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21. 发明公开

EP0069505A3 Semiconductor device connection lead formation 失效
标题翻译：半导体器件连接引线形成
公开(公告)号：EP0069505A3
公开(公告)日：1985-01-02
申请号：EP82303255
申请日：1982-06-22
申请人： FUJITSU LIMITED
发明人： Kanai, Yasunori
IPC分类号： H01L23/14 , H01L23/52 , H01L23/04
CPC分类号： H05K3/3415 , H01L23/055 , H01L23/057 , H01L23/49827 , H01L23/5383 , H01L24/48 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/30107 , H05K3/3421 , H05K3/3447 , H05K2201/10659 , H05K2201/10689 , H05K2201/10704 , Y02P70/613 , H01L2224/45099 , H01L2924/00
摘要： Connection leads (32, 35) of a semiconductor device extending from a chip carrier housing (31) for connection with external circuitry are arranged in a plurality of rings, one within the other. The leads (32), in the outermost ring, are composed of surface connection leads to be electrically connected to the uppermost layer (41) only of a multilayer printed circuit board (40) and the connecting leads in the inner ring or rings are composed of lead pins (35) to be inserted into and be electrically connected to plated through holes (35) of the multilayer printed circuit board (40) for connection to other layers (43) of the board (40).

22. 发明公开

EP0104565A3 Mounting of electronic components on printed circuit boards 失效
标题翻译：电子元件在印刷电路板上的安装
公开(公告)号：EP0104565A3
公开(公告)日：1984-10-03
申请号：EP83109223
申请日：1983-09-17
申请人： NORTHERN TELECOM LIMITED
发明人： Berger, Jean Phillip , Crothers, Carlyle Wellesley
IPC分类号： H05K03/34 , H05K03/30
CPC分类号： H05K3/3415 , H05K3/30 , H05K3/3447 , H05K3/3484 , H05K2203/0126 , H05K2203/1446 , H05K2203/1476 , H05K2203/1572 , Y02P70/613
摘要： Mounting of leaded components on one side of a PCB and surface mounting components on the other side of the PCB creates problems. The pressure of the lead ends projecting through the PCB prevents the use of a mask for applying solder paste for the mounting of the surface mounting components. Attaching surface mounting components initially by adhesive prior to wave soldering also causes problems. In the present invention leaded components are inserted and the lead ends crimped. The board is then turned over, solder paste applied by individual applicator nozzles to the lead ends and to solder pads on the circuit pattern. The surface mounting components are then positioned with contact areas aligned with the solder pads and the whole reflow soldered. The process can be repeated for surface mounting components on the same side as the original leaded components, with or without the insertion of further leaded components on the same side as the original surface mounting components.

23. 发明授权

EP1645015B1 COMPOSANT, CIRCUIT IMPRIME DOUBLE FACE ET PROCEDE POUR REALISER UNE CONNEXION ELECTRIQUE D UN CIRCUIT IMPRIME DOUBLE FACE 有权
标题翻译：元件，双面印刷电路和用于制造双面印刷电路的电连接的方法
公开(公告)号：EP1645015B1
公开(公告)日：2018-03-21
申请号：EP04767723.2
申请日：2004-07-16
申请人： Groupe Brandt
发明人： CORNEC, René , FOURNIER, Dominique , MARLIOT, Eric
IPC分类号： H01R12/52 , H05K3/40 , H01R31/08 , H05K3/34
CPC分类号： H01R12/526 , H01R31/08 , H05K3/3415 , H05K3/3447 , H05K3/4046 , H05K2201/10363

24. 发明授权

EP2658035B1 Terminal manufacturing method and board connector 有权
标题翻译：终端的制造工艺和磁盘连接器
公开(公告)号：EP2658035B1
公开(公告)日：2015-09-09
申请号：EP13001123.2
申请日：2013-03-06
申请人： Sumitomo Wiring Systems, Ltd.
发明人： Kobayashi, Kazumasa
IPC分类号： H01R12/58 , H01R13/03 , H01R43/16 , B21C1/02 , B21C3/00 , H05K3/34
CPC分类号： H01R43/0256 , B21C1/02 , B21C3/00 , H01R12/585 , H01R12/71 , H01R13/03 , H01R43/16 , H05K3/3415 , Y10T29/49153

