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21. 发明授权

EP1983809B1 Printed wiring board 有权
公开(公告)号：EP1983809B1
公开(公告)日：2018-09-12
申请号：EP08007057.6
申请日：2008-04-09
申请人： YAZAKI CORPORATION
发明人： Masaoki, Yoshida , Nakayama, Takuya , Ueyama, Koji
IPC分类号： H05K1/11 , H05K1/02 , H05K3/34
CPC分类号： H05K1/116 , H05K1/0256 , H05K3/3447 , H05K2201/09363 , H05K2201/09463 , H05K2201/0969 , H05K2201/09718 , H05K2201/10651 , H05K2203/1446
摘要： The present invention is to provide a printed wiring board which can certainly prevent damage of conductive pattern caused by the terminal. The printed wiring board has a board, a conductive pattern, a through-hole and a non-conductive area. A lead wire of resistance mounted on the printed wiring board is inserted into the through-hole 4. The lead wire projects from a surface of the board, and is bent close to the surface. The non-conductive area is formed into a fan-shaped shape enlarging toward a tip of the lead wire from a center of the through-hole. Since the bent lead wire is arranged on the non-conductive area, the non-conductive area can prevent damage of the conductive pattern which is caused by touching the lead wire to the conductive pattern.

22. 发明公开

EP3057211A4 DRIVER SUBSTRATE AND POWER CONVERSION DEVICE 有权转让
标题翻译： TREBSERSUBSTRAT和LEISTUNGSUMWANDLUNGSVORRICHTUNG
公开(公告)号：EP3057211A4
公开(公告)日：2017-05-24
申请号：EP14852693
申请日：2014-10-01
申请人： HITACHI AUTOMOTIVE SYSTEMS LTD
发明人： KATO TAKESHI , TSUJI MASASHIGE , HIRANUMA SATOSHI
IPC分类号： H02M1/08 , H02M7/48 , H05K1/02 , H05K1/18
CPC分类号： H02M5/458 , H02M1/08 , H02M7/003 , H03K17/61 , H03K2217/0081 , H05K1/0256 , H05K1/181 , H05K2201/10053 , H05K2201/10121 , H05K2201/10545
摘要： Provided is a driver board capable of miniaturizing itself while ensuring insulation voltage resistance performance. In the driver board: a transformer 114 is configured, so as to cross a first insulating region 120a, such that a primary side terminal 114a is connected to a primary side circuit 112a and a secondary side terminal 114b is connected to a secondary side circuit 113a; a power supply control IC 115 is configured, so as to cross a insulating region 120b, such that a primary side terminal 115a is connected to a primary side circuit 112b and a secondary side terminal 115b is connected to a secondary side circuit 113b; and the insulating region 120a and the insulating region 120b are formed so as to at least partially face each other via an insulating board 111 such that the primary side circuit 112a and the secondary side circuit 113b do not face each other via the insulating board and the primary side circuit 112b and the secondary side circuit 113a do not face each other via the insulating board.
摘要翻译：提供了一种能够在确保绝缘耐压性能的同时使其自身小型化的驱动器板。在驱动器板中：变压器114被构造成跨越第一绝缘区域120a，使得初级侧端子114a连接到初级侧电路112a，并且次级侧端子114b连接到次级侧电路113a ; 电源控制IC 115被配置成跨越绝缘区域120b，使得初级侧端子115a连接到初级侧电路112b，并且次级侧端子115b连接到次级侧电路113b; 并且绝缘区域120a和绝缘区域120b经由绝缘板111形成为至少部分地彼此面对，使得初级侧电路112a和次级侧电路113b不通过绝缘板彼此面对，并且初级侧电路112b和次级侧电路113a不通过绝缘板彼此面对。

