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11. 发明授权

EP3951808B1 SHUNT RESISTOR MODULE 有权转让
公开(公告)号：EP3951808B1
公开(公告)日：2023-03-22
申请号：EP20852846.3
申请日：2020-08-10
发明人： KO, Dong-Wan
IPC分类号： G01R1/20 , H01C1/144 , H01C1/148 , H05K1/18 , H01C1/012 , G01R31/364 , H01C1/014 , H01C7/06

12. 发明公开

EP3951808A1 SHUNT RESISTOR MODULE 有权转让
公开(公告)号：EP3951808A1
公开(公告)日：2022-02-09
申请号：EP20852846.3
申请日：2020-08-10
申请人： LG ENERGY SOLUTION, LTD.
发明人： KO, Dong-Wan
IPC分类号： H01C1/148 , H01C1/014 , H01C1/144 , H05K1/18
摘要： Disclosed is a shunt resistor module, which includes a shunt resistor having a resistor unit having a predetermined resistance, plate-shaped terminal units respectively configured to extend at both sides of the resistor unit, and a voltage measurement lead pin configured to protrude perpendicular to the terminal unit and having an end portion bent to be parallel to the terminal unit; and a PCB substrate having an assembly guide portion formed to be cut inward by a predetermined depth from an outermost side thereof, wherein the voltage measurement lead pin is fit into the assembly guide portion so that the resistor unit and the terminal unit are placed on a front surface of the PCB substrate and the end portion of the voltage measurement lead pin is caught at a rear surface of the PCB substrate.

13. 发明公开

EP3832675A1 MODULAR OVERVOLTAGE PROTECTION UNITS 审中-实审
公开(公告)号：EP3832675A1
公开(公告)日：2021-06-09
申请号：EP21150022.8
申请日：2015-05-28
申请人： RIPD IP ASSETS LTD
发明人： TSOVILIS, Thomas , GIANNELAKI, Eva , ASIMAKOPOULOU, Fani , BAKATSIAS, Konstantinos , POLITIS, Zafiris
IPC分类号： H01C7/12 , H01C13/02 , H01C1/022 , H01T1/16 , H01C1/014
摘要： A modular overvoltage protection unit for electrically connecting a first power line and/or a second power line to a protected earth (PE) line in the case of an overvoltage event on the first or second power line includes a unit enclosure defining an enclosure cavity, and first and second surge protection devices (SPDs) each disposed in the enclosure cavity. Each of the first and second SPDs includes: a first electrode in the form of a metal housing defining a housing cavity; a second electrode disposed within the housing cavity; and a varistor member captured between and electrically connected with each of the first and second electrodes, wherein the varistor member is formed of a varistor material. The overvoltage protection unit further includes: a first line terminal to connect the first power line to the overvoltage protection unit, wherein the first line terminal is electrically connected to the second electrode of the first SPD; a second line terminal to connect the second power line to the overvoltage protection unit, wherein the second line terminal is electrically connected to the second electrode of the second SPD; and a PE terminal to connect the PE line to the overvoltage protection unit, wherein the PE terminal is electrically connected to the metal housing of the second SPD. The metal housing of the first SPD is electrically connected to the PE terminal through the metal housing of the second SPD.

14. 发明公开

EP3261119A1 POWER SEMICONDUCTOR MODULE COMPONENTS AND ADDITIVE MANUFACTURING THEREOF 审中-公开
标题翻译：功率半导体模块组件及其添加剂制造
公开(公告)号：EP3261119A1
公开(公告)日：2017-12-27
申请号：EP16175368.6
申请日：2016-06-21
申请人： Infineon Technologies AG
发明人： Wilke, Ulrich , Cordes, Achim , Mücke, Achim , Tschirbs, Roman , Hohlfeld, Olaf
IPC分类号： H01L23/373 , H01L21/48 , H01L25/07 , H01C1/014 , H01C7/13 , H01C17/06 , H01L23/62
CPC分类号： H01L23/3735 , H01C1/014 , H01C7/13 , H01C17/06 , H01L21/4867 , H01L23/62 , H01L25/072
摘要： A power semiconductor module component comprises a substrate with a first surface and a first layer which is arranged on the first surface of the substrate, wherein at least one of the substrate and the first layer is at least partly manufactured by additive manufacturing.
摘要翻译：功率半导体模块组件包括具有第一表面和布置在衬底的第一表面上的第一层的衬底，其中衬底和第一层中的至少一个至少部分地通过增材制造来制造。

