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    • 105. 发明公开
    • Fluorine-containing polyimide gas separation membrane and method of manufacturing the same
    • 膜ur us us us ung ung ung ung ung ung ung ung ung ung ung ung ung ung ung
    • EP0748650A2
    • 1996-12-18
    • EP96109588.2
    • 1996-06-14
    • NITTO DENKO CORPORATION
    • Hachisuka, HisaoMaeda, MasatoshiIkeda, Kenichi
    • B01D71/64B01D53/22C08G73/10
    • C08G73/1064B01D53/228B01D67/0011B01D67/0013B01D71/64B01D2323/30B01D2325/022B01D2325/026B01D2325/26C08G73/1039Y10S55/05
    • A fluorine-containing polyimide gas separation membrane which is pinhole-free, uniform over a large area, and has a high permeability and a high separation factor α is provided. A polyimide resin is dissolved in at least one solvent selected from the group consisting of an organic solvent (A) or (B). The organic solvent (A) has a dielectric constant of 30 or less and a dipole moment of 3.0D or less. The organic solvent (B) mainly contains an organic solvent having at least one ether bonding in the molecular unit. In the next step, the polyimide resin is dipped in a solvent (C) in order for desolvation. The solvent (C) does not dissolve the fluorine-containing polyimide resin while it is miscible with the organic solvent (A) or (B). As a result, an asymmetric gas separation membrane is formed. The fluorine-containing polyimide resin layer (3) comprises a skin layer (1) the thickness L 1 thereof is about 40nm and a sponge like layer (2) the thickness L 2 thereof is about 30 µm. The membrane is formed on a supporter (4) of, for example, an nonwoven cloth.
    • 提供了一种无孔无孔,大面积均匀的含氟聚酰亚胺气体分离膜,具有高磁导率和高分离系数α。 将聚酰亚胺树脂溶解在选自由有机溶剂(A)或(B)组成的组中的至少一种溶剂中。 有机溶剂(A)的介电常数为30以下,偶极矩为3.0​​D以下。 有机溶剂(B)主要含有在分子单元中具有至少一个醚键的有机溶剂。 在下一步骤中,将聚酰亚胺树脂浸渍在溶剂(C)中以进行去溶剂化。 溶剂(C)在与有机溶剂(A)或(B)可混溶时不溶解含氟聚酰亚胺树脂。 结果形成了不对称气体分离膜。 含氟聚酰亚胺树脂层(3)包括其厚度L1约为40nm的表皮层(1)和厚度L2为约30μm的海绵状层(2)。 膜形成在例如非织造布的支撑体(4)上。
    • 107. 发明公开
    • Polyimide film
    • 聚酰亚胺薄膜
    • EP0710690A3
    • 1996-10-16
    • EP95116816.0
    • 1995-10-25
    • SUMITOMO CHEMICAL COMPANY, LIMITED
    • Shirasaki, MikaUeda, YouichiShibata, Mitsuhiro
    • C08G73/10C09D179/08C09J179/08
    • H05K1/0346C08G73/105C08G73/1064C09D179/08C09J179/08Y10T428/31721
    • The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1):

      wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4;
      with a tetracarboxylic dianhydride represented by the general formula (2)

      wherein Y represents a tetravalent organic group having 2 or more carbon atoms. The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.
    • 本发明的聚酰亚胺膜由聚酰亚胺形成,所述聚酰亚胺通过使由通式(1)表示的二氨基化合物:其中X表示具有1至20个碳原子的烃基或硫原子的二氨基化合物; R分别独立地表示卤素原子,碳原子数1〜6的烃基或碳原子数1〜6的含卤素的烃基, a分别独立地表示0〜4的整数。 与通式(2)表示的四羧酸二酐反应,其中Y表示具有2个或更多个碳原子的四价有机基团。 所获得的聚酰亚胺膜可以良好地应用于没有粘合层的柔性印刷电路板,用于电子部件和电线的保护涂层或耐热粘合剂。
    • 108. 发明公开
    • Polyimide film
    • Polyimidfilme
    • EP0710690A2
    • 1996-05-08
    • EP95116816.0
    • 1995-10-25
    • SUMITOMO CHEMICAL COMPANY, LIMITED
    • Shirasaki, MikaUeda, YouichiShibata, Mitsuhiro
    • C08G73/10C09D179/08C09J179/08
    • H05K1/0346C08G73/105C08G73/1064C09D179/08C09J179/08Y10T428/31721
    • The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1):

      wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4;
      with a tetracarboxylic dianhydride represented by the general formula (2)

      wherein Y represents a tetravalent organic group having 2 or more carbon atoms.
      The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.
    • 本发明的聚酰亚胺膜由聚酰亚胺形成,该聚酰亚胺通过使通式(1)表示的二氨基化合物:其中X表示碳原子数1〜20的烃基或硫原子的 R各自独立地表示卤素原子,碳原子数1〜6的烃基或碳原子数1〜6的含卤素的烃基。 a各自独立地表示0〜4的整数, 与由通式(2)表示的四羧酸二酐其中Y表示具有2个或更多个碳原子的四价有机基团。 获得的聚酰亚胺膜可以有利地应用于没有粘附层的柔性印刷电路板,用于电子部件和电线的保护涂层或耐热粘合剂。