23. 发明公开

EP2248855A4 PROCESS FOR PRODUCING RESIN COMPOSITION WITH PARTIAL-DISCHARGE RESISTANCE, RESIN COMPOSITION WITH PARTIAL-DISCHARGE RESISTANCE, AND INSULATING MATERIAL WITH PARTIAL-DISCHARGE RESISTANCE 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER HARZZUSAMMENSETZUNG MIT TEILENTLADUNGSRESISTENZ，HARZZUSAMMENSETZUNG MIT TEILENTLADUNGSRESISTENZ UND ISOLIERMATERIAL MIT TEILENTLADUNGSRESISTENZ
公开(公告)号：EP2248855A4
公开(公告)日：2017-05-17
申请号：EP08872604
申请日：2008-08-04
申请人： TOSHIBA KK , A SCHOOL CORP KANSAI UNIV
发明人： OZAKI TAMON , IMAI TAKAHIRO , SAWA FUMIO , MURAYAMA KIYOKO , KOMIYA GEN , SHIMIZU TOSHIO , TODO YOKO , HOMMA MITSUTAKA , SAKAGUCHI OSAMU , OCHI MITSUKAZU , KURAYA MIYUKI
IPC分类号： C08G59/42 , C08K3/34 , H01B3/40 , H05K1/02 , H05K1/03
CPC分类号： H05K1/0373 , C08G59/42 , C08K3/346 , H01B3/40 , H05K1/0256 , H05K1/0257 , H05K2201/0209
摘要： Fabricating a partial discharge resistant resin composite with an excellent partial discharge resistance with a small density, in a simplified manner. Using an ion exchange treatment for intercalating an organic compound between layers of a layer clay mineral thereby providing the layer clay mineral with a swellability to at least one of a polar solvent and a non-polar solvent, having the layer clay mineral as provided with a swellability swollen in a swelling solvent comprising the polar solvent or the non-polar solvent, followed by mixing an epoxy resin and kneading, making a removal of the swelling solvent from an obtained mixture including the swelling solvent, the layer clay mineral, and the epoxy resin, adding a hardener for epoxy resin to the mixture including the layer clay mineral and the epoxy resin, and mixing the mixture. In a partial discharge resistant insulation material comprising a hardened material of a partial discharge resistant resin composite thus fabricated, there is a network of molecular chains (1) of the epoxy resin constituting a cross-linked structure, with a system of inorganic nanoparticles (2) comprising the layer clay mineral and precisely and evenly dispersed therein.
摘要翻译：以简单的方式制造具有优异的局部放电抗性且具有小密度的耐局部放电性树脂组合物。使用离子交换处理在层状粘土矿物的层之间插入有机化合物，由此使层状粘土矿物具有对至少一种极性溶剂和非极性溶剂的溶胀性，具有层状粘土矿物，在包含极性溶剂或非极性溶剂的溶胀溶剂中膨胀，然后混合环氧树脂并捏合，从得到的包含溶胀溶剂，层状粘土矿物和环氧树脂的混合物中除去溶胀溶剂向包括层状粘土矿物和环氧树脂的混合物中加入用于环氧树脂的固化剂，并混合该混合物。在包含如此制造的局部放电抗性树脂复合材料的硬化材料的耐局部放电绝缘材料中，存在构成交联结构的环氧树脂的分子链（1）网络与无机纳米粒子体系（2 ）包含层状粘土矿物并精确且均匀地分散于其中。

24. 发明公开

EP3054543A4 ELECTRICAL CONNECTION BOX 失效
标题翻译：电箱
公开(公告)号：EP3054543A4
公开(公告)日：2016-12-21
申请号：EP14860440
申请日：2014-10-15
申请人： AUTONETWORKS TECHNOLOGIES LTD , SUMITOMO WIRING SYSTEMS , SUMITOMO ELECTRIC INDUSTRIES
发明人： HACHIYA YOSHIKAZU
IPC分类号： H02G3/08 , B60R16/023 , B60R16/03 , H05K1/02 , H05K3/10 , H05K3/22 , H05K3/24 , H05K3/46
CPC分类号： B60R16/03 , B60R16/0239 , H02G3/081 , H02G3/088 , H05K1/0256 , H05K1/0265 , H05K3/103 , H05K3/24 , H05K3/4617 , H05K3/4626 , H05K2201/09063 , H05K2201/09945 , H05K2201/10272
摘要： Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box (10) includes a bus bar circuit unit (12) obtained by arranging a plurality of bus bars (28a to 28g) including a power source-side bus bar (28c) to be connected to a power source line and a ground-side bus bar (28d) to be connected to a ground line on insulated boards (26a, 26b). In the electrical junction box (10), the power source-side bus bar (28c) and the ground-side bus bar (28d) are arranged adjacent to each other, and an oxide deposition inhibiting structure (42) is provided in exposed portions (44a to 44c) of the insulated board (26a) exposed through a gap between the power source-side bus bar (28c) and the ground-side bus bar (28d).