15. 发明公开

EP2410537A2 Method and apparatus for control of failed thermistor devices 有权
标题翻译：对于有缺陷的热敏电阻的控制方法和装置
公开(公告)号：EP2410537A2
公开(公告)日：2012-01-25
申请号：EP11174691.3
申请日：2011-07-20
申请人： Sensata Technologies Massachusetts, Inc.
发明人： Cohen, Jonathan F. , Porto, Gabriel , Kwok, Simon C. , Pellon, Christian V.
IPC分类号： H01C1/014 , H01C1/14
CPC分类号： H01C1/1406 , H01C1/014 , H01C7/02
摘要： A thermistor device (100) includes supports (102a,102b,108), contacts (104a,104b,109) and offset posts (106a,106b) configured to assist the fracturing of failed thermistor "pills" (110) and to distribute the fragments of the fractured pills into compartment away from electrically conductive contacts in order to minimize arcing and overheating.
摘要翻译：热敏电阻装置（100）包括被配置为协助失败热敏电阻 “药丸” 的压裂支撑件（102A，102B，108），接触件（104A，104B，109）和偏移的帖子（106A，106B）（110）和分发为了断裂药片成隔室由导电的金属触点的片段以最小化电弧放电和过热。

16. 发明公开

EP2197000A1 Vorrichtung zur Anordnung elektronischer Bauelemente 审中-公开
公开(公告)号：EP2197000A1
公开(公告)日：2010-06-16
申请号：EP09178212.8
申请日：2009-12-07
申请人： Aizo AG
发明人： Beck, Wilfried , Burk, Michael , Hemmler, Wolfgang
IPC分类号： H01C1/014 , H01C7/12 , H05K1/18
CPC分类号： H05K3/3426 , H01C1/014 , H01C1/148 , H01C7/12 , H05K2201/10643 , H05K2201/10651 , H05K2201/10946 , Y02P70/613
摘要： Vorrichtung zur Anordnung elektronischer Halbleiterbauelemente 4 auf elektronischen Leiterplatten, umfassend eine e elektronische Leiterplatte, ein elektronisches Halbleiterbauelement 4, Positionierelemente 1, welche das elektronische Halbleitcrbaudement 4 zur Ersparnis von Bauraum im wesentlichen parallel zur elektronischen Leiterplatte und von dieser beabstandet anordnen und mit dieser elektrisch verbinden.
摘要翻译：该装置包括电子印刷电路板，电子半导体元件或变阻器（4），将电子半导体元件或变阻器与电子印刷电路板平行布置的定位元件（1）。定位元件之一重建半导体元件或压敏电阻的接触表面的外轮廓。

