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21. 发明公开

EP2615194A3 Resin plating method using graphene thin layer 审中-公开
标题翻译： Harzbeschichtungsverfahren mitGraphendünnschicht
公开(公告)号：EP2615194A3
公开(公告)日：2014-08-20
申请号：EP13162845.5
申请日：2011-04-07
申请人： Samsung Electronics Co., Ltd
发明人： Bae, Ah Hyun , Son, Sang Ik , Nam, Jae Do , Lee, Jun Ho , Hwang, Tae Seon , Oh, Joon Suk
IPC分类号： C23C18/20 , C25D5/56 , C23C18/31 , C23C18/16 , C25D5/10 , C23C18/40
CPC分类号： C25D5/56 , C23C18/1653 , C23C18/2006 , C23C18/2066 , C23C18/2073 , C23C18/31 , C23C18/405 , C25D5/10
摘要： According to an example embodiment a method of plating resin using a graphene thin layer includes forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on the resin substrate. The forming of the graphene thin layer comprises applying an expanded graphite dispersion to the resin substrate.
摘要翻译：根据一个示例性实施例，使用石墨烯薄层对树脂进行镀覆的方法包括在树脂基板上形成石墨烯薄层并对形成在树脂基板上的具有石墨烯薄层的树脂基板进行电镀。

22. 发明公开

EP2561117A1 PROCEDE DE REVETEMENT D'UNE SURFACE D'UN SUBSTRAT EN MATERIAU NON METALLIQUE PAR UNE COUCHE METALLIQUE 有权转让
标题翻译：方法用于涂覆基材的表面由不含金属材料有金属层
公开(公告)号：EP2561117A1
公开(公告)日：2013-02-27
申请号：EP11723649.7
申请日：2011-04-19
申请人： Pegastech
发明人： ROUSSEL, Sébastien , GILBERT, Frida
IPC分类号： C23C18/22 , C23C18/30 , C23C18/40 , C23C18/44 , C23C18/54
CPC分类号： C23C18/1886 , C23C18/1639 , C23C18/1653 , C23C18/1658 , C23C18/1855 , C23C18/1896 , C23C18/2013 , C23C18/2073 , C23C18/22 , C23C18/38 , C23C18/40 , C23C28/023 , C25D5/56 , C25D9/02 , Y10T428/31678
摘要： The present invention relates to a process for coating a surface of a substrate made of nonmetallic material with a metal layer. According to this invention, the coating process consists of the following steps: a. a substrate made of nonmetallic material is provided, b. at least part of at least one surface of said substrate is subjected to a physical or chemical treatment for increasing the specific surface area thereof, c. that surface of said substrate which was treated in step b) is subjected to an oxidizing treatment, d. that surface of said substrate which was treated in step c) is brought into contact with a solution containing at least one ion of at least one metal and its counterion, said metal being chosen from the group formed by the metals of groups IB and VIII of the Periodic Table of the Elements, e. a substrate comprising ions of at least one metal that are chemically attached to the nonmetallic material constituting the substrate on at least part of at least one of its surfaces is obtained, f. said ions of at least one metal that are chemically attached to the nonmetallic material constituting the substrate on a surface of said substrate are subjected to a reducing treatment and a substrate comprising atoms of at least one metal that are chemically attached to the nonmetallic material constituting the substrate on at least part of at least one of its surfaces is obtained, g. the surface comprising particles of at least one metal which was obtained in step f) is brought into contact with a solution containing ions of at least one metal, h. a coating formed by a layer of at least one metal is obtained on the treated surface of said substrate, said steps optionally being followed or preceded by one or more rinsing steps. The invention also relates to a substrate made of nonmetallic material, at least one surface of which is coated with a metal activation layer formed by atoms of a metal that are bonded, through metal-ligand interaction, directly to the constituent material of the substrate by carboxyl (-COOH), hydroxyl (-OH), alkoxyl (-OR), carbonyl (-C=O), percarbonic (-CO-O-OH), nitro (N=O) or amide (-CONH) groups, said activation layer being covered with a layer of an identical or different metal deposited by electroless deposition.

23. 发明公开

EP2559786A1 Stable catalyst solution for electroless metallization 有权
标题翻译： StabileKatalysatorlösungzur stromlosen Metallabscheidung
公开(公告)号：EP2559786A1
公开(公告)日：2013-02-20
申请号：EP12180785.3
申请日：2012-08-17
申请人： Rohm and Haas Electronic Materials, LLC
发明人： Milum, Kristen M. , Cleary, Donald E. , Rzeznik, Maria Anna
IPC分类号： C23C18/18 , C23C18/20 , C23C18/31 , C23C18/38
CPC分类号： C23C18/1662 , C23C18/206 , C23C18/2073 , C23C18/2086 , C23C18/30 , C23C18/31 , C23C18/32 , C23C18/38
摘要： Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin.
摘要翻译：催化剂包括催化金属和没食子酸或没食子酸衍生物或其盐的纳米颗粒。催化剂用于化学镀金属。催化剂不含锡。

24. 发明公开

EP1734156A1 Verfahren zur Direktmetallisierung von nicht leitenden Substraten 有权
标题翻译：一种用于非导电性基板的直接金属化过程
公开(公告)号：EP1734156A1
公开(公告)日：2006-12-20
申请号：EP06011977.3
申请日：2006-06-09
申请人： Enthone, Inc.
发明人： Königshofen, Andreas, Dr. , Möbius, Andreas Prof. Dr.
IPC分类号： C25D5/54 , C23C18/16 , C23C18/31
CPC分类号： C25D5/54 , C23C18/1653 , C23C18/2073 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/31 , H05K3/188
摘要： Um ein Verfahren zum Metallisieren eines nicht leitenden Substrates aufweisend wenigstens die Verfahrensschritte:
Kontaktieren des Substrats mit einer metallhaltigen Aktivatorlösung,
Kontaktieren des mit der Aktivatorlösung kontaktierten Substrats mit einer Metallsalzlösung, aufweisend wenigstens ein durch ein Metall der Aktivatorlösung reduzierbares Metall, einen Komplexbildner sowie wenigstens ein Metall der Gruppe bestehend aus Lithium, Natrium, Kalium, Rubidium, Cäsium,
anschließendes stromloses oder galvanisches Beschichten des behandelten Substrats mit einem Metall, anzugeben, wird mit der Erfindung vorgeschlagen, dass die Metallsalzlösung das Metall der Gruppe 1A als Salz der Gruppe bestehend aus Fluoriden, Chloriden, lodiden, Bromiden, Nitraten, Sulfaten oder Mischungen dieser aufweist.

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