25. 发明公开

EP3055749A1 USING MATERIALS TO INCREASE STRUCTURAL RIGIDITY, DECREASE SIZE, IMPROVE SAFETY, ENHANCE THERMAL PERFORMANCE AND SPEED CHARGING IN SMALL FORM FACTOR DEVICES 审中-公开
标题翻译：在结构提高强度材料的使用，以减少大小，以提高安全性，并提高器件充电速度的热量和功耗，小巧的外形
公开(公告)号：EP3055749A1
公开(公告)日：2016-08-17
申请号：EP13895118.1
申请日：2013-12-26
申请人： Intel Corporation
发明人： PIDWERBECKI, David , GALLINA, Mark , HEMMEYER, Mark , LOFLAND, Steven , ILAVARASAN, Ponniah , STEWART, Michael , BYRD, Kevin
IPC分类号： G06F1/16
CPC分类号： H04B1/3888 , G06F1/1626 , G06F1/1658 , G06F1/18 , G06F1/182 , G06F1/203 , H04M1/0202 , H04M1/026 , H04M1/0262 , H04M1/0277 , H04M1/185 , H05K1/0256 , H05K1/0373 , H05K3/284 , H05K2203/1327
摘要： Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.

26. 发明公开

EP3054543A1 ELECTRICAL CONNECTION BOX 失效
标题翻译： ELEKTRISCHE ANSCHLUSSDOSE
公开(公告)号：EP3054543A1
公开(公告)日：2016-08-10
申请号：EP14860440.8
申请日：2014-10-15
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , Sumitomo Electric Industries, Ltd.
发明人： HACHIYA, Yoshikazu
IPC分类号： H02G3/16 , H05K1/02 , H05K7/06
CPC分类号： B60R16/03 , B60R16/0239 , H02G3/081 , H02G3/088 , H05K1/0256 , H05K1/0265 , H05K3/103 , H05K3/24 , H05K3/4617 , H05K3/4626 , H05K2201/09063 , H05K2201/09945 , H05K2201/10272
摘要： Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box (10) includes a bus bar circuit unit (12) obtained by arranging a plurality of bus bars (28a to 28g) including a power source-side bus bar (28c) to be connected to a power source line and a ground-side bus bar (28d) to be connected to a ground line on insulated boards (26a, 26b). In the electrical junction box (10), the power source-side bus bar (28c) and the ground-side bus bar (28d) are arranged adjacent to each other, and an oxide deposition inhibiting structure (42) is provided in exposed portions (44a to 44c) of the insulated board (26a) exposed through a gap between the power source-side bus bar (28c) and the ground-side bus bar (28d).
摘要翻译：本发明提供一种具有新颖结构的电接线盒，其能够在不依赖于电接线盒的防水结构的情况下防止水渗透后的车辆火灾。电接线盒（10）包括通过布置多个汇流条（28a至28g）获得的母线电路单元（12），该汇流条包括要连接到电源线的电源侧汇流条（28c）和接地侧母线（28d）连接到绝缘板（26a，26b）上的接地线。在电接线盒（10）中，电源侧汇流条（28c）和接地侧母线（28d）彼此相邻配置，并且在暴露部分设置氧化物沉积抑制结构（42）通过电源侧汇流条（28c）和接地侧汇流条（28d）之间的间隙露出的绝缘基板（26a）的开口（44a〜44c）。

27. 发明授权

EP2784808B1 RESIN FOR ELECTRICAL COMPONENTS, SEMICONDUCTOR DEVICE, AND WIRING BOARD 失效转让
标题翻译：电子元件用树脂，半导体器件和接线板
公开(公告)号：EP2784808B1
公开(公告)日：2016-07-06
申请号：EP12851940.2
申请日：2012-10-18
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： MINAMIO, Masanori , IKEUCHI, Hiroki
IPC分类号： H01L23/29 , H01L23/31 , H05K1/03 , H05K3/46 , H01L23/498 , H01L23/427 , H01L23/433 , H01L23/495 , H05K1/02 , H05K3/28 , H01L23/00 , H05K1/18
CPC分类号： H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

