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11. 发明公开

EP2580519A4 LIGHT EMITTING DIODE (LED) LIGHTING SYSTEMS AND METHODS 审中-公开
标题翻译：照明系统和程序，发光二极管（LED）
公开(公告)号：EP2580519A4
公开(公告)日：2014-06-11
申请号：EP11793290
申请日：2011-06-10
申请人： ECO LUMENS LLC
发明人： SCARPELLI RICHARD
IPC分类号： F21S2/00 , F21S4/00 , F21V17/00 , F21V23/00 , F21V29/00 , F21Y101/02 , F21Y103/00 , F21Y105/00 , H05B33/08 , H05B37/02
CPC分类号： F21V5/007 , F21S4/28 , F21V29/507 , F21Y2103/10 , F21Y2105/16 , F21Y2115/10

12. 发明公开

EP2553330A1 ILLUMINATION APPARATUS 审中-公开
标题翻译：照明设备
公开(公告)号：EP2553330A1
公开(公告)日：2013-02-06
申请号：EP11713020.3
申请日：2011-03-29
申请人： Optovate Limited
发明人： WOODGATE, Graham, John , HARROLD, Jonathan
IPC分类号： F21V29/00 , F21K99/00 , F21V5/00 , F21Y101/02 , F21Y105/00
CPC分类号： F21V29/004 , F21K9/00 , F21V5/007 , F21V7/0083 , F21V13/04 , F21V13/12 , F21V29/505 , F21V29/67 , F21V29/677 , F21V29/70 , F21V29/71 , F21V29/74 , F21V29/745 , F21V29/75 , F21V29/763 , F21Y2105/10 , F21Y2105/16 , F21Y2115/10 , Y10S362/80 , Y10T29/49826
摘要： An illumination apparatus, a method of manufacture of the same and a heat sink apparatus for use in said illumination apparatus in which an array of optical elements directs light from an array of light emitting elements through a heat dissipating structure to achieve a thin and efficient light source that provides directional illumination with efficient dissipation of generated heat into the illuminated environment.
摘要翻译：一种用于所述照明装置的照明装置及其制造方法和散热器装置，其中光学元件阵列（30）将来自发光元件阵列的光通过散热结构引导以实现薄的并提供有效的光源，提供定向照明，并有效地将产生的热量散发到照明环境中。

13. 发明授权

EP1297723B1 DISPOSITIF MOBILE D'ECLAIRAGE 有权
标题翻译： TRAGBARE BELEUCHTUNGSEINRICHTUNG
公开(公告)号：EP1297723B1
公开(公告)日：2006-09-27
申请号：EP01955387.4
申请日：2001-07-02
申请人： FACOM, Société Anonyme
发明人： GOMAS, Hervé
IPC分类号： H05B33/02 , F21V15/04 , F21L14/02
CPC分类号： F21V15/04 , F21L14/023 , F21V31/00 , F21Y2105/16 , F21Y2115/10
摘要： The invention concerns a mobile illuminating device (1) comprising a housing with elongated shape along a longitudinal axis (X-X), including: an assembly of illuminating elements, in the form of light-emitting diodes (5) (LED), fixed on a support plate (4); electrical/electronic control means and/or for electrical connection between the illuminating elements and a power source, a housing (1) comprising a window (24) located opposite the illuminating elements. The invention is characterised in that it comprises a transparent material protective plate (25) covering said window (24) opposite the illuminating means.
摘要翻译：本发明涉及一种移动照明装置（1），其包括沿着纵向轴线（XX）具有细长形状的壳体，包括：发光二极管（5）（LED）形式的照明元件的组件，固定在支撑板（4）; 电气/电子控制装置和/或用于照明元件和电源之间的电连接;壳体（1），包括与照明元件相对定位的窗口（24）。本发明的特征在于它包括覆盖与照明装置相对的所述窗口（24）的透明材料保护板（25）。

14. 发明授权

EP2819190B1 Semiconductor light emitting module and method for manufacturing the same 有权
公开(公告)号：EP2819190B1
公开(公告)日：2019-07-10
申请号：EP14181596.9
申请日：2009-03-19
申请人： Shimane Prefectural Government , S.E.I. Inc.
发明人： Komatsubara, Satoshi , Fukuda, Kenichi , Otao, Shinobu , Furuta, Toru
IPC分类号： H01L25/075 , H01L33/60 , H05K1/02
CPC分类号： H01L33/644 , F21K9/00 , F21Y2101/00 , F21Y2105/10 , F21Y2105/16 , F21Y2115/10 , H01L25/0753 , H01L33/483 , H01L33/60 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H05K1/021 , H05K2201/09054 , H05K2201/10106 , H05K2203/0323 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).

