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11. 发明授权

EP0338199B1 Method and apparatus for encapsulation of an electronic device 失效
标题翻译：用于封装电子设备的方法和装置
公开(公告)号：EP0338199B1
公开(公告)日：1993-05-26
申请号：EP89102185.9
申请日：1989-02-09
申请人： International Business Machines Corporation
发明人： Kovac, Caroline Ann , Ledermann, Peter Gerard , Nguyen Luu Thanh
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L2224/50

12. 发明公开

EP0399161A3 Multi-level circuit card structure 失效
标题翻译：多级电路卡结构
公开(公告)号：EP0399161A3
公开(公告)日：1991-01-16
申请号：EP90105309.0
申请日：1990-03-21
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Buchwalter, Stephen Leslie , Hermann, Karl , Kovac, Caroline Ann , Poore, Paige Adams , Viehbeck, Alfred
IPC分类号： H05K1/05 , H05K1/00
CPC分类号： H05K3/462 , H01L23/5385 , H01L24/00 , H01L2924/14 , H05K1/0272 , H05K1/056 , H05K1/144 , H05K3/321 , H05K3/325 , H05K3/429 , H05K3/445 , H05K2201/0154 , H05K2201/0314 , H05K2201/068 , H05K2201/09536 , H05K2201/09554 , H05K2201/09581 , H05K2201/096 , H05K2203/0323 , H05K2203/041 , H05K2203/1184 , H05K2203/1438 , H01L2924/00
摘要： Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

13. 发明公开

EP0298345A3 Method for preparing substrates for subsequent electroless metallization 失效
标题翻译：用于制备用于后续电镀金属化的基板的方法
公开(公告)号：EP0298345A3
公开(公告)日：1990-04-11
申请号：EP88110292.5
申请日：1988-06-28
申请人： International Business Machines Corporation
发明人： Clarke, Thomas Carl , Kovac, Caroline Ann , Jung, Dae Young , Park, Jae Myung , Thomas, Richard Ronald
IPC分类号： C23C16/18 , C23C16/04 , H01L21/02
CPC分类号： C23C18/2033 , C23C16/04 , C23C16/18 , C23C18/1605 , C23C18/1608 , C23C18/1865 , C23C18/1893 , C23C18/2006 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/38 , C23C18/42 , H05K3/146 , H05K3/181 , H05K3/184
摘要： A process for preparing a substrate, e.g., an epoxy printed circuit board, for subsequent metallization. Active chemical sites are formed adhering to the substrate surface. The substrate is then exposed to a vapor of a volatile organometallic compound, which chemically reacts with the active sites and is decomposed to at least a species of the metal constituent of the compound. This species adheres to the substrate and can be transformed into the free metal which is useful as a seed for subsequent electroless deposition of a metal thereon. If selective deposition is desired, a resist masking layer is used prior to forming the seed layer.

14. 发明公开

EP0338199A2 Method and apparatus for encapsulation of an electronic device 失效
标题翻译： Verfahren und Apparat zum Verkapseln einer elektronischen Anordnung。
公开(公告)号：EP0338199A2
公开(公告)日：1989-10-25
申请号：EP89102185.9
申请日：1989-02-09
申请人： International Business Machines Corporation
发明人： Kovac, Caroline Ann , Ledermann, Peter Gerard , Nguyen Luu Thanh
IPC分类号： H01L21/56
CPC分类号： H01L21/56 , H01L2224/50
摘要： A method and apparatus to encapsulate a device (24) and joints (26, 28) coupled to conductive leads (30) with an encapsulating material (42). A fixture (12) has a recess to hold via a vacuum (16) the device (24) in place. Conduits in the fixture supply air (20) around the device (24) to form an air dam that flows outward around the device (24) and the leads (30). A nozzle (40) supplies a metered amount of material (42) to the surface of the device (24). By controlling the temperature of the fixture (12) and/or the air (20) forming the air dam, the flow of material can be confined to the surface of the device (24) and the joints (26, 28) as it cures. The method can also provide encapsulant edge capping to reduce device stresses.
摘要翻译：一种用封装材料（42）封装耦合到导电引线（30）的器件（24）和接头（26,28）的方法和装置。固定装置（12）具有通过真空（16）将装置（24）保持就位的凹部。导管装置在装置周围提供空气（20），以形成围绕装置（24）和引线（30）向外流动的空气坝。喷嘴（40）将计量的材料（42）供应到装置（24）的表面。通过控制夹具（12）和/或形成空气坝的空气（20）的温度，材料的流动可以被限制在装置（24）和接头（26,28）的表面，因为它固化。该方法还可以提供封装边缘封盖以减少器件应力。

