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    • 144. 发明公开
    • Solar cell module
    • 太阳能电池组件
    • EP2608278A1
    • 2013-06-26
    • EP12188049.6
    • 2012-10-10
    • Industrial Technology Research Institute
    • Lin, Hui-HsiungLiao, Chi-HungLin, Chun-TingWu, Tsung-ChoYang, Wen-Hsun
    • H01L31/052H01L31/058
    • H01L31/052F24S23/00F24S23/10F24S2020/17H01L31/0543H02S40/44Y02E10/44Y02E10/52Y02E10/60
    • A solar cell module is provided, including a solar collector, a solar cell chip panel and a cooling pipeline system. The solar collector includes a first optical surface and a second optical surface, wherein light enters the solar collector from the first optical surface, and then exits from the second optical surface after collection. The solar cell chip panel has a light-receiving surface for receiving the light exited from the second optical surface. The solar cell chip panel includes a photovoltaic conversion material capable of absorbing a specific spectrum band in the light and converting that into electricity. The cooling pipeline system allows water to flow therein and includes a heat absorber, wherein the light exits to the light-receiving surface of the solar cell chip panel through the heat absorber, and the water flowing through the heat absorber absorbs light beyond the specific spectrum band.
    • 提供了一种太阳能电池组件,包括太阳能收集器,太阳能电池芯片面板和冷却管道系统。 太阳能收集器包括第一光学表面和第二光学表面,其中光从第一光学表面进入太阳能收集器,然后在收集之后从第二光学表面离开。 太阳能电池芯片面板具有用于接收从第二光学表面出射的光的光接收表面。 太阳能电池芯片面板包括能够吸收光中的特定光谱带并将其转换为电的光电转换材料。 冷却管路系统允许水在其中流动并且包括吸热器,其中光通过吸热器流出到太阳能电池芯片面板的光接收表面,并且流过吸热器的水吸收超过特定光谱的光 带。
    • 150. 发明公开
    • Packaging substrate having embedded interposer and fabrication method thereof
    • 具有用于制备嵌入中介层及其方法封装基板
    • EP2555240A1
    • 2013-02-06
    • EP12179424.2
    • 2012-08-06
    • Unimicron Technology Corp.Industrial Technology Research Institute
    • Hu, Dyi-ChungLau, John Hon-Shing
    • H01L25/065H01L23/14H01L23/498
    • A packaging substrate includes a carrier and an interposer. The carrier has opposite top and bottom surfaces. A recess is disposed in the top surface and a plurality of first conductive terminals are disposed on the bottom of the recess. Further, a plurality of second conductive terminals are disposed on the bottom surface of the carrier. The interposer is disposed in the recess and has opposite first and second surfaces and a plurality of conductive through vias penetrating the first and second surfaces. A first conductive pad is disposed on an end of each of the conductive through vias exposed from the first surface, and a second conductive pad is disposed on the other end of the conductive through via exposed from the second surface and electrically connected to a corresponding one of the first conductive terminals. Compared with the prior art, the invention improves the product reliability.
    • 甲封装基板包括载体和在中介层上。 该载体具有相对的顶部和底部表面。 的凹部在其顶表面设置,并且第一导电端子的多元化是在凹部的底部处。 此外,第二导电端子的多元被设置在载体的下表面上。 该内插器是在所述凹部设置,并且具有相对的第一和第二表面和通孔穿透第一和第二表面的导电复数。 第一导电垫被设置在每个导电的端部通过从所述第一表面暴露的通孔设置在和第二导电板经由通孔从所述第二表面暴露的并且电连接到相应的一个设置在导电的另一端 的第一导电端子。 与现有技术相比,本发明提高了产品的可靠性。