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11. 发明公开

EP3890442A1 METHOD FOR JOINING TRANSPARENT SUBSTRATES, AND LAMINATED BODY 审中-公开
公开(公告)号：EP3890442A1
公开(公告)日：2021-10-06
申请号：EP19888990.9
申请日：2019-11-25
申请人： Lan Technical Service Co., Ltd. , Suga, Tadatomo
发明人： MATSUMOTO Yoshiie , SUGA Tadatomo
IPC分类号： H05B33/04 , H05B33/10 , H01L51/50 , C23C14/08
摘要： A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates.

12. 发明公开

EP3171390A1 THIN SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND METHOD FOR TRANSPORTING SUBSTRATE 审中-实审
标题翻译：薄基底，制造该基底的方法以及用于运输基底的方法
公开(公告)号：EP3171390A1
公开(公告)日：2017-05-24
申请号：EP15821437.9
申请日：2015-07-16
申请人： Lan Technical Service Co., Ltd. , Suga, Tadatomo
发明人： SUGA Tadatomo , MATSUMOTO Yoshiie
IPC分类号： H01L21/02 , B65G49/06 , H01L21/683 , H01L51/50 , H05B33/02 , H05B33/04 , H05B33/10
CPC分类号： H01L51/003 , B32B7/06 , B32B17/064 , B32B2379/08 , B65G49/061 , C03C17/002 , C03C19/00 , C03C27/10 , C03C2218/31 , H01L21/185 , H01L21/6835 , H01L51/0096 , H01L51/524 , H01L51/56 , H01L2221/68318 , H01L2221/6835 , H01L2227/326
摘要： [Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate.
[Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.
摘要翻译：提供一种技术，其允许膜或玻璃粘合到传送基板并且在制造基板期间容易分离。解决方案提供一种用于制造表面上形成有电子器件的基板的方法，所述方法包括形成步骤，用于在形成电子器件的基板的至少一个接合表面上形成无机材料层表面将被结合到运输基板以及用于运输基板的运输基板上的结合表面; 粘合步骤，用于将所述基板和所述传送基板相互挤压并通过所述无机材料层粘合所述基板和所述传送基板; 以及用于分离衬底和传输衬底的分离步骤。

13. 发明公开

EP2837490A1 METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDING POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE, POLYMER FILM LAMINATE, AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE 有权
标题翻译：法的聚合物膜和聚合物膜，METHOD FOR的聚合物膜ON无机材料，聚合物膜和层压板的层压板的衬底中聚合物薄膜无机材料与底物结合BINDING
公开(公告)号：EP2837490A1
公开(公告)日：2015-02-18
申请号：EP13776372.8
申请日：2013-04-09
申请人： Suga, Tadatomo , Lan Technical Service Co., Ltd.
发明人： SUGA, Tadatomo , MATSUMOTO, Yoshiie
IPC分类号： B29C65/00 , B23K20/00 , B29L9/00
CPC分类号： B32B15/08 , B29C59/14 , B29C65/1432 , B29C65/1467 , B29C66/028 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72325 , B29C66/72326 , B29C66/73161 , B29C66/7373 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29C66/73941 , B29C66/74 , B29C66/7461 , B29C66/74611 , B29C66/7465 , B29C66/8221 , B29C66/83241 , B29C66/83413 , B32B15/09 , B32B17/064 , B32B27/08 , B32B27/281 , B32B27/36 , B32B37/0076 , B32B37/02 , B32B37/182 , B32B37/203 , B32B37/24 , B32B38/00 , B32B2037/0092 , B32B2037/243 , B32B2250/03 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2307/546 , B32B2309/68 , B32B2310/0881 , B32B2457/20 , B32B2457/206 , C08J5/12 , Y10T156/10 , Y10T428/31681 , B29K2067/003 , B29K2079/08 , B29K2067/00 , B29K2067/006
摘要： The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.
摘要翻译：本发明提供用于在低温下聚合物膜牢固且廉价地结合到另一种聚合物膜或一种玻璃基板，而不使用有机粘合剂的方法。一种用于粘合的聚合物膜的方法包括用于形成部分或全部的第一聚合物膜的第一无机材料层的步骤（S1）; 用于形成上部分或全部的第二聚合物膜的第二无机材料层的步骤（S3）; 为表面活性的第一无机材料层的表面通过用具有预定动能粒子轰击步骤（S2）; 为表面活性的第二无机材料层的表面通过用具有预定动能粒子轰击步骤（S4）; 和用于抵靠所述第二无机材料层的表面活化表面上的第一无机材料层的表面活化表面与所述第一聚合物膜和第二聚合物膜粘合在一起的工序（S5）。