15. 发明授权

EP0399161B1 Multi-level circuit card structure 失效
标题翻译：多层印刷电路板结构。
公开(公告)号：EP0399161B1
公开(公告)日：1995-01-11
申请号：EP90105309.0
申请日：1990-03-21
申请人： International Business Machines Corporation
发明人： Bregman, Mark Fielding , Buchwalter, Stephen Leslie , Hermann, Karl , Kovac, Caroline Ann , Poore, Paige Adams , Viehbeck, Alfred
IPC分类号： H05K1/05 , H05K1/00
CPC分类号： H05K3/462 , H01L23/5385 , H01L24/00 , H01L2924/14 , H05K1/0272 , H05K1/056 , H05K1/144 , H05K3/321 , H05K3/325 , H05K3/429 , H05K3/445 , H05K2201/0154 , H05K2201/0314 , H05K2201/068 , H05K2201/09536 , H05K2201/09554 , H05K2201/09581 , H05K2201/096 , H05K2203/0323 , H05K2203/041 , H05K2203/1184 , H05K2203/1438 , H01L2924/00

16. 发明公开

EP0340527A2 Improved semiconductor device packaging structures 失效
标题翻译： PackalsstrukturenfürHalbleiteranordnungen。
公开(公告)号：EP0340527A2
公开(公告)日：1989-11-08
申请号：EP89106979.1
申请日：1989-04-19
申请人： International Business Machines Corporation
发明人： Bickford, Harry Randall , Bregman, Mark Fielding , Moskowitz, Paul Andrew , Kovac, Caroline Ann , Palmer, Michael Jon , Poore, Paige Adams , Reiley, Timothy Clark
IPC分类号： H01L25/08
CPC分类号： H01L25/0657 , H01L23/49575 , H01L24/48 , H01L25/0652 , H01L2224/16145 , H01L2224/48091 , H01L2224/48247 , H01L2225/06513 , H01L2924/00014 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/04941 , H01L2924/09701 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2224/45099 , H01L2224/05599 , H01L2924/00 , H01L2924/00012
摘要： An integrated circuit device package (76) in which integrated circuit devices (78, 80) are mounted with active faces (82, 84) placed facing each other to form a double-chip structure. Input/output terminals (90, 92) on the active faces of each chips are electrically interconnected by placing an interconnection means (98) between the chips to electrically interconnect input/output terminals on the active faces of the first and second chips. Beam leads (98), each having an inner (100) and outer (99) lead bond site, project outwardly from between the chip where each of the inner lead bond site is bonded to at least one interconnection means. A series of double-chip structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-chips structure, the inner lead bond site being electrically bonded to at least one interconnection means.
摘要翻译：集成电路器件封装（76），其中集成电路器件（78,80）安装有面向彼此放置的有源面（82,84）以形成双芯片结构。每个芯片的有源面上的输入/输出端子（90,92）通过在芯片之间放置互连装置（98）而进行电互连，以电连接第一和第二芯片的有效面上的输入/输出端子。每个具有内部（100）和外部（99）引线键合位置的束引线（98）从芯片之间向外突出，其中每个内部引线键合部位被结合到至少一个互连装置。可以在其上具有多组束引线图案的带上形成一系列双芯片结构。每个具有内部和外部引线键合位置的每个束引线从双芯片结构之间向外突出，内部引线键合位置电连接到至少一个互连装置。

