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11. 发明公开

EP0581712A2 MLC conductor pattern off-set design to eliminate line to via cracking 失效
标题翻译：多层陶瓷具有凹陷导体图案设计用于防止将电缆衬套的桥接的。
公开(公告)号：EP0581712A2
公开(公告)日：1994-02-02
申请号：EP93480075.6
申请日：1993-06-15
申请人： International Business Machines Corporation
发明人： Desai, Kamalesh Suryakant , Di Angelo, Donald William
IPC分类号： H01L23/498
CPC分类号： H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K1/113 , H05K3/4053 , H01L2924/00
摘要： A semiconductor ceramic packaging substrate (20) has the usual vias (21, 22, 23) of sintered electrically conductive metal extending through the substrate. There are the usual metal conductor lines (24-26) comprising conductive elements on the surface of the substrate. Each via is connected to the conductive elements in a predetermined pattern through a conductive via cap (27-29) on the surface of the ceramic package. The caps join each conductive element and each via. The cap has a width substantially larger than the diameter of the via at the point of contact of the via and the conductive element in contact with it. The caps are also substantially thicker and wider than the conductive elements.
摘要翻译：一种半导体陶瓷封装基板（20）具有烧结导电金属的通常的通孔（21，22，23）通过衬底延伸。有通常的金属导线（24-26），其包括在基板的表面上的导电元件。每个通孔被连接到经由陶瓷封装的表面上的盖（27-29）以预定的图案的导电元件通过一个导电的。帽加入通过每个导电元件和每个。所述帽具有基本上大于所述通孔的在通孔的接触和与它接触的导电元件的点的直径大的宽度。盖是如此显着更厚和抗蚀剂比导电元件。

12. 发明公开

EP0491543A3 Via resistors within multilayer 3-dimensional structures/substrates 失效
标题翻译：通过多层三维结构/基板中的电阻
公开(公告)号：EP0491543A3
公开(公告)日：1992-10-28
申请号：EP91311674.5
申请日：1991-12-16
申请人： Hughes Aircraft Company
发明人： Smith, Hal D , McClanahan, Robert F. , Shapiro, Andrew A. , Brown, Raymond
IPC分类号： H01L23/538 , H01L23/64
CPC分类号： H05K1/167 , H01L23/5384 , H01L23/647 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/092 , H05K3/4053 , H05K3/4611 , H05K3/4629 , H05K2201/09563 , H01L2924/00
摘要： Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. A disclosed via resistor structure (A) includes a plurality of resistive via fills (202A, 203A) in vias in respective adjacent insulating layers (L2, L3), a plurality of conductive elements (102A, 103A) for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills (301a, 401A) for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.

13. 发明公开

EP3273754A1 STRETCHABLE CABLE AND STRETCHABLE CIRCUIT BOARD 有权
标题翻译：可拉伸电缆和可伸缩电路板
公开(公告)号：EP3273754A1
公开(公告)日：2018-01-24
申请号：EP16764943.3
申请日：2016-03-14
申请人： Tatsuta Electric Wire & Cable Co., Ltd.
发明人： TAKAHASHI, Akio , TERADA, Tsunehiko
IPC分类号： H05K1/09 , B32B27/18 , H01B7/06 , H01B7/08 , H05K3/46
CPC分类号： H05K1/0283 , B32B27/18 , H01B1/22 , H01B7/0009 , H01B7/04 , H01B7/06 , H01B7/08 , H05K1/09 , H05K1/095 , H05K1/115 , H05K1/181 , H05K3/1283 , H05K3/207 , H05K3/303 , H05K3/4053 , H05K3/46 , H05K3/4664
摘要： A stretchable cable 1 includes a sheet-shaped stretchable base material 2 exhibiting elasticity and elongated in one direction, and a stretchable wiring 3 formed on one surface of the stretchable substrate 2 and exhibiting elasticity. The stretchable base material 2 is made of a material exhibiting elasticity. The stretchable wiring 3 is made of a conductive composition including elastomer and a conductive filler filling the elastomer.
摘要翻译：可拉伸电缆1包括呈现弹性并沿一个方向伸长的片状伸缩性基材2和形成在伸缩性基材2的一个表面上并具有弹性的可拉伸布线3。伸缩性基材2由具有弹性的材料构成。可拉伸布线3由包含弹性体和填充弹性体的导电填料的导电组合物制成。

