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21. 发明授权

EP2684904B1 RESIN COMPOSITION, AND PREPREG AND LAMINATED SHEET CONTAINING SAME 有权
标题翻译：树脂组合物和预浸料和层压薄膜SO
公开(公告)号：EP2684904B1
公开(公告)日：2017-01-11
申请号：EP12754288.4
申请日：2012-03-05
申请人： Mitsubishi Gas Chemical Company, Inc.
发明人： OHTSUKA, Hajime , UEYAMA, Daisuke , SOGAME, Masanobu
IPC分类号： C08G59/40 , C08J5/24 , C08K3/00 , C08K3/38 , C08L63/00 , C08K9/02
CPC分类号： H05K1/0373 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/20 , B32B27/26 , B32B2262/101 , B32B2264/102 , B32B2264/104 , B32B2307/302 , B32B2307/3065 , B32B2457/08 , C08G59/4014 , C08J5/24 , C08K3/013 , C08K3/38 , C08K9/02 , C08K2003/387 , H05K1/056 , Y10T428/31529 , C08K3/0033 , C08L63/00
摘要： [Problem to be solved] To provide a resin composition which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. [Solution] There is used a resin composition comprising an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.

22. 发明公开

EP3103825A1 RESIN COMPOSITION FOR PRINTED-CIRCUIT BOARD, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN COMPOSITE SHEET, AND PRINTED-CIRCUIT BOARD 有权
标题翻译： HARZZUSAMMENSETZUNGFÜRLEITERPLATTE，PREPREG，METALLFOLIENKASCHIERTE LAMINATPLATTE，HARZVERBUNDFOLIE UND LEITERPLATTE
公开(公告)号：EP3103825A1
公开(公告)日：2016-12-14
申请号：EP15746398.5
申请日：2015-02-03
申请人： Mitsubishi Gas Chemical Company, Inc.
发明人： ARII, Kenji , KOBAYASHI, Takashi , SOGAME, Masanobu , MABUCHI, Yoshinori , HIRAMATSU, Sotaro
IPC分类号： C08G59/40 , B32B15/08 , B32B15/092 , C08J5/24 , C08L63/00 , H05K1/03
CPC分类号： H05K1/0373 , B32B15/092 , B32B27/20 , B32B2307/306 , B32B2307/3065 , B32B2307/726 , B32B2457/08 , C08J5/24 , C08J2363/00 , C08K3/36 , C08K5/315 , H05K1/0366 , H05K3/022
摘要： A resin composition for a printed wiring board comprising:
a cyanate compound (A) represented by the following general formula (1); and
an epoxy resin (B),
wherein Ar 1 represents an aryl group, Ar 2 each independently represents a divalent substituent selected from the group consisting of a phenylene group, a naphthylene group, and a biphenylene group, Ar 3 each independently represents a p+1-valent substituent selected from the group consisting of a p+1-valent phenyl group, a p+1-valent naphthyl group, and a p+1-valent biphenyl group, R 1 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, and an aryl group, R 2 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, an aryl group, and a cyanato group, n represents number of cyanato groups bonded to Ar 1 and is an integer of 1 to 3, m represents number of R 1 bonded to Ar 1 , n + m + 2 is equal to or less than number of possible bonds to Ar 1 , p represents number of R 2 bonded to Ar 3 and is an integer of 1 to 9, x and y represent a ratio of repeating units, x is 1, whereas y is 0.25 to 2.0, and the repeating units for x and y may each be continuously arranged or may be alternately or randomly arranged with each other.
摘要翻译：一种印刷线路板用树脂组合物，其特征在于，含有下述通式（1）表示的氰酸酯化合物（A）。和环氧树脂（B），其中Ar 1表示芳基，Ar 2各自独立地表示选自亚苯基，亚萘基和亚联苯基的二价取代基，Ar 3各自独立地表示p + 1价取代基，选自p + 1价苯基，p + 1价萘基和p + 1价联苯基，R 1各自独立地表示选自由氢原子，烷基和芳基组成的基团，R 2各自独立地表示选自氢原子，烷基，芳基和氰基的一价取代基，n表示数的与Ar 1键合的氰基，为1〜3的整数，m表示与Ar 1键合的R 1的数，n + m + 2等于或小于Ar 1的可能键数，p表示 R 2与Ar 3键合，为1〜9的整数，x和y 表示重复单元的比例，x为1，y为0.25〜2.0，x和y的重复单元可以各自连续排列，也可以交替地或随机地排列。