17. 发明公开

EP0340492A2 Conformal sealing and interplanar encapsulation of electronic device structures 失效
标题翻译： Konforme Versieglung und interplanare Verkapselung elektronischer Anordnungsstrukturen。
公开(公告)号：EP0340492A2
公开(公告)日：1989-11-08
申请号：EP89106476.8
申请日：1989-04-12
申请人： International Business Machines Corporation
发明人： Ameen, Joseph George , Buchwalter, Stephen Leslie , Kovac, Caroline Ann , Palmer, Michael Jon , Poore, Paige Adams
IPC分类号： H01L23/31
CPC分类号： H01L23/293 , H01L21/563 , H01L23/295 , H01L23/3157 , H01L24/31 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/0132 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15312 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/3512
摘要： Electronic device packaging structures wherein the active face (6) of an electronic device (4) is mounted facing a substrate (12). Environmental isolation is provided by an overcoat polymeric material (44) at least sealing the space (41) between the device and substrate at the periphery of the device. Enhanced environmental isolation is provided by a polymeric material disposed to substantially fill the space (41) between the device and substrate. The overcoat polymeric material provides enhanced fatigue life to solder mounds disposed between and electrically interconnecting the device and substrate.
摘要翻译：电子器件封装结构，其中电子器件（4）的有源面（6）面向衬底（12）安装。环境隔离由外涂聚合物材料（44）提供，至少密封装置周围的装置和基板之间的空间（41）。增强的环境隔离由设置成基本上填充装置和基板之间的空间（41）的聚合材料提供。外涂层聚合物材料为设置在设备和基板之间的电气互连的焊锡堆提供增强的疲劳寿命。

18. 发明公开

EP0307665A2 Encapsulation composition and use thereof 失效
标题翻译： Einbettzusammensetzung und ihre Verwendung。
公开(公告)号：EP0307665A2
公开(公告)日：1989-03-22
申请号：EP88113641.0
申请日：1988-08-23
申请人： International Business Machines Corporation
发明人： Buchwalter, Stephen Leslie , Kovac, Caroline Ann , Nguyen, Luu Thanh
IPC分类号： H01B3/40 , C08G59/42 , C08G59/68 , C08G59/24
CPC分类号： H01B3/40 , C08G59/24 , C08G59/42 , C08G59/686
摘要： A composition capable of encapsulating electronic devices that includes a cycloaliphatic epoxide; an anhydride of an organic carboxylic acid; and an alkylene oxide adduct of an imidazole, and use thereof to encapsulate an electronic device by reaction injection molding.
摘要翻译：能够封装包含脂环族环氧化物的电子器件的组合物; 有机羧酸的酸酐; 和咪唑的氧化烯加合物，以及其用于通过反应注射成型包封电子器件的用途。

19. 发明公开

EP0182193A3 A method of depositing a copper pattern on a substrate 失效
标题翻译：在基底上沉积铜图案的方法
公开(公告)号：EP0182193A3
公开(公告)日：1986-10-22
申请号：EP85114052
申请日：1985-11-05
申请人： International Business Machines Corporation
发明人： Baum, Thomas Hall , Houle, Frances Anne , Jones, Carol Ruth , Kovac, Caroline Ann
IPC分类号： C23C18/16 , C23C18/30
CPC分类号： C23C18/1879 , C23C18/1608 , C23C18/1612 , C23C18/182 , C23C18/1831 , C23C18/1868 , C23C18/204 , C23C18/30 , C23C18/38 , H05K3/184 , H05K2203/107
摘要： In a method of electrolessly depositing copper on a substrate, a palladium seed pattern is formed by directing light (eg from a laser) at the substrate in the presence of the vapour of a palladium compound, such as palladium (II) bis-(hexafluoro- acetylacetonate). The substrate may be first coated with a polymer which is removed by excimer laser irradiation.

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