25. 发明公开

EP2332189A4 LIGHT AND PROCESS OF MANUFACTURING A LIGHT 审中-公开
标题翻译：照明及其制造方法的照明
公开(公告)号：EP2332189A4
公开(公告)日：2014-12-10
申请号：EP09813608
申请日：2009-09-10
申请人： NEXXUS LIGHTING INC
发明人： GRAJCAR ZDENKO
IPC分类号： H05K1/14 , F21K99/00 , F21V23/00 , H05K3/30 , H05K3/34 , H05K3/36
CPC分类号： H05K1/144 , F21K9/00 , H05K1/0204 , H05K3/0052 , H05K3/0097 , H05K3/306 , H05K3/3415 , H05K3/368 , H05K2201/09027 , H05K2201/09063 , H05K2201/10106 , H05K2201/10303 , H05K2201/10818 , H05K2203/0169 , H05K2203/166 , Y10T29/49124 , Y10T29/4913 , Y10T29/49144

26. 发明公开

EP2647270A1 LÖTVERFAHREN UND ENTSPRECHENDE LÖTEINRICHTUNG 无效
标题翻译：焊接及相关焊接
公开(公告)号：EP2647270A1
公开(公告)日：2013-10-09
申请号：EP12815642.9
申请日：2012-12-21
申请人： Isabellenhütte Heusler GmbH & Co. Kg
发明人： HETZLER, Ulrich , STÜHN, Rüdiger
IPC分类号： H05K3/34 , H05K1/02
CPC分类号： H05K1/0212 , H05K1/111 , H05K1/181 , H05K3/3415 , H05K3/3494 , H05K2201/10022 , Y10T29/49144 , Y10T29/53174
摘要： The invention relates to a soldering method and a corresponding soldering device for soldering a printed circuit board (2) to an electric component (8) using a solder (6, 7), said solder (6, 7) being melted by heat and then connecting the component (8) to the printed circuit board (2). The heat required to melt the solder (6, 7) is generated by electrically energizing the component (8), thereby generating an electric heat loss in the component (8), said heat loss being transferred from the component (8) to the solder (6, 7) and melting the solder (6, 7).

27. 发明公开

EP2325600A1 DISTANCE DETECTION INDUCTION DEVICE 审中-公开
标题翻译：距离检测感应装置
公开(公告)号：EP2325600A1
公开(公告)日：2011-05-25
申请号：EP09809249.7
申请日：2009-08-27
申请人： Shanghai Kohler Electronics, Ltd.
发明人： TANG, Qiaomei , LIU, Xingyan , CHEN, Guofeng
IPC分类号： G01C3/06
CPC分类号： G01S17/48 , G01S7/4813 , G01S17/026 , H05K1/184 , H05K3/3415 , H05K2201/10106 , H05K2201/10121
摘要： The present invention discloses a distance detecting sensor, comprising: a housing, a focusing lens, a circuit board, as well as a transmitter device for transmitting infrared light rays and a receiver device for receiving and sensing the reflected infrared light rays, wherein the housing comprises an elongated main body and two apertures located on a top surface of the main body; the lens comprises a transmitting lens and a receiving lens located at positions of the two apertures of the housing; the circuit board is received in the main body of the housing and located below the lens; the transmitter device and the receiver device are positioned directly below the transmitting lens and the receiving lens, wherein the transmitter device is an infrared light emitting diode and the receiver device is a distance detecting sensing module. The transmitter device and the receiver device are installed on the lower side of the circuit board; and the circuit board is provided thereon, between the transmitting lens and the transmitter device and between the receiving lens and the receiver device, with first and second via holes through which the transmitted light rays and the received light rays can pass, respectively. The distance detecting sensor of the present invention tends to be miniaturized and is easily produced and manufactured.
摘要翻译：本发明公开了一种距离检测传感器，包括壳体，聚焦透镜，电路板以及用于发射红外光线的发射器装置以及用于接收和感测反射的红外线射线的接收器装置，其中壳体包括细长的主体和位于主体的顶面上的两个孔; 所述透镜包括位于所述壳体的所述两个孔的位置处的发射透镜和接收透镜; 电路板容纳在壳体的主体中并位于透镜下方; 发射器装置和接收器装置位于发射透镜和接收透镜的正下方，其中发射器装置是红外发光二极管而接收器装置是距离探测感测模块。发射器装置和接收器装置安装在电路板的下侧; 并且电路板在发送透镜和发送器装置之间以及接收透镜和接收器装置之间分别设置有第一和第二通孔，透射光线和接收光线可以分别通过该第一和第二通孔。本发明的距离检测传感器趋向于小型化并且容易生产和制造。

