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    • 101. 发明公开
    • A shielding box
    • 屏蔽盒
    • EP2299796A2
    • 2011-03-23
    • EP10177103.8
    • 2010-09-16
    • BANG & OLUFSEN A/S
    • Skindhøj Pedersen, Flemming
    • H05K9/00
    • H05K9/0032H05K9/0035
    • The invention is related to use of shielding boxes on electric PCBs where protection against electromagnetic interference is to be provided. The shielding box has properties that simplify mounting on PCBs and improve the quality of the electromagnetic protection. The shielding box has means providing that it is fixed against the PCB during soldering so that displacement is prevented and so that the box is provided stable full-edged soldering against the PCB after the soldering process. The shielding box is made of sheet metal, and the fixing means of the shielding box are provided by means of precise working by means of laser or chemical etching or electrochemical etching and/or a combination of these processes.
      Typical applications for the shielding box are PCBs on which there are mounted equipment like e.g. microprocessors and/or signal processors operating at high speed, and whereby high-frequency signals arise in the form of noise which has to be attenuated efficiently.
    • 本发明涉及在要提供防电磁干扰的电PCB上使用屏蔽盒。 屏蔽盒具有简化PCB上安装和提高电磁保护质量的特性。 屏蔽盒具有在焊接期间将其固定在PCB上的装置,从而防止位移,并且在焊接工艺之后,盒子被提供稳定的全边焊接在PCB上。 屏蔽盒由金属片制成,并且屏蔽盒的固定装置通过借助于激光或化学蚀刻或电化学蚀刻和/或这些处理的组合的精确加工来提供。 屏蔽盒的典型应用是其上安装有设备如图1所示的PCB。 微处理器和/或信号处理器以高速运行,并且高频信号以噪声形式出现,其必须被有效衰减。
    • 102. 发明授权
    • COMBINED ELECTROCHEMICAL AND LASER MICROMACHINING PROCESS FOR CREATING ULTRA-THIN SURFACES
    • 联合电化学和激光加工微型计算机处理用于生产超狭窄的空间
    • EP2043812B1
    • 2010-12-01
    • EP07764482.1
    • 2007-07-12
    • BANG & OLUFSEN A/S
    • PRICHYSTAL, Jan Phuklin
    • B23K26/40B23K26/42C25F3/14
    • B23H5/06B23K26/40B23K26/60B23K2201/35B23K2203/50
    • The invention provides a process for the manufacture of ultra-thin sections in an electrically conducting material, comprising: firstly removing material in an electrochemical process to a material thickness of approximately 10 to 20 micrometers; - secondly removing further material by a laser micromachining process to a ma¬ terial thickness of 1 to 5 micrometers. By combining the two methods it is possible by the electrochemical process quickly to remove a substantial amount of material. The electrochemical process is not as precise and accurate so that it may be possible to solely rely on and use this method in order to create the ultra-thin sections or translucent sections. However, by removing material by an electrochemical process down to a thickness of approx. 10-12 micrometres, enough margin is provided, so that the electrochemical process may be controlled in a manner so that it is satisfied that there is a material thickness left at the bottom of this first cavity. By thereafter applying the laser technique, in a laser micromachining process, the remaining material down to a predetermined level, e.g. 1-5 micrometres, may be achieved relatively rapidly, so that a relatively quick process for the manufac¬ ture of these ultra-thin sections in an electrically conducting material is achieved. Also a metal structure manufactured by the novel and inventive process is disclosed.