15. 发明公开

EP3300107A1 LIGHT EMITTING DIODE ARRAY OPTICAL CUP STRUCTURE WITH A FOCAL POSITION 无效转让
标题翻译：发光二极管阵列具有焦点位置的光学杯结构
公开(公告)号：EP3300107A1
公开(公告)日：2018-03-28
申请号：EP17167243.9
申请日：2017-04-20
申请人： Excellence Opto. Inc.
发明人： Wu, Chun-Der , Tseng, Kuo-Shu , Huang, Chang-Ching , Kuo, Kun-Hua , Reniger, Bruce Lynn
IPC分类号： H01L25/075 , H01L33/60 , F21S8/10 , F21V7/00 , F21Y105/10 , F21Y115/10
CPC分类号： F21V7/041 , F21S41/125 , F21S41/143 , F21S41/153 , F21S41/255 , F21V5/04 , F21V5/048 , F21V7/0083 , F21V13/04 , F21V19/003 , F21Y2105/16 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L33/60
摘要： A light emitting diode (LED) array optical cup structure with a focal position includes a substrate (10), at least three reflective optical cups (20) disposed on the substrate (10), and a plurality of LEDs (30) in a quantity corresponding to the reflective optical cups (20). The reflective optical cups (20) are arranged closely side by side to form a geometric shape, and each is tapered downwards to form a cone-shaped accommodating space (21) having an opening (22). The LEDs (30) are disposed on the substrate (10) and respectively accommodated in the cone-shaped accommodating spaces (21), and form a focal position (40) at a center thereof. Accordingly, with the design of the reflective optical cups (20) arranged closely side by side, the LEDs (30) are caused to produce the focal position (40), and so existing conventional secondary optical components (50) may be adopted to save production costs and satisfy manufacturing requirements.
摘要翻译：具有焦点位置的发光二极管（LED）阵列光杯结构包括衬底（10），设置在衬底（10）上的至少三个反射光杯（20），以及多个LED（30）对应于反射式光学杯（20）。反射式光学杯20并排紧密排列形成几何形状，并分别向下渐缩形成具有开口22的锥形容纳空间21。 LED（30）设置在基板（10）上并分别容纳在锥形容纳空间（21）中，并且在其中心处形成焦点位置（40）。因此，由于反射光杯（20）的并排设置，使得LED（30）产生焦点位置（40），因此可以采用现有的常规辅助光学部件（50）来节省生产成本和满足制造要求。

16. 发明公开

EP3274621A1 LICHTLEITKÖRPER MIT SPRITZGUSSMATTE UND LICHTKANÄLEN 失效
标题翻译：带注塑模块和光通道的照明装置
公开(公告)号：EP3274621A1
公开(公告)日：2018-01-31
申请号：EP15817067.0
申请日：2015-12-10
申请人： Christandl, Dieter , Christandl, Josef , Hofer, Robert
发明人： Christandl, Dieter , Christandl, Josef , Hofer, Robert
IPC分类号： F21S8/06 , E04B9/04 , F21V8/00
CPC分类号： G02B6/0021 , E04B9/0421 , F21S8/06 , F21W2111/023 , F21Y2105/10 , F21Y2105/16 , F21Y2115/10 , G02B1/045 , G02B6/0095
摘要： Disclosed is a light guide mat (1) for the production of a block- or cuboid-shaped light guide body (21), which mat is arranged in a casting mould and can be sealed in a pourable, curable casting compound (24), wherein the light guide mat (1) consists of longitudinal and transverse struts (2, 3) connected to one another in the form of a grid, which struts consist at least partially of a light-conducting plastic, wherein profiled light guide elements (4) consisting of an at least partially light-conducting plastic are integrally formed at the point of intersection of the longitudinal and transverse struts (2, 3), an end face (6) of which elements being formed as light-emitting surfaces on the upper face (22) of the light guide body (21), wherein at least the longitudinal struts (2) of the light guide mat (1) are formed as light channels (5) for receiving point-like, light-generating elements, and the light channels (5) are integrally formed on the face of the light guide elements (4) near to the bottom.

