a substrate recess or reacts with the metal to prevent the elution of the metal and forms a protection film on the metal surface. A metal surface protection film forming agent and a method of polishing a substrate surface for producing a semiconductor−use substrate, a method of forming a metal surface protection film, the application of the specific amino acid to a metal surface protection film forming agent, and a semiconductor circuit−use substrate using them, a semiconductor circuit containing it and methods of producing them.
    • 含有特定的α-氨基酸例如亮氨酸和苯基丙氨酸的金属表面保护膜形成剂以及使用其的金属研磨液。 该试剂可以用作在半导体电路制造中的化学机械抛光方法中使用的研磨液,由环境负荷轻的各种安全添加剂组成,并且可以限制抛光期间金属布线特别是铜金属布线的凹陷和腐蚀。 所使用的这种特定的α-氨基酸吸附到布线金属表面,特别是埋入基板凹槽中的铜金属表面,或与金属反应以防止金属洗脱并在金属表面上形成保护膜。 一种金属表面保护膜形成剂和抛光基板表面以制造半导体用基板的方法,一种形成金属表面保护膜的方法,该特定氨基酸在金属表面保护膜形成剂上的应用,以及 使用它们的半导体电路用基板,包含它的半导体电路及其制造方法。