14. 发明公开

EP3258749A1 ELECTRONIC CIRCUIT APPARATUS 审中-公开
标题翻译：电子电路设备
公开(公告)号：EP3258749A1
公开(公告)日：2017-12-20
申请号：EP17165188.8
申请日：2017-04-06
申请人： Miyoshi Electronics Corporation
发明人： MORI, Kazuhito
IPC分类号： H05K1/02 , H05K3/40 , H05K1/18
CPC分类号： H01L23/5386 , H01L23/13 , H01L23/3121 , H01L23/3675 , H01L23/49811 , H01L23/5384 , H01L24/32 , H01L25/072 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2924/19105 , H05K1/0206 , H05K1/021 , H05K1/181 , H05K3/4053 , H05K2201/09554 , H05K2203/049
摘要： There is provided an electronic circuit apparatus in which the heat generated at an electronic component can be transferred to a heat spreader efficiently. An electronic circuit apparatus (1) includes a dielectric substrate (10), an electronic component (61, 62), a heat spreader (15), and a conductive via (50). The conductive via (50) electrically and thermally connects the electronic component (61, 62) and the heat spreader (15). The conductive via (50) extends from the first surface (11) to at least an interior of the heat spreader (15) and is in surface-contact with the heat spreader (15).
摘要翻译：提供一种电子电路装置，其中电子部件产生的热量可以有效地传递到散热器。电子电路装置（1）包括电介质基板（10），电子部件（61,62），散热器（15）以及导电孔（50）。导电通孔（50）将电子部件（61,62）和散热器（15）电和热连接。导电通孔（50）从第一表面（11）延伸到散热器（15）的至少内部并且与散热器（15）表面接触。

15. 发明公开

EP2613616A3 Flexible printed circuit for mounting light emitting element, and illumination apparatus, capsule endoscope and vehicle lighting apparatus incorporating the same 审中-公开
标题翻译：柔性印刷电路板，用于安装一个发光元件和照明装置的胶囊型内窥镜和所述车辆用照明装置，使得
公开(公告)号：EP2613616A3
公开(公告)日：2015-04-22
申请号：EP13150214.8
申请日：2013-01-04
申请人： Canon Components, Inc.
发明人： Uehara, Hiroharu
IPC分类号： H05K1/11 , H05K1/02 , H05K1/18 , F21V7/00 , H05K1/05 , H05K3/28 , H05K3/40
CPC分类号： F21V7/00 , H05K1/0206 , H05K1/0218 , H05K1/0274 , H05K1/056 , H05K1/189 , H05K3/281 , H05K3/4053 , H05K2201/10106 , H05K2201/2054
摘要： A flexible printed circuit for mounting a light emitting element has a base film, a wiring pattern formed on a surface of the base film, and a cover film that covers the base film and the wiring pattern. At least one of the base film and the cover film has a substrate comprising a metal. The cover film has such surface properties as to produce specular reflection or diffuse reflection of light or has a substantially white reflecting film on a surface of the cover film.

16. 发明公开

EP2763518A1 COMPONENT EMBEDDED SUBSTRATE MOUNTING BODY, METHOD FOR MANUFACTURING SAME AND COMPONENT EMBEDDED SUBSTRATE 审中-公开
标题翻译：对于组件组装件内置基板，工艺用于生产和组件内置基板
公开(公告)号：EP2763518A1
公开(公告)日：2014-08-06
申请号：EP12835560.9
申请日：2012-09-25
申请人： Fujikura, Ltd.
发明人： UETA, Nobuki
IPC分类号： H05K3/46 , H01L23/12 , H01L23/36 , H05K1/02
CPC分类号： H05K1/185 , H01L23/3121 , H01L23/3677 , H01L23/49816 , H01L23/49833 , H01L23/5389 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01327 , H05K1/0206 , H05K1/0298 , H05K1/186 , H05K3/0026 , H05K3/301 , H05K3/4038 , H05K3/4053 , H05K3/429 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K3/4623 , H05K2203/1453 , Y10T29/4913 , H01L2924/00
摘要： A component built-in board mounting body(100) has a component built-in board(1) mounted on a mounting surface(2a) of a mounting board (2), the component built-in board(1) being configured having stacked therein a plurality of printed wiring bases (10, 20, 30, 40) that each have a wiring pattern and a via formed on/in a resin base(11, 21, 31, 41) thereof, and the component built-in board(1) being configured having an electronic component(90) built in thereto, wherein the component built-in board (1) has at least a portion of the plurality of printed wiring bases (10, 20, 30, 40) including thermal wiring (13, 23, 33, 43) in the wiring pattern and including a thermal via (14, 24, 34, 44) in the via, and the component built-in board(1) is mounted on the mounting board (2) via a bump (49) formed on a surface layer of the component built-in board (1), and a surface (91a) on an opposite side to an electrode formation surface(91b) of the built in electronic component(90) is connected to the bump(49) via the thermal via(14) and the thermal wiring (13), and is thermally connected to the mounting board (2) via the bump(49).