23. 发明公开

EP3061745A1 CYANIC ACID ESTER COMPOUND, CURABLE RESIN COMPOSITION CONTAINING SAID COMPOUND, AND CURED PRODUCT THEREOF 无效
标题翻译： CYANSÄUREESTERVERBINDUNG，与此相关的固化树脂组合物和硬化产物
公开(公告)号：EP3061745A1
公开(公告)日：2016-08-31
申请号：EP14855327.4
申请日：2014-10-24
申请人： Mitsubishi Gas Chemical Company, Inc.
发明人： KATAGIRI, Masayuki , TOKUZUMI, Keita , TSUBUKU, Makoto , TSUJIMOTO, Tomoo , ARII, Kenji , KOBAYASHI, Takashi , SOGAME, Masanobu , MABUCHI, Yoshinori , HIRAMATSU, Sotaro
IPC分类号： C07C261/02 , C08K5/06 , C08L63/00 , C08L79/00
CPC分类号： H05K1/0346 , C07C261/02 , C07C265/14 , C07C2603/74 , C08G18/02 , C08G73/0655 , C08K3/01 , C08L61/04 , C08L63/00 , C08L79/00 , C08L79/04 , C09J179/00
摘要： There is provided a novel cyanate ester compound which has excellent solvent solubility and provides a hardened product having a low coefficiency of thermal expansion, and excellent flame retardancy and heat resistance. The present invention is a cyanate ester compound represented by the following formula (1):

wherein Ar represents an aromatic ring; R 1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m + n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R 2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R 1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R 3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
摘要翻译：本发明提供具有优异的溶剂溶解性，并且提供具有热膨胀低系数法的硬化产物的新型氰酸酯化合物，和优异的阻燃性和耐热性。本发明是由下式表示的氰酸酯化合物（1）：氩worin darstellt到芳族环; 的R 1各自独立地darstellt氢原子，烷基上的基团，或芳基; n各自unabhängigdarstellt上述1〜3的整数; m + n为相同的氢原子在包含芳香环和氢原子的一价芳族基团的总数; R 2表示氢原子（不包括其中Ar darstellt苯环的情况; n分别darstellt 1; R 1表示氢原子; m的每个darstellt 4，和氰酸酯基团键合到苯环相对于4-位在在金刚烷基），或在具有1至4个碳原子的烷基; 和R 3 darstellt氢原子或烷基具有1至4个碳原子基团。

24. 发明公开

EP3012294A1 RESIN COMPOSITION, PREPREG, RESIN SHEET AND METAL FOIL-CLAD LAMINATE 有权
标题翻译：树脂组合物，预浸料和金属薄膜包衣层压板
公开(公告)号：EP3012294A1
公开(公告)日：2016-04-27
申请号：EP14814473.6
申请日：2014-06-16
申请人： Mitsubishi Gas Chemical Company, Inc.
发明人： ARII, Kenji , KOBAYASHI, Takashi , SOGAME, Masanobu , MABUCHI, Yoshinori , MISHIMA, Hiroyuki
IPC分类号： C08L61/14 , B32B15/092 , C08G59/40 , C08J5/24 , C08K3/00 , C08K5/16 , C08L63/00 , H05K1/03
CPC分类号： H01B3/40 , B32B15/092 , B32B15/14 , B32B27/12 , B32B2260/021 , B32B2260/046 , B32B2457/08 , C08G10/04 , C08G14/12 , C08G73/0655 , C08J5/24 , C08J2363/00 , C08K3/36 , C08L61/18 , C08L61/34 , C08L63/00 , C08L79/04 , C09D161/18 , C09D161/34 , C09D163/00 , C09D179/04 , C09J161/34 , C09J179/04 , H01B3/307 , H01B3/36 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K2201/012
摘要： The resin composition of the present invention comprises a cyanate ester compound (A) obtained by cyanating a modified naphthalene formaldehyde resin, and an epoxy resin (B).

25. 发明公开

EP2774938A1 RESIN COMPOSITION, PREPREG, AND LAMINATED SHEET 有权
标题翻译： HARZZUSAMMENSETZUNG，PREPREG UND LAMINIERTE FOLIE
公开(公告)号：EP2774938A1
公开(公告)日：2014-09-10
申请号：EP12846152.2
申请日：2012-10-30
申请人： Mitsubishi Gas Chemical Company, Inc.
发明人： KOBAYASHI, Hiroaki , SOGAME, Masanobu , KATO, Yoshihiro
IPC分类号： C08G59/40 , C08J5/24 , C08K3/00 , C08K5/315 , C08L63/00
CPC分类号： C08K3/36 , C08G59/3218 , C08G59/40 , C08J5/24 , C08K3/00 , C08K5/315 , C08L63/00 , C08L65/02 , Y10T428/31511 , Y10T428/31529 , C08L79/04
摘要： A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition.
摘要翻译：本发明的树脂组合物含有选自具有特定结构单元的氰酸酯化合物（A1）〜（A3），环氧树脂（B），环氧树脂和无机填料（C）。本发明的预浸料通过用树脂组合物浸渍基材或将树脂组合物涂布在基材上而获得。此外，本发明的覆金属箔层压板是包含预浸料的层压体。此外，本发明的印刷电路板包含绝缘层和形成在绝缘层的表面上的导体层，其中绝缘层包含树脂组合物。

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