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    • 11. 发明公开
    • Honeycomb filter production apparatus
    • 蜂窝过滤器生产设备
    • EP2371452A1
    • 2011-10-05
    • EP11250321.4
    • 2011-03-16
    • NGK Insulators, Ltd.
    • Tsuji, HiroyukiAkao, TakayoshiFujita, ShuheiMatsumoto, Kazuhi
    • B01J37/02B05C19/00B05D7/22B05B13/06B05C11/10
    • B05D1/12B01J35/04B01J37/0232B05B7/0075B05B7/1409B05B7/1454B05B7/1486B05B12/084B05B13/0609B05B15/18B05D1/22B08B5/02C04B41/009C04B41/4545C04B41/87C04B2111/00793C04B41/457C04B41/5025C04B41/5024C04B41/5059C04B35/00C04B38/0006C04B35/565
    • A honeycomb filter production apparatus includes: a workpiece securing section (10) for securing a base of a honeycomb filter (11); a powder transfer section (20) that is disposed on one side of the workpiece securing section (10), and transfers a powder together with an air current by utilizing pressurized gas; an introduction section (40) that is provided between the powder transfer section (20) and the workpiece securing section (10), the powder transferred from the powder transfer section (20) together with the air current being mixed with another gas in the introduction section (40), and introduced into the base secured by the workpiece securing section (10) when the apparatus is used; a suction section (30) that is disposed on the other side of the workpiece securing section (10), and sucks the gas that has passed through the base secured by the workpiece securing section (10) by reducing pressure on the other side of the workpiece securing section (10) as compared with the one side of the workpiece securing section (10) using suction means; a cleaning section (50) for removing a surplus powder adhering to an end face of the base after the introduction of the powder; a judgment section (60) for judging an amount of the powder adhering to the base; and a workpiece transfer section (70) for transferring the base among the workpiece securing section (10), the cleaning section (50), and the judgment section (60).
    • 蜂窝过滤器制造装置具备:工件固定部(10),其用于固定蜂窝过滤器(11)的基部; 设置在工件固定部分(10)一侧的粉末传送部分(20),利用加压气体将粉末与气流一起传送; (20)与工件固定部(10)之间设置有导入部(40),从导入部(20)导入的粉末与导入的气体一起与其他气体混合 当装置被使用时被引入由工件固定部分(10)固定的基座中; 设置在所述工件固定部(10)的另一侧的吸入部(30),通过降低所述工件固定部(10)的另一侧的压力来吸附由所述工件固定部(10)固定的通过所述基座的气体 与工件固定部分(10)的一侧相比,使用抽吸装置的工件固定部分(10) 清洁部分(50),用于在引入粉末之后去除附着到基部端面的多余粉末; 一个判断部分(60),用于判断附着在基座上的粉末的量; 和工件传送部分(70),用于在工件固定部分(10),清洁部分(50)和判断部分(60)之间传送基部。
    • 12. 发明公开
    • Method for fabrication of industrial parts having high-aspect-ratio through-hole sections
    • 通过具有高Aspektverhältis孔用于生产工件的方法
    • EP1175978A3
    • 2004-01-02
    • EP01306147.8
    • 2001-07-17
    • NGK INSULATORS, LTD.
    • Takeuchi, YukihisaTsuji, HiroyukiKitamura, KazumasaYamaguchi, Yoshinori
    • B26F1/02H05K3/00B32B31/00
    • B26F1/02B26F2210/08B32B38/04B32B2038/047B32B2457/08H05K1/0306H05K1/0393H05K3/005H05K3/4611H05K3/4629H05K3/4635H05K3/4638H05K2201/096H05K2203/0195H05K2203/1476
    • A fabrication method of an industrial part having high-aspect-ratio through-hole sections using a punch and a die, includes: a first step of drilling a first hole section in a first sheet of sheet material with said punch; a second step of lifting said first sheet in tight contact with a stripper under a condition that said punch is not pulled out from the first hole section; a third step of lifting said punch so that a tip section of said punch is slightly drawn in from a bottom section of said lifted first sheet of sheet material; a fourth step of drilling a second hole section in a second sheet of sheet material with said punch; a fifth step of lifting said second sheet in tight contact with said first sheet under a condition that said punch is not pulled out from the second hole section; and a sixth step of lifting said punch so that a tip section of said punch is slightly drawn in from the bottom section of said lifted second sheet of sheet material. Subsequently, the fourth to sixth steps are repeated for lamination of a plurality of sheets of sheet material.
    • 使用冲头具有高纵横比的通孔部的工业部件的制造方法和,在,包括:在片材的第一片材​​与所述冲头钻出第一孔部的第一步骤; 升降的第二步骤所述条件是所述冲头不从第一孔部拔出的条件下汽提器紧密接触第一片材; 提升所述冲头的第三步骤所以没有所述冲头的前端部稍微从所述的底部吸入的抬起片材的第一片材​​; 钻在与所述冲头片材的第二片材的第二孔部的第四步骤; 提升的第五步骤中,所述在与所述冲头不从第二孔部拔出的状态下所述第一片紧密接触第二片材; 和提升所述冲模所以没有所述冲头的前端部的第六步骤略微从所说的底部部分吸入的抬起片材的第二片材。 随后,第四至第六步骤被重复用于片材的片材的多个层压。
    • 15. 发明公开
    • V-shaped groove inspecting and working method
    • V形沟槽检查和工作方法
    • EP0363101A3
    • 1990-12-19
    • EP89309985.3
    • 1989-09-29
    • NGK INSULATORS, LTD.