28. 发明公开

EP2784808A4 RESIN FOR ELECTRICAL COMPONENTS, SEMICONDUCTOR DEVICE, AND WIRING BOARD 失效转让
标题翻译：树脂电机元件，半导体器件和电路板
公开(公告)号：EP2784808A4
公开(公告)日：2015-10-07
申请号：EP12851940
申请日：2012-10-18
申请人： PANASONIC IP MAN CO LTD
发明人： MINAMIO MASANORI , IKEUCHI HIROKI
IPC分类号： H01L23/29 , H01L23/00 , H01L23/31 , H01L23/427 , H01L23/433 , H01L23/495 , H01L23/498 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/28 , H05K3/46
CPC分类号： H05K1/0306 , H01L23/295 , H01L23/3107 , H01L23/4275 , H01L23/4334 , H01L23/49537 , H01L23/49575 , H01L23/49822 , H01L23/49861 , H01L23/49894 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48137 , H01L2224/48247 , H01L2224/4903 , H01L2224/73265 , H01L2924/00014 , H01L2924/181 , H01L2924/3025 , H05K1/0201 , H05K1/0203 , H05K1/0209 , H05K1/0224 , H05K1/0256 , H05K1/0373 , H05K1/186 , H05K3/284 , H05K3/285 , H05K3/4676 , H05K2201/0227 , H05K2201/0376 , H05K2201/0723 , H05K2201/1056 , H05K2201/10969 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device is a resin package structure including a semiconductor element T1 molded with a first resin 6. The first resin 6 contains a filler 7 including an electrical insulating capsule enclosed with a phase-change-material that absorbs ambient heat and phase-changes so as to increase a dielectric-strength. The effect of the filler 7 achieves a structure with satisfactory heat dissipation and a high withstand voltage.

29. 发明授权

EP1895584B1 Method of manufacturing a thermally conductive substrate with leadframe and heat radiation plate 有权
标题翻译：一种用于与引线框和导热板制备导热基板的制造方法
公开(公告)号：EP1895584B1
公开(公告)日：2010-12-22
申请号：EP07021191.7
申请日：2001-05-30
申请人： Panasonic Corporation
发明人： Yamashita, Yoshihisa , Hirano, Koichi , Nakatani, Seiichi , Matsuo, Mitsuhiro
IPC分类号： H01L23/433 , H01L23/498 , H01L21/48
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00

30. 发明公开

EP2232652A1 STECKVERBINDERTEIL, STECKVERBINDUNG, GERÄT UND VERFAHREN ZUR HERSTELLUNG EINES GERÄTS 有权
标题翻译： STECKVERBINDERTEIL，STECKVERBINDUNG，GERÄTUND VERFAHREN ZUR HERSTELLUNG EINESGERÄTS
公开(公告)号：EP2232652A1
公开(公告)日：2010-09-29
申请号：EP08871567.7
申请日：2008-11-20
申请人： SEW-Eurodrive GmbH & Co
发明人： ENDERLE, Christian , MÜLLER, Michael , SIMON, Olaf
IPC分类号： H01R43/02 , H01R43/20 , H01R13/506 , H01R13/53 , H01R12/16
CPC分类号： H01R13/53 , H01R12/716 , H01R13/5045 , H01R13/506 , H01R43/0256 , H01R43/205 , H05K1/0256 , H05K3/306 , H05K3/3447
摘要： The invention relates to a plug connector part, a plug connection, a device and a method for the production of a device, wherein the plug connector part comprises an insulating part, particularly a plastic part, on which a recess is integrally formed, particularly a second recess, wherein connecting pins are accommodated in the insulating part, wherein an insulating body can be connected to the recess of the insulating part for enlarging the air gap between the connecting pins.
摘要翻译：本发明涉及一种插头连接器部件，插头连接器，装置和用于制造器件的方法，其中插头连接器部件包括绝缘部件，特别是塑料部件，凹部一体地形成在其上，特别地，第二凹部，其中连接销被容纳在绝缘部分中，其中绝缘体可以连接到绝缘部分的凹部，用于扩大连接销之间的气隙。

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