17. 发明公开

EP3128231A1 IMPROVEMENTS IN OR RELATING TO LIGHT-EMITTING DIODE MODULES 有权
标题翻译： VERBESSERUNGEN AN ODER IM ZUSAMMENHANG MIT LEUCHTDIODENMODULEN
公开(公告)号：EP3128231A1
公开(公告)日：2017-02-08
申请号：EP15180043.0
申请日：2015-08-06
申请人： Schreder
发明人： Joiris, Samuel
IPC分类号： F21V31/00 , F21K99/00 , F21V5/00
CPC分类号： F21V31/005 , F21K9/20 , F21K9/69 , F21V5/007 , F21V5/04 , F21V17/06 , F21V17/12 , F21V19/003 , F21V23/002 , F21V23/06 , F21V27/02 , F21V29/70 , F21W2131/10 , F21Y2105/16 , F21Y2115/10 , H05K2201/09063 , H05K2201/10106
摘要： Described herein is an LED module (500) comprising a PCBA (200) having an array of LED elements, a secondary lens array (300) and a lens holder (510). The secondary lens array (300) has a peripheral lip (360) and a plurality of boss portions (330a) which are compressed between the lens holder (510) and the PCBA (200) to form water-tight gaskets. The secondary lens array (300) also forms gaskets around wires connecting with terminal blocks on the PCBA (200) and effectively seals with a base plate (100) on which the PCBA (200) is mounted.
摘要翻译：这里描述的是LED模块（500），其包括具有LED元件阵列的PCBA（200），辅助透镜阵列（300）和透镜保持器（510）。副透镜阵列（300）具有在透镜保持架（510）和PCBA（200）之间被压缩的外周唇部（360）和多个凸台部（330a），以形成防水垫圈。辅助透镜阵列（300）还在与PCBA（200）上的端子块连接的电线周围形成垫圈，并且有效地与安装有PCBA（200）的基板（100）密封。

18. 发明公开

EP3096167A1 A METHOD OF PRODUCING LIGHTING DEVICES AND OPTICAL COMPONENT FOR USE THEREIN 审中-公开
标题翻译：用于生产照明装置和光学组件以供其使用
公开(公告)号：EP3096167A1
公开(公告)日：2016-11-23
申请号：EP16169128.2
申请日：2016-05-11
申请人： OSRAM GmbH , OSRAM S.P.A. - SOCIETA' RIUNITE OSRAM EDISON CLERICI
发明人： MASCOLO, Luca , GRIFFONI, Alessio , ZANON, Franco
IPC分类号： G02B7/02 , G02B19/00 , F21V5/00
CPC分类号： G02B19/0061 , F21K9/90 , F21V5/007 , F21Y2105/16 , F21Y2115/10 , G02B7/025 , G02B19/0014
摘要： A method of producing lighting devices includes the use of a support structure (10) with a front surface having an array of electrically powered light radiation sources, e.g. LED sources, thereon and an optical component (16) including a coupling surface coupleable to the front surface of support structure (10), with an array of lenses (18) complementary to the array of light radiation sources (L) on the front surface of support structure (10). On the coupling surface of optical component (16) there is provided a network of channels (20) which extend along paths, the meshes of said network enclosing lenses (18) in the array of lenses (18). After coupling optical component (16) with support structure (10), with the lenses (18) facing said light radiation sources (L), a mass of sealing material is injected (N, 22) into said network of channels (20) by forming sealing formations (32), sealingly enclosing light radiation sources (L) and the lenses (18) facing the same.
摘要翻译：制造照明装置的方法包括使用一个支撑结构（10）与具有电的阵列的前表面的光供电辐射源，E.G. LED光源，在其上并以光学组件（16），其包括联接表面联接能够支撑结构（10）的前表面与透镜阵列（18）的光辐射源（L）的阵列互补的前表面上支撑结构（10）的。上光学部件（16）的连接表面，提供了通道（20），其沿着路径延伸，的透镜阵列（18）在所述网络包围透镜（18）的网眼的网络。与支撑结构（10）耦接的光学部件（16），具有面对所述光辐射源（L）的透镜（18）之后，密封材料的质量被注入（N，22）进入通道的所述网络（20）由形成密封结构（32）密封地封装在光辐射源（L）和面临着同样的透镜（18）。