28. 发明公开

EP2031945A3 Verfahren zur Montage von elektronischen Bauteilen und elektromechanischen Komponenten auf einer Leiterplatte 审中-公开
标题翻译：一种用于在电路基板上安装电子元件，机电元件的方法
公开(公告)号：EP2031945A3
公开(公告)日：2010-05-05
申请号：EP08014607.9
申请日：2008-08-18
申请人： Elster Messtechnik GmbH
发明人： Ohlemüller, Patrick
IPC分类号： H05K3/34
CPC分类号： H05K3/3415 , H05K3/3421 , H05K3/3447 , H05K2201/09781 , H05K2201/10659 , Y02P70/613
摘要： Die Erfindung betrifft ein Verfahren zur Montage von elektrischen Komponenten (20 auf einer Leiterplatte (50), wobei die wenigstens eine elektrische Komponente (20) mehrere elektrisch leitende Anschlusspins (10), sowie wenigstens ein mechanisches Anschlusspin (60) aufweist und auf einer Seite, der Bestückungsseite (1), auf die Leiterplatte (50), aufgesetzt wird, gekennzeichnet durch folgende Verfahrensschritte:
Die elektrisch leitenden Anschlusspins (10) der elektrischen Komponente (20 werden umgebogen und das wenigstens eine mechanische Anschlusspin (60) der elektrischen Komponente (20) wird durch eine in der Leiterplatte vorgesehene Durchgangsbohrung (40) geführt, wodurch die jeweilige elektrische Komponente (20) und die umgebogenen elektrisch leitenden Anschlusspins (10) auf der Bestückungsseite (1) der Leiterplatte (50) aufgesetzt werden. Nach dem Aufsetzen der elektrischen Komponente (20) auf der Leiterplatte (50) werden die mechanischen und elektrisch leitenden Anschlusspins (10), (60) fixiert, vorzugsweise verlötet.

29. 发明公开

EP1586224A4 COVER FOR BALL-GRID ARRAY CONNECTOR 审中-公开
标题翻译： COVER球栅阵列连接器
公开(公告)号：EP1586224A4
公开(公告)日：2009-04-29
申请号：EP04701244
申请日：2004-01-09
申请人： FRAMATOME CONNECTORS INT
发明人： SHUE THOMAS L , EMENHEISER MATTHEW S
IPC分类号： H01R12/71 , H05K3/30 , H05K3/34 , H05K7/10 , H05K5/00
CPC分类号： H05K7/1053 , H05K3/3415 , H05K3/3426 , H05K3/3494 , H05K2201/10189 , H05K2203/081 , H05K2203/1476 , H05K2203/304
摘要： A presently-preferred embodiment of a cover (50) for a ball-grid array connector comprises a top member (50a) and a first and a second side member (50b,c) adjoining opposing ends of the top member (50a). The first and the second side members (50b,c) each have a mating feature (50d) formed thereon for engaging a housing (20) of the ball-grid array connector by way of a respective complementary mating feature (28) formed in the housing (20) so that the cover (50) is movable between a first and second position in relation to the housing (20).

30. 发明公开

EP1917844A2 VERFAHREN ZUM LÖTEN VON SMD-BAUTEILEN, LEITERPLATTEUND REF LOW-LÖTOFEN DAZU 失效转让
标题翻译：方法用于焊接SMD组件在印刷电路板和回流炉
公开(公告)号：EP1917844A2
公开(公告)日：2008-05-07
申请号：EP06777763.1
申请日：2006-07-13
申请人： Endress+Hauser GmbH+Co. KG
发明人： BIRGEL, Dietmar , HAUPTVOGEL, Karl-Peter
IPC分类号： H05K3/34
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K2201/42 , H05K3/3415 , H05K2203/1563 , H05K2203/1572 , H05K2203/1581
摘要： The invention enables lead-free soldering, in a reflow soldering furnace, of thermally critical, surface-mounted components together with thermally uncritical SMD components, on one side of a printed circuit board. Thermally critical and uncritical components (20, 22) are inserted into the soldering paste on the printed circuit board (10). According to the invention, said printed circuit board (10) is transported with other printed circuit boards (10), with the equipped first side facing upwards, through the reflow soldering furnace (30), and soldered in a soldering chamber (42). Thermal energy acting on the printed circuit board (10) in the lower region (46) thereof is adjusted in the soldering chamber (42) in such a way that the temperature on the lower side of the printed circuit board (10) is higher than that on the equipped upper side of the printed circuit board (10). The soldering paste on the upper side of the printed circuit board (10) is reliably melted by said indirect heating, and the temperature of the thermally critical components on the upper side of the printed circuit board (10) is maintained below the critical temperature.

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