17. 发明授权

EP2421343B1 Anlage und Verfahren zum Bearbeiten von Leiterplatten 有权
标题翻译：系统和方法，用于钻探多氯联苯
公开(公告)号：EP2421343B1
公开(公告)日：2013-03-20
申请号：EP10172160.3
申请日：2010-08-06
申请人： Mass GmbH
发明人： Klocke, Franz , Settemeyer, Axel
IPC分类号： H05K3/40 , H05K3/00 , H05K3/12
CPC分类号： H05K3/1233 , H05K3/0094 , H05K3/4053 , H05K2201/0959 , H05K2203/0126 , H05K2203/085

18. 发明公开

EP2421343A1 Anlage und Verfahren zum Bearbeiten von Leiterplatten 有权
公开(公告)号：EP2421343A1
公开(公告)日：2012-02-22
申请号：EP10172160.3
申请日：2010-08-06
申请人： Mass GmbH
发明人： Klocke, Franz , Settemeyer, Axel
IPC分类号： H05K3/40 , H05K3/00
CPC分类号： H05K3/1233 , H05K3/0094 , H05K3/4053 , H05K2201/0959 , H05K2203/0126 , H05K2203/085
摘要： Die Erfindung bezieht sich auf eine Anlage (1) und ein Verfahren zum Bearbeiten von Leiterplatten (6), die das Füllen von eingebrachten Löchern (10) mit einem Füllmaterial (9) oder das Auftragen von Auftragsmaterial erlaubt, umfassend eine Haltevorrichtung (4) zum Halten der Leiterplatte (6), ein Füllteil (8) zum Einbringen des Füll- oder Auftragsmaterials (9) und ein auf der dem Füllteil (8) gegenüberliegenden Seite der Leiterplatte (6) befindliches Gegenhalteteil (12), wobei das Füllteil (8) über die Leiterplatte bewegbar ist und dabei, abgedichtet an einer Seite der Leiterplatte(6) anliegend, die auf der Leiterplatte (6) vorgesehenen Bearbeitungsbereiche unter Pressdruck bearbeitet, wobei die Leiterplatte (6) waagerecht in der Halteeinrichtung (4) gehalten ist und auf der Leiterplatte eine Schablone (7) liegt, die bei den Bearbeitungsbereichen (17) Öffnungen (15) aufweist, so dass nur die durch die Öffnungen (15) freiliegenden Löcher (10) oder Auftragsbereiche (16) gefüllt werden.
摘要翻译：该系统具有保持印刷电路板（6）的保持装置（4）和引入填充和涂覆材料的填充部分（8）。计数器保持部件（12）具有间隔件的多孔板设置在板的与填充部相对的一侧。将填充部分移动到水平保持在保持装置中的板上，并且模制工具（7）位于板上并且包括开口，盲孔或涂层区域通过开口填充。保持部分选自由纸幅和间隔物覆盖的多孔板。填充材料选自导电糊或环氧树脂。涂料选自焊膏。模具由金属板或筛网材料制成。还包括用于填充印刷电路板用填充材料的孔或用于涂覆涂料的方法的独立权利要求。

19. 发明公开

EP2151150A4 METHOD IN MANUFACTURING OF CIRCUIT BOARDS 审中-公开
标题翻译：操作法，印刷电路板生产
公开(公告)号：EP2151150A4
公开(公告)日：2011-07-06
申请号：EP08761708
申请日：2008-05-29
申请人： FINNISH ENVIRONMENT TECHNOLOGY OY
发明人： SALMINEN ANTTI , HOLAPPA RAUNO
IPC分类号： H05K3/46 , H05K3/02 , H05K3/10
CPC分类号： H05K3/102 , H05K3/4053 , H05K3/4069 , H05K2203/107 , H05K2203/1131 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165

20. 发明公开

EP2223324A1 PATTERNING A THICK FILM PASTE IN SURFACE FEATURES 审中-公开
标题翻译：结构厚膜浆料至地面条件的
公开(公告)号：EP2223324A1
公开(公告)日：2010-09-01
申请号：EP08868113.5
申请日：2008-12-19
申请人： E. I. du Pont de Nemours and Company
发明人： CHENG, Lap-Tak, Andrew
IPC分类号： H01J1/304 , H01J9/02 , H05K3/40
CPC分类号： H01J1/304 , H01J9/025 , H01J2201/30403 , H05K3/02 , H05K3/4053 , H05K2201/09827 , H05K2201/09981 , H05K2203/0508 , H05K2203/0783 , H05K2203/308 , Y10T428/24339 , Y10T428/24802
摘要： This invention relates to a method for the fabrication of electrical and electronic devices using a photoresist deposited in pre-existing through holes in a device structure and a thick film paste, and to the devices made by such method. The method allows thick film paste deposits in the corners of the holes. This invention also relates to devices made with thick film pastes that are patterned using a diffusion layer made from residual photoresist deposits in a hole.

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