19. 发明公开

EP3089226A1 LIGHT-EMITTING DIODE MODULE AND LAMP USING THE SAME 审中-公开
标题翻译： LEUCHTDIODENMODUL UND LAMPE DAMIT
公开(公告)号：EP3089226A1
公开(公告)日：2016-11-02
申请号：EP16167209.2
申请日：2016-04-27
申请人： Lextar Electronics Corp.
发明人： HSUEH, Fang-Chang , LIN, Yu-Min , LIN, Chih-Hao , TSAI, Tzong-Liang
IPC分类号： H01L33/50 , H01L25/075 , F21K99/00 , H01L33/36
CPC分类号： H01L27/15 , F21K9/23 , F21K9/232 , F21V3/00 , F21Y2101/00 , F21Y2105/16 , F21Y2115/10 , G02B6/0073 , H01L25/0753 , H01L33/36 , H01L33/486 , H01L33/505 , H01L33/58
摘要： A light-emitting diode (LED) module (10) and a lamp using the same are provided. The LED module includes a substrate (100) and a plurality of light-emitting packages (102). Each light-emitting package (102) includes an optical wavelength conversion layer (106) and a light-emitting diode (104) having a first light-output surface (104A), a bonding surface (104B), and a plurality of second light-output surfaces (104C). The bonding surface (104B) is opposite the first light-output surface (104A) and connected to the substrate (100). The second light-output surfaces (104C) are between the first light-output surface (104A) and the bonding surface (104B). The optical wavelength conversion layer (106) covers the first and second light-output surfaces (104A,104C). The distance between the bonding surface (104B) and the top surface (106A) of the optical wavelength conversion layer (106) on the first light-output surface (104A) represents a light source thickness (T). The distance between two adjacent light-emitting packages (102) represents a spacing (D) of light sources. Specifically, the ratio of the spacing (D) of light sources to the light source thickness (T) is between 1 and 6.3.
摘要翻译：提供了一种发光二极管（LED）模块（10）和使用其的灯。 LED模块包括基板（100）和多个发光封装（102）。每个发光封装（102）包括光波长转换层（106）和具有第一光输出表面（104A）的发光二极管（104），接合表面（104B）和多个第二光 - 输出表面（104C）。接合表面（104B）与第一光输出表面（104A）相对并连接到基板（100）。第二光输出表面（104C）在第一光输出表面（104A）和接合表面（104B）之间。光波长转换层（106）覆盖第一和第二光输出表面（104A，104C）。第一光输出表面（104A）上的光波长转换层（106）的接合表面（104B）和顶表面（106A）之间的距离表示光源厚度（T）。两个相邻的发光封装（102）之间的距离表示光源的间隔（D）。具体地说，光源的间隔（D）与光源厚度（T）之比为1〜6.3。

20. 发明公开

EP3076761A1 CARD TYPE LED DRIVER AND TRANSPORTATION MEANS WITH CARD TYPE DRIVER 审中-公开
标题翻译： KARTENARTIGER LED-TREIBER UND TRANSPORTMITTEL MIT DEM KARTENARTIGEN TREIBER
公开(公告)号：EP3076761A1
公开(公告)日：2016-10-05
申请号：EP14865883.4
申请日：2014-11-25
申请人： Sichuan Sunfor Light Co., Ltd.
发明人： FENG, Zhengyong , LI, Dongming , YANG, Mian , LONG, Wentao
IPC分类号： H05B37/02
CPC分类号： F21V23/005 , F21S8/00 , F21V17/101 , F21V17/12 , F21V23/0435 , F21Y2105/16 , F21Y2115/10 , H05B33/0803 , H05B33/0809 , H05B33/0812 , H05B33/0815 , H05B33/0818 , H05B33/083 , H05B33/0845 , H05B33/0857 , H05B33/089 , Y02B20/343
摘要： The present invention relates to a card type LED driver and transportation means with the card type driver, characterized in that the card type LED driver includes an installation card tray and a replaceable driving circuit board, the installation card tray being secured to an LED module or an LED lamp with the LED module so as to drive and/or control the LED module through an electrical interface in the installation card tray; the replaceable driving circuit board has at least one AC directly driven LED driving unit, the replaceable driving circuit board being pluggably secured to the installation card tray, thus making possible selectively installing a corresponding replaceable driving circuit board according to lighting scenario requirements, dimming requirements, and electrical characteristics of the LED module.
摘要翻译：本发明涉及具有卡型驱动器的卡式LED驱动器和输送装置，其特征在于，卡式LED驱动器包括安装卡托盘和可更换的驱动电路板，安装卡盘固定到LED模块或 LED灯，其具有LED模块，以通过安装卡盘中的电接口驱动和/或控制LED模块; 可更换的驱动电路板具有至少一个AC直接驱动的LED驱动单元，可替换的驱动电路板可插拔地固定到安装卡盘，从而可以根据照明场景要求，调光要求，选择性地安装相应的可更换驱动电路板，和LED模块的电气特性。

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