14. 发明公开

EP2672509A1 BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY 审中-公开
标题翻译： BINDESUBSTRAT-HERSTELLUNGSVERFAHREN，BINDESUBSTRAT，SUBSTRATBINDUNGSVERFAHREN，BINDESUBSTRAT-HERSTELLUNGSVORRICHTUNG UND SUBSTRATANORDNUNG
公开(公告)号：EP2672509A1
公开(公告)日：2013-12-11
申请号：EP12742631.0
申请日：2012-01-30
申请人： Suga, Tadatomo , Bondtech Co., Ltd. , Taiyo Yuden Co., Ltd. , Lan Technical Service Co., Ltd.
发明人： YAMAUCHI Akira , KONDOU Ryuichi , MATSUMOTO Yoshiie
IPC分类号： H01L21/02 , B23K20/00 , B23K20/14 , B23K20/16 , B23K20/24
CPC分类号： H01L21/3221 , B23K1/20 , B23K20/24 , B23K2201/36 , H01J37/317 , H01J2237/202 , H01J2237/3165 , H01L21/02046 , H01L21/2007 , H01L21/263 , H01L21/302 , H01L21/67092 , H01L21/67115 , H01L21/76251 , H01L29/04 , H01L29/36
摘要： [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
摘要翻译： [问题]提供具有广泛应用的基板粘合技术。 [解决方案]在接合表面上形成硅薄膜，并且使用能量粒子/金属颗粒对与基板的界面进行表面处理。

15. 发明公开

EP1227360A3 Method and device for connecting display panel substrates 审中-公开
标题翻译：用于接合屏幕基板的方法和装置
公开(公告)号：EP1227360A3
公开(公告)日：2004-12-29
申请号：EP02250456.7
申请日：2002-01-23
申请人： Lan Technical Service Co., Ltd
发明人： Matsumoto, Yoshiie, Lan Technical Service Co., Ltd
IPC分类号： G02F1/1339
CPC分类号： G02F1/1339 , G02F2001/133354
摘要： A method for connecting display panel substrates comprises the following steps. Firstly, a first substrate (10) and a second substrate (12), whereon sealant material (14) is disposed so as to form a waste region (30) in the inner side region of the edges of the first and second substrates, are aligned in position and held. Thereupon, a spacer (20, 24, 26) having a thickness substantially equal to a prescribed cell gap (d) is inserted into the waste region between the first and second substrates. Next, the cell gap is determined by pressing the first and second substrates. The sealant material is then hardened, whereupon the spacer is withdrawn. In this connecting process for fabricating a display panel, the cell gap can be set readily and precisely to a high degree of accuracy.

16. 发明公开

EP0285446A3 Apparatus for surface treatment of synthetic organic polymer mouldings 失效
标题翻译：表面处理合成有机聚合物模具的设备
公开(公告)号：EP0285446A3
公开(公告)日：1990-01-17
申请号：EP88302960.5
申请日：1988-03-31
申请人： AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY , LAN TECHNICAL SERVICE CO., LTD. , SUMITOMO CHEMICAL COMPANY, LIMITED
发明人： Katoh, Koichiroh Industrial Products Research Ins. , Matsumoto, Yoshiie Lan Technical Service Co., Ltd. , Shinonaga, Hideo
IPC分类号： B29C59/16
CPC分类号： B29C59/16 , B29C2035/0827 , B29K2023/12 , B29K2995/0041
摘要： Apparatus for surface treatment of a synthetic organic polymer moulding includes a preliminary heating chamber (11) for heating a synthetic organic polymer moulding as a preliminary step, a solvent treatment chamber (21) for contacting the surface of the preliminarily-heated moulding with an ultraviolet light absorbing solvent provided in a solvent tank (25), an irradiation chamber (31) including low pressure mercury lamps (35) for irradiating the surface of the moulding with ultraviolet light having a main wavelength of 184.9 nm, and a transfer mechanism such as a belt conveyor (41) for transferring the moulding through the chambers. The apparatus can alternatively dispense with the preliminary heating chamber, in which case the solvent treatment chamber is arranged to contact the surface of the moulding with the ultraviolet light absorbing solvent having been heated to a predetermined temperature. A polypropylene type resin is preferably used as the synthetic organic polymer. The surface of the synthetic organic polymer moulding is easily modified and hence coating, printing, adhesion, or similar treatment of the moulding can be effected with high adherence.