    • Tsuji, HiroyukiNomoto, SusumuOta, Takashi
    • G01B21/20
    • G01B21/20
    • A method of inspecting V-shaped grooves, e.g. grooves for optical fibres, is carried out in the following steps. Coordinates of more than 20 points per groove (1) on a substate formed with V-shaped grooves ar emeasured with a stylus (3) moving in directions perpendicular to the longitudinal directions of the grooves. Data measured within regions of at least 10 µm at the edges (5) and bottom (6) of the grooves are removed from the data so obtained. Shapes formed by straight lines are then calculated on the basis of remaining data on effective measuring lengths of more than 40 µm. A method of working the V-shaped grooves is effected by the following steps. A circle (7) having a diameter substantially equal to that of fibres to be supported in the grooves is drawn inscribed in the interior of a V-shaped groove of shape calculated by the above method. The groove is then worked, while errors in the centre position of the circle are fed-back into the working process of the groove of the substrate to compensate for variation of depths and pitches of the V-shaped grooves being worked.
    • 19. 发明公开
    • Punching apparatus for stamping and method for producing the same
    • Stanzvorrichtung und Verfahren zu ihrer Herstellung
    • EP0993885A1
    • 2000-04-19
    • EP99307490.5
    • 1999-09-22
    • NGK INSULATORS, LTD.
    • Tsuji, HiroyukiKitamura, KazumasaNoritake, MotooMatsubayashi, SatoshiKabe, Shusaku
    • B21D28/34B26F1/14
    • B26F1/02B26D7/2614B26F2210/08H05K3/005Y10T83/943Y10T83/9476
    • A stamping punch (92) of a punching apparatus for stamping (10) comprises a grip member (94) which is provided with crosspieces (95) formed between long grooves (93) on side walls of a rectangular parallelepiped, and a plurality of punch members (96) which are formed integrally with the grip member (94). The respective punch members (96) are arranged in parallel to one another. A plurality of long holes (90) are defined on a punch holder (86). A large amount of adhesive is contained in the gap between joining surfaces when the grip members (94) of the stamping punches (92) are inserted and secured into the respective long holes (90). Accordingly, the positional accuracy of the punch member (86) is improved, the accuracy of the hole defined through a workpiece is improved, and it is possible to eliminate any fear of occurrence of defect in shape. Further, the rigidity of the punch member (86) can be improved, the stripper is prevented from application of unbalanced load, and the punch is easily exchangeable.
    • 一种用于冲压冲压装置(10)的冲压冲头(92)包括夹紧构件(94),该夹紧构件设置有形成在长方体侧壁上的长槽(93)和多个冲头 与所述把手构件(94)一体形成的构件(96)。 相应的冲头构件(96)彼此平行地布置。 多个长孔(90)被限定在冲头保持器(86)上。 当冲压冲头(92)的夹紧构件(94)插入并固定到各个长孔(90)中时,接合表面之间的间隙中含有大量的粘合剂。 因此,提高了冲头构件(86)的位置精度,提高了通过工件限定的孔的精度,并且可以消除对形状缺陷的担心。 此外,可以提高冲压构件(86)的刚性,防止剥离器施加不平衡载荷,并且冲头容易更换。
    • 20. 发明公开
    • Method of and apparatus for peeling off chips
    • Verfahren und Vorrichtung zum Abziehen von Chips
    • EP0798955A1
    • 1997-10-01
    • EP97302085.2
    • 1997-03-26
    • NGK INSULATORS, LTD.
    • Tsuji, HiroyukiOhnishi, Takao
    • H05K13/02H05K13/04
    • H01L21/67132H01L2221/68322H05K13/0417Y10T29/4979Y10T225/12
    • A chip peeling apparatus (60) has a plurality of protrusions (100) which include first protrusions (100a) and second protrusions (100b) lower than the first protrusions (100a). A vacuum pump communicates through holes (106) with grooves (104) defined between adjacent ones of the protrusions (100). A UV sheet (126) is attached to chips (102), and the chips (102) are supported in the vicinity of their corners (103a ∼ 103d) by the tops of the first protrusions (100a). When the vacuum pump is actuated, the chips (102) and streets (122) disposed between the chips (102) are lowered, and the chips (102) are curved and supported in abutment against the tops of the second protrusions (100b). Each of the chips (102) is gradually peeled off the UV sheet (126) under a force tending to recover the original shape of the curved sheet (102). The chip peeling apparatus (60) is effective in preventing the chips (102) from being damaged and positionally deviated when the chips (102) are attracted and carried.
    • 芯片剥离装置(60)具有多个突起(100),其包括比第一突起(100a)低的第一突起(100a)和第二突起(100b)。 真空泵通过孔(106)与限定在相邻的突起(100)之间的凹槽(104)连通。 UV片(126)附接到芯片(102),并且芯片(102)通过第一突起(100a)的顶部被支撑在其角部(103a类似于103d)附近。 当致动真空泵时,设置在芯片(102)之间的芯片(102)和街道(122)被降低,并且芯片(102)被弯曲并被支撑以抵靠第二突起(100b)的顶部。 每个芯片(102)在倾向于恢复弯曲片(102)的原始形状的力下逐渐从UV片(126)剥离。 芯片剥离装置(60)有效地防止芯片(102)被吸引和携带时损坏和位置偏移。