17. 发明公开

EP1372161A1 MULTI-USE HEATING DEVICE FOR THE EVAPORATION OF ACTIVE SUBSTANCES 有权
标题翻译：用于蒸发活性物质的多用途加热装置
公开(公告)号：EP1372161A1
公开(公告)日：2003-12-17
申请号：EP01909851.6
申请日：2001-03-13
申请人： DBK Espana, S.A.
发明人： BASAGANAS MILLAN, Jordi
IPC分类号： H01C7/02 , H01C1/014 , H01C1/084 , A61L9/03 , A01M1/20
CPC分类号： H05B3/50 , A01M1/2077 , A61L9/03 , H01C1/014 , H01C1/084 , H01C1/1406 , H05B3/14 , H05B2203/02
摘要： Starting with a body formed by a base (1) and a cover (2) an opening (3) is established in the base (1) extended into a neck (4), for connecting the wick from the receptacle when a liquid product is concerned, this neck (4) being housed inside another cylindrical neck (10) of the cover (2) in closed position, defining a ring-shaped housing in which curved partitions (11-11') are formed, obtained by die pressing of respective plates (12-12') that act as a radiator, which also have fins (13) orthogonally bent and parallel to each other, between which the PTC resistance (15) and a spring (16), that facilitates the electrical connection, are set up; so that the plates (12) not only act as radiators but also as means of electrical supply to the resistance (15),for which they have connectors (16) for receiving the corresponding cables.
摘要翻译：从由基座（1）和盖（2）形成的本体开始，在延伸到颈部（4）中的基座（1）中建立开口（3），用于当液体产品是（4）在闭合位置容纳在盖（2）的另一个圆柱形颈部（10）内，限定了环形壳体，在该环形壳体中形成有弯曲分隔件（11-11'），通过模压用作散热器的相应板（12-12'）也具有彼此正交地弯曲并且彼此平行的翅片（13），PTC电阻（15）和促进电连接的弹簧（16）设立; 使得板12不仅起到散热器的作用，而且还作为向电阻15供电的装置，为此它们具有用于接收相应电缆的连接器16。

18. 发明授权

EP0142053B1 Kontrollgerät 有权
标题翻译：录音设备
公开(公告)号：EP0142053B1
公开(公告)日：1990-08-29
申请号：EP84112394.6
申请日：1984-10-13
申请人： Stribel GmbH
发明人： Kröner, Otwin , Geber, Michael
IPC分类号： B60R16/02 , H01C1/014 , H05K1/18
CPC分类号： B60R16/0239 , H01C1/014 , H05K1/18 , H05K2201/10022 , H05K2201/10515 , H05K2201/10651 , H05K2201/10757

19. 发明授权

EP0171838B1 Umhülltes elektrisches Element 有权
标题翻译：封装电气部件
公开(公告)号：EP0171838B1
公开(公告)日：1988-10-05
申请号：EP85201111.3
申请日：1985-07-08
申请人： Philips Electronics N.V.
发明人： Voeten, Hendrik
IPC分类号： H01G1/02 , H01C1/028 , H01C1/014
CPC分类号： H01G4/224 , H01G2/065 , H01L2924/0002 , H01L2924/00
摘要： 1. An enveloped electric component which is built into a prismatic envelope, using an electrically insalating moulding compound, which envelope is made of an electrically insulating material, is open on at least one side, and has contact faces at the ends of its boundary surfaces, which contact faces are conductively connected to the contacts of the component, characterized in that each contact face forms part of a strip of conductive material which extends from the boundary surface along the outside of the envelope and which is then folded inwards, the component being electrically conductively secured on the inside between the parts.
摘要翻译： 1.一种内置于棱柱形外壳中的包封电气部件，使用电绝缘模塑料，该封套由电绝缘材料制成，至少在一侧开口，并且在其边界端的端部具有接触面所述接触面导电地连接到所述部件的触点，其特征在于，每个接触面形成导电材料条的一部分，所述导电材料条沿着所述封套的外部从所述边界表面延伸，然后被向内折叠，所述部件为导电地固定在部件之间的内部。

20. 发明授权

EP0101623B1 Halterungsvorrichtung für eine mäanderförmige Wicklung und Verwendung dieser Halterungsvorrichtung 失效
标题翻译：用于ZIG-ZAG绕组的支持装置，以及该支持装置的使用
公开(公告)号：EP0101623B1
公开(公告)日：1987-03-11
申请号：EP83201014.4
申请日：1983-07-07
申请人： BBC Brown Boveri AG
发明人： Schneider, Paul
IPC分类号： H01C1/014 , H01C3/10 , H01C3/02 , H01C1/082
CPC分类号： H01C3/02 , H01C1/014 , H01C1/082 , H01C3/10

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