17. 发明授权

EP2837490B8 METHOD FOR BONDING POLYMER FILM TO POLYMER FILM OR INORGANIC MATERIAL SUBSTRATE, POLYMER FILM LAMINATE, AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE 有权
公开(公告)号：EP2837490B8
公开(公告)日：2018-11-21
申请号：EP13776372.8
申请日：2013-04-09
申请人： Suga, Tadatomo , Lan Technical Service Co., Ltd.
发明人： SUGA, Tadatomo , MATSUMOTO, Yoshiie
IPC分类号： B29C65/14 , B32B27/28 , B32B27/36 , B32B37/00 , B32B37/02 , B32B37/18 , B32B37/20 , B32B37/24 , B29C59/14 , C08J5/12 , B32B27/08 , B32B17/06 , B29C65/00
CPC分类号： B32B15/08 , B29C59/14 , B29C65/1432 , B29C65/1454 , B29C65/1467 , B29C66/028 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72325 , B29C66/72326 , B29C66/73161 , B29C66/7373 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29C66/73941 , B29C66/74 , B29C66/7461 , B29C66/74611 , B29C66/7465 , B29C66/8221 , B29C66/83241 , B29C66/83413 , B32B15/09 , B32B17/064 , B32B27/08 , B32B27/281 , B32B27/36 , B32B37/0076 , B32B37/02 , B32B37/182 , B32B37/203 , B32B37/24 , B32B38/00 , B32B2037/0092 , B32B2037/243 , B32B2250/03 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2307/546 , B32B2309/68 , B32B2310/0881 , B32B2457/20 , B32B2457/206 , C08J5/12 , Y10T156/10 , Y10T428/31681 , B29K2067/003 , B29K2079/08 , B29K2067/00 , B29K2067/006
摘要： The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

18. 发明授权

EP2837490B1 METHOD FOR BONDING POLYMER FILM TO POLYMER FILM OR INORGANIC MATERIAL SUBSTRATE, POLYMER FILM LAMINATE, AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE 有权
公开(公告)号：EP2837490B1
公开(公告)日：2018-09-26
申请号：EP13776372.8
申请日：2013-04-09
申请人： Suga, Tadatomo , Lan Technical Service Co., Ltd.
发明人： SUGA, Tadatomo , MATSUMOTO, Yoshiie
IPC分类号： B29C65/14 , B32B27/28 , B32B27/36 , B32B37/00 , B32B37/02 , B32B37/18 , B32B37/20 , B32B37/24 , B29C59/14 , C08J5/12 , B32B27/08 , B32B17/06 , B29C65/00
CPC分类号： B32B15/08 , B29C59/14 , B29C65/1432 , B29C65/1454 , B29C65/1467 , B29C66/028 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72321 , B29C66/72325 , B29C66/72326 , B29C66/73161 , B29C66/7373 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29C66/73941 , B29C66/74 , B29C66/7461 , B29C66/74611 , B29C66/7465 , B29C66/8221 , B29C66/83241 , B29C66/83413 , B32B15/09 , B32B17/064 , B32B27/08 , B32B27/281 , B32B27/36 , B32B37/0076 , B32B37/02 , B32B37/182 , B32B37/203 , B32B37/24 , B32B38/00 , B32B2037/0092 , B32B2037/243 , B32B2250/03 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2307/546 , B32B2309/68 , B32B2310/0881 , B32B2457/20 , B32B2457/206 , C08J5/12 , Y10T156/10 , Y10T428/31681 , B29K2067/003 , B29K2079/08 , B29K2067/00 , B29K2067/006
摘要： The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.

19. 发明公开

EP0461843A3 Methods of modifying metallic surfaces 失效
标题翻译：修饰金属表面的方法
公开(公告)号：EP0461843A3
公开(公告)日：1993-03-17
申请号：EP91305230.4
申请日：1991-06-11
申请人： AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY , LAN TECHNICAL SERVICE CO., LTD. , SEN LIGHTS CORPORATION
发明人： Katoh, Koichiroh, c/o Ind. Products Research Inst. , Matsumoto, Yoshiie, c/o LAN TECH. SERVICE CO., LTD , Kikuchi, Kiyoshi, c/o SEN Lights Corporation
IPC分类号： C23G5/00 , B08B7/00 , C09J5/02 , B05D3/06 , C23C8/10
CPC分类号： B05D3/062 , B05D2202/00 , C09J5/02 , C09J2400/166 , C23G5/00 , H05K3/382 , H05K3/44
摘要： In a method of modifying a metallic surface having a poor adhesion to a material to be provided thereon before the material is provided on the surface of the metal, the surface of the metal is first irradiated with ultraviolet light having a 253.7 nm-wavelength, or with that having a 253.7 nm-wavelength and a 184.9 nm-wavelength.
摘要翻译：在将材料设置在金属表面之前，在对其上提供的材料进行改性的金属表面改性方法中，首先用253.7nm波长的紫外线照射金属表面，或具有253.7nm波长和184.9nm波长的波长。

20. 发明公开

EP0285446A2 Apparatus for surface treatment of synthetic organic polymer mouldings 失效
标题翻译：装置模制的合成有机聚合物的表面处理。
公开(公告)号：EP0285446A2
公开(公告)日：1988-10-05
申请号：EP88302960.5
申请日：1988-03-31
申请人： AGENCY OF INDUSTRIAL SCIENCE AND TECHNOLOGY , LAN TECHNICAL SERVICE CO., LTD. , SUMITOMO CHEMICAL COMPANY, LIMITED
发明人： Katoh, Koichiroh Industrial Products Research Ins. , Matsumoto, Yoshiie Lan Technical Service Co., Ltd. , Shinonaga, Hideo
IPC分类号： B29C59/16
CPC分类号： B29C59/16 , B29C2035/0827 , B29K2023/12 , B29K2995/0041
摘要： Apparatus for surface treatment of a synthetic organic polymer moulding includes a preliminary heating chamber (11) for heating a synthetic organic polymer moulding as a preliminary step, a solvent treatment chamber (21) for contacting the surface of the preliminarily-heated moulding with an ultraviolet light absorbing solvent provided in a solvent tank (25), an irradiation chamber (31) including low pressure mercury lamps (35) for irradiating the surface of the moulding with ultraviolet light having a main wavelength of 184.9 nm, and a transfer mechanism such as a belt conveyor (41) for transferring the moulding through the chambers. The apparatus can alternatively dispense with the preliminary heating chamber, in which case the solvent treatment chamber is arranged to contact the surface of the moulding with the ultraviolet light absorbing solvent having been heated to a predetermined temperature.
A polypropylene type resin is preferably used as the synthetic organic polymer. The surface of the synthetic organic polymer moulding is easily modified and hence coating, printing, adhesion, or similar treatment of the moulding can be effected with high adherence.
摘要翻译：一种用于合成有机聚合物模制的表面处理包括用于加热的合成有机聚合物成型作为预先加热的成型体的表面与紫外线接触的预备步骤，溶剂处理室（21）的预备加热室（11）光吸收溶剂中，在溶剂罐（25）设置，以照射室（31）包括低压汞灯（35），用于照射具有184.9纳米的主波长的紫外线灯，和一个传送机构在模制的表面：如带式传送器（41），用于传递环通过腔室中的成型。该装置可任选被预备加热室分配，在这种情况下，溶剂处理室被布置成与所述紫外线吸收溶剂已被加热到预定温度的模制品的表面接触。聚丙烯类树脂，优选使用作为合成有机聚合物。该合成的有机聚合物成型体的表面被容易地修改和因此涂布，印刷，粘附，或模制品的类似的处理可以以